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1. 发明授权

US5023698A Semiconductor device 失效
公开(公告)号：US5023698A
公开(公告)日：1991-06-11
申请号：US327609
申请日：1989-03-23
申请人： Shiro Kobayashi , Emiko Murofushi , Masahiko Itoh
发明人： Shiro Kobayashi , Emiko Murofushi , Masahiko Itoh
IPC分类号： H01L21/3205 , H01L21/28 , H01L23/52 , H01L23/532 , H01L29/43
CPC分类号： H01L23/53233 , H01L24/05 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/48647 , H01L2224/49171 , H01L2224/73265 , H01L2224/85447 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01012 , H01L2924/01014 , H01L2924/01079 , H01L2924/15747 , H01L2924/181
摘要： A metallization film layer disposed on a semiconductor chip is made of Cu alloy which contains a metal element less noble than Cu and whose balance consists of Cu and unavoidable impurities. The metal element less noble than Cu is at least one kind of members selected from the group consisting of Al, Be, Cr, Fe, Mg, Ni, Si, Sn and Zn. Cu alloy as the metallization film layer improves corrosion resistance by adding a trance amount of a metal element less noble than Cu within such a range where electric conductivity is not much reduced to Cu without lowering high electric conductivity, high heat resistance and high electro-migration resistance of Cu.

2. 发明授权

US5221859A Lead frame for semiconductor device 失效
标题翻译：半导体器件引线框架
公开(公告)号：US5221859A
公开(公告)日：1993-06-22
申请号：US660944
申请日：1991-02-26
申请人： Shiro Kobayashi , Narutoshi Kazama , Masahiko Itoh , Noriyuki Ohnaka
发明人： Shiro Kobayashi , Narutoshi Kazama , Masahiko Itoh , Noriyuki Ohnaka
IPC分类号： H01L23/495 , H05K3/34
CPC分类号： H01L23/49582 , H01L23/4951 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/20753 , H05K3/3421
摘要： A lead frame of a plastic encapsulated type semiconductor device is provided with a coating film which has a solderability higher than a solderability of a basic metal of the lead frame, and the coating film has a corrosion potential higher than a corrosion potential of the basic metal. The coating film protects the basic metal from corrosion caused by the plastic encapsulated member. The coating film of the lead frame made of a Fe-Ni alloy is an alloy comprising metal selected from Mo, W, Au, Cr, Cu, metals of the platinum group and a metal selected from Fe, Co, and Ni.
摘要翻译：塑料封装型半导体器件的引线框架设置有具有比引线框架的碱性金属的可焊性高的可焊性的涂膜，并且涂膜具有高于碱性金属的腐蚀电位的腐蚀电位。涂膜可保护碱性金属免受塑料封装件引起的腐蚀。由Fe-Ni合金制成的引线框架的涂膜是包含选自Mo，W，Au，Cr，Cu的金属，铂族金属和选自Fe，Co和Ni的金属的合金。

3. 发明授权

US4821148A Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound 失效
标题翻译：具有由金属 - 有机物质化合物制成的保护层的树脂封装半导体器件
公开(公告)号：US4821148A
公开(公告)日：1989-04-11
申请号：US870399
申请日：1986-06-04
申请人： Shiro Kobayashi , Masahiko Itoh , Akira Minato
发明人： Shiro Kobayashi , Masahiko Itoh , Akira Minato
IPC分类号： H01L23/02 , H01L21/56 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/49 , H01L23/30
CPC分类号： H01L23/293 , H01L23/3135 , H01L24/48 , H01L2224/05624 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48624 , H01L2224/48639 , H01L2224/48824 , H01L2224/48839 , H01L2224/85439 , H01L2224/8592 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , H01L2924/3011
摘要： A silver electrode (4) on a lead frame (2) is bonded to an aluminum electrode (5) on a silicon chip (1) with a copper wire (3). The resulting semiconductor device was immersed in a solution of benzotriazole in ethyl alcohol. An Ag-benzotriazole film (6) was formed on the surface of the silver electrode (4) and a Cu-benzotriazole film (7) was formed on the surface of the copper wire (3), while an Al-benzotriazole film (8) was formed on the surface of the aluminum electrode (5). Even if water penetrates into the semiconductor device, the silver electrode (4), the aluminum electrode (5) and the copper wire (3) are effectively protected by the anti-corrosive Ag-benzotriazole film (6), Cu-benzotriazole film (7) and Al-benzotriazole film (8) to exhibit excellent damp-proof.
摘要翻译：引线框架（2）上的银电极（4）通过铜线（3）与硅芯片（1）上的铝电极（5）接合。将所得半导体器件浸入苯并三唑在乙醇中的溶液中。在银电极（4）的表面上形成Ag-苯并三唑膜（6），在铜线（3）的表面上形成Cu-苯并三唑膜（7），而Al-苯并三唑膜）形成在铝电极（5）的表面上。即使水渗透到半导体器件中，银电极（4），铝电极（5）和铜线（3）也被抗腐蚀的Ag-苯并三唑膜（6），Cu-苯并三唑膜 7）和Al-苯并三唑膜（8），具有优异的防潮性能。

4. 发明授权

US5055356A Aluminium and aluminium alloy having corrosion-resistant protective layer, and methods of making such a layer 失效
标题翻译：具有耐腐蚀保护层的铝和铝合金及其制造方法
公开(公告)号：US5055356A
公开(公告)日：1991-10-08
申请号：US386218
申请日：1989-07-28
申请人： Emiko Minowa , Shiro Kobayashi , Masahiko Itoh
发明人： Emiko Minowa , Shiro Kobayashi , Masahiko Itoh
IPC分类号： C25D11/18 , C23C22/56 , C23C22/68 , C25D9/12 , C25D11/06 , C25D11/16 , C25D11/36 , C25D11/38 , G11B7/24 , G11B7/258 , G11B7/26 , H01G9/00 , H01G9/04
CPC分类号： H01G9/0032 , C23C22/56 , C23C22/68 , C25D11/06 , C25D11/16 , G11B7/24 , G11B7/258 , G11B7/26 , G11B7/2585 , Y10S428/913 , Y10T428/21 , Y10T428/31 , Y10T428/31678
摘要： A body, particularly a thin layer, of aluminium or aluminium alloy is given a corrosion-resistant bright dense barrier-type protective layer. The layer has a thickness in the range 50 to 500 nm and comprises aluminium oxide and a chelate complex of aluminium and at least one organic chelating compound. The layer is formed by contacting the surface with a solution of the chelating compound of pH 2 to 7 and, optionally, performing oxidative electrolysis.

5. 发明授权

US4977443A Semiconductor module and an electronic computer using the semiconductor module 失效
标题翻译：半导体模块和使用半导体模块的电子计算机
公开(公告)号：US4977443A
公开(公告)日：1990-12-11
申请号：US409139
申请日：1989-09-19
申请人： Shiro Kobayashi , Masahiko Itoh , Masakiyo Izumiya
发明人： Shiro Kobayashi , Masahiko Itoh , Masakiyo Izumiya
IPC分类号： H01L23/473 , H01L23/433
CPC分类号： H01L23/4332 , H01L2224/16 , H01L2224/73253
摘要： A semiconductor module comprises semiconductor elements, cooling structures for cooling the semiconductor elements by liquid refrigerant, and a housing for accommodating the semiconductor elements and the cooling structures, wherein within the housing, there is supplied or enclosed sealingly a reactive gas which reacts with ions of a metal constituting the cooling structures to form a chemical compound hard to dissolve to the refrigerant but does not react with the metal itself constituting the cooling structures.

6. 发明授权

US08642694B2 Bio-based coating composition and its coated article 有权
标题翻译：生物基涂料组合物及其涂层制品
公开(公告)号：US08642694B2
公开(公告)日：2014-02-04
申请号：US12713569
申请日：2010-02-26
申请人： Koji Morita , Hirofumi Yamashita , Hitomi Ohara , Shiro Kobayashi , Masahiko Ishii
发明人： Koji Morita , Hirofumi Yamashita , Hitomi Ohara , Shiro Kobayashi , Masahiko Ishii
IPC分类号： C08L67/04 , C08G63/08 , C08G63/02 , C08G63/06
CPC分类号： C08L67/04 , C08F220/06 , C08F220/14 , C08F220/18 , C08F2220/1825 , C08F2220/281 , C08L33/066 , C08L33/068 , C08L2666/04 , C08L2666/02
摘要： There are provided: a bio-based coating composition which is a bio-based ingredient coating composition in consideration of environment and does not need any expensive ingredient and is also excellent in hydrolysis resistance; and an article coated with the coating composition. The bio-based coating composition is characterized by comprising the following film-forming ingredients: a lactic acid polymer (A) which contains a polyfunctional compound having a hydroxyl group and/or a carboxyl group in a functionality of not less than 3 and lactic acid as essential monomer ingredients and has a specific SP value; and a resin (B) which contains a hydroxyl group and/or a carboxyl group and has a specific SP value; wherein the difference (ΔSP) between the SP values of the lactic acid polymer (A) and the resin (B) is in the range of 0.2 to 4.0. The coated article is characterized by being obtained by being coated with the aforementioned coating composition.
摘要翻译：提供：生物基涂料组合物，考虑到环境是生物基成分涂料组合物，不需要任何昂贵的成分，并且耐水解性也优异; 和涂覆有涂料组合物的制品。生物基涂料组合物的特征在于包含以下成膜成分：含有官能度不低于3的具有羟基和/或羧基的多官能化合物的乳酸聚合物（A）和乳酸作为必需单体成分，具有特定的SP值; 和含有羟基和/或羧基并具有特定SP值的树脂（B）; 其中，乳酸聚合物（A）和树脂（B）的SP值之差（DeltaSP）在0.2〜4.0的范围内。涂层制品的特征在于通过涂覆上述涂料组合物获得。

7. 发明申请

US20090083687A1 PRINTED CIRCUIT BOARD DESIGN SUPPORT METHOD AND APPARATUS 有权
标题翻译：印刷电路板设计支持方法和设备
公开(公告)号：US20090083687A1
公开(公告)日：2009-03-26
申请号：US12238895
申请日：2008-09-26
申请人： Toshisato Sadamatsu , Shinichi Hama , Shiro Kobayashi
发明人： Toshisato Sadamatsu , Shinichi Hama , Shiro Kobayashi
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： A method used for supporting designing of a printed circuit board including a plurality of conductive layers having conductive areas to which a constant potential is applied, includes specifying conductive areas having a predetermined wiring from the conductive areas for each of the plurality of conductive layers, extracting areas that overlap each other in a planar view from the specified conductive areas, specifying an interlayer connection member that electrically connects at least two of the plurality of conductive layers in the extracted area, and clearly specifying an area within a predetermined distance from a center of the specified interlayer connection member and in the extracted area.
摘要翻译：一种用于支持包括具有施加恒定电位的导电区域的多个导电层的印刷电路板的设计的方法包括从多个导电层中的每一个的导电区域指定具有预定布线的导电区域，提取指定从提取区域中电连接多个导电层中的至少两个的层间连接构件，并且明确地指定距离所述提取区域中的多个导电层的中心的预定距离内的区域指定的层间连接构件和提取区域。

8. 发明授权

US06841650B2 Crystallizable poly (2,5-di-substituted-1,4-phenylene oxide) and a method of preparing the same 有权
标题翻译：可结晶的聚（2,5-二取代-1,4-亚苯基氧化物）及其制备方法
公开(公告)号：US06841650B2
公开(公告)日：2005-01-11
申请号：US10157862
申请日：2002-05-31
申请人： Hideyuki Higashimura , Kiyoshi Fujisawa , Yoshihiko Moro-Oka , Shiro Kobayashi
发明人： Hideyuki Higashimura , Kiyoshi Fujisawa , Yoshihiko Moro-Oka , Shiro Kobayashi
IPC分类号： C08G65/44 , C08G59/50
CPC分类号： C08G65/44
摘要： There is disclosed a crystallizable poly(2,5-di-substituted-1,4-phenylene oxide), which exhibits an exothermic peak for crystallization of not less than 5 J/g at 150° C. or over when cooled after melting, and/or an endothermic peak, at the time of melting of crystals thereof, of not less than 5 J/g at 150° C. or over when re-heated after cooling of the melt, and which comprises a recurring unit of the following formula (I), and a method of preparing the same by polymerization of a 2,5-di-substituted-phenol of the following formula (II) by use of a copper complex catalyst made of a tridentate ligand of which nitrogen atoms coordinate to a copper atom in coexistence with oxygen: wherein R1's independently represent a hydrocarbon group or a substituted hydrocarbon group, and they may be the same or different. The crystallizable poly(2,5-di-substituted-1,4-phenylene oxide) is able to provide a melt molding which has a reduced degree of coloration and good heat resistance.
摘要翻译：公开了一种可结晶的聚（2,5-二取代-1,4-亚苯基氧化物），其在熔化后冷却时在150℃或更高温度下表现出不低于5J / g的结晶放热峰，和/或其结晶时的吸热峰在熔融物冷却后再加热时在150℃以上不低于5J / g，并且其包含以下的重复单元式（I）的方法和通过使用由氮原子配位的三齿配体构成的铜络合物催化剂聚合下述式（II）的2,5-二取代苯酚而制备的方法与氧共存的铜原子：其中R 1独立地表示烃基或取代的烃基，它们可以相同或不同。可结晶的聚（2,5-二取代-1,4-亚苯基氧化物）能够提供具有降低的着色程度和良好的耐热性的熔融模塑。

9. 发明授权

US06576800B2 Oxidation polymer of a substituted phenol 失效
标题翻译：取代苯酚的氧化聚合物
公开(公告)号：US06576800B2
公开(公告)日：2003-06-10
申请号：US09905978
申请日：2001-07-17
申请人： Hideyuki Higashimura , Shiro Kobayashi
发明人： Hideyuki Higashimura , Shiro Kobayashi
IPC分类号： C07C4100
CPC分类号： C08G65/44
摘要： An oxidation polymer of a substituted phenol, obtained by oxidative polymerization of at least one compound selected from the group consisting of a compound of formula (Ia) and a compound of formula (Ib), in which the oxidation polymer has a number-average polymerization degree of 3 or more: wherein R1 to R4 each represent a hydrogen atom and the like; provided that at least one of R1 to R4 represents a substituted or unsubstituted, saturated hydrocarbon group having 10 or more carbon atoms, and R1 and/or R4 represent a hydrogen atom; wherein R11 represents a substituted or unsubstituted, saturated hydrocarbon group having 15 or more carbon atoms, and R12 is the same as R11, or when R12 is different from R11, R12 represents a substituted or unsubstituted hydrocarbon group and the like.
摘要翻译：通过氧化聚合至少一种选自式（Ia）化合物和式（Ib）化合物的化合物的化合物获得的取代苯酚的氧化聚合物，其中氧化聚合物具有数均聚合 3以上：其中，R1〜R4各自表示氢原子等; 条件是R 1至R 4中的至少一个表示具有10个或更多个碳原子的取代或未取代的饱和烃基，R 1和/或R 4表示氢原子;其中R 11表示取代或未取代的饱和烃基，其具有15或更多的碳原子，R 12与R 11相同，或者当R 12与R 11不同时，R 12表示取代或未取代的烃基等。

10. 发明授权

US5204428A Copolymer and method of producing the same 失效
标题翻译：共聚物及其制造方法
公开(公告)号：US5204428A
公开(公告)日：1993-04-20
申请号：US809224
申请日：1991-12-16
申请人： Shiro Kobayashi , Yoshihiro Taguchi , Hiroshi Uyama
发明人： Shiro Kobayashi , Yoshihiro Taguchi , Hiroshi Uyama
IPC分类号： C08F216/14 , C08F220/10 , C08F246/00 , C09K11/02 , H01G4/18 , H05B33/20
CPC分类号： H01G4/18 , C08F216/14 , C08F220/10 , C08F246/00 , C09K11/02 , H05B33/20
摘要： A copolymer of the present invention is produced by copolymerization of an electron-donating monomer having an electron-accepting group and an electron-accepting monomer having an electron-accepting group. The copolymer thus exhibits a high dielectric constant, a low level of hygroscopicity and good adhesion.
摘要翻译：本发明的共聚物是通过具有电子接受基团的给电子性单体和具有电子接受基团的电子接受性单体的共聚来制造的。因此共聚物表现出高介电常数，低吸湿性和良好的粘合性。

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