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1. 发明授权

US07429759B2 Optical semiconductor device with improved illumination efficiency 有权
标题翻译：具有改善照明效率的光学半导体器件
公开(公告)号：US07429759B2
公开(公告)日：2008-09-30
申请号：US10559447
申请日：2004-06-07
申请人： Shinji Isokawa
发明人： Shinji Isokawa
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： An optical semiconductor device (A1) includes a light reflector (5) and an optical semiconductor chip (3). The reflector (5) includes two first reflecting surfaces (50a) spaced from each other in direction x, and two second reflecting surfaces (50b) spaced from each other in direction y. The chip (3) includes a rectangular upper surface and a rectangular lower surface spaced from each other in direction z perpendicular to both of the directions x and y. The chip (3) further includes at least one light-emitting surface (31) extending between the upper and the lower surfaces. The light-emitting surface (31) faces a corresponding one of the second reflecting surfaces (50b). The light-emitting surface (31) is non-parallel to the corresponding second reflecting surfaces (50b) as viewed in parallel to the direction z.
摘要翻译：光学半导体器件（A 1）包括光反射器（5）和光学半导体芯片（3）。反射器（5）包括在方向x上彼此间隔开的两个第一反射表面（50a）和在y方向上彼此间隔开的两个第二反射表面（50b）。芯片（3）包括矩形上表面和矩形下表面，它们在垂直于两个方向x和y的方向z上彼此间隔开。芯片（3）还包括在上表面和下表面之间延伸的至少一个发光表面（31）。发光面（31）面对相应的一个第二反射面（50b）。与Z方向平行地观察时，发光面（31）不对应于相应的第二反射面（50b）。

2. 发明授权

US07002185B2 Semiconductor device using semiconductor chip 有权
标题翻译：半导体器件采用半导体芯片
公开(公告)号：US07002185B2
公开(公告)日：2006-02-21
申请号：US10521301
申请日：2003-04-16
申请人： Shinji Isokawa
发明人： Shinji Isokawa
IPC分类号： H01L29/22 , H01L29/24
CPC分类号： H01L33/486 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/83 , H01L33/38 , H01L33/62 , H01L2224/0401 , H01L2224/0603 , H01L2224/06051 , H01L2224/16225 , H01L2224/26175 , H01L2224/29027 , H01L2224/29028 , H01L2224/30164 , H01L2224/32106 , H01L2224/32227 , H01L2224/8314 , H01L2224/83143 , H01L2224/83815 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor chip 1 is provided with a first electrode 2 formed at a first corner of a crystal substrate 1a generally quadrangular as viewed in plan, and with a second electrode 3 formed to extend along two sides of the crystal substrate 1a, these sides including between them a second corner located diagonally away from the first corner. The first electrode 2 and the second electrode 3 are connected to a first lead 15 and second leads 16a, 16b formed on the circuit substrate 10 via solder paste 20. The narrow first lead 15 extends transversely to a side of the crystal substrate 1a, and the second leads 16a, 16b extends in the opposite direction to that of the first lead 15. The first lead 15 and the second lead 16b are offset from each other by an appropriate distance. With such arrangements, the surface tension of melted solder prevents the semiconductor chip 1 from being fixed to the circuit substrate 10 with a slanting posture.
摘要翻译：半导体芯片1设置有形成在晶体基板1的第一角上的第一电极2，其在俯视图中大致四边形，并且形成为沿着晶体基板1a的两侧延伸的第二电极3，包括它们之间的第二个角落位于与第一个角落对角。第一电极2和第二电极3通过焊膏20连接到形成在电路基板10上的第一引线15和第二引线16a，16b。窄的第一引线15横向于晶体基板1a的一侧延伸，并且第二引线16a，16b沿与第一引线15的方向相反的方向延伸。第一引线15和第二引线16b彼此偏移适当的距离。通过这样的布置，熔融焊料的表面张力防止半导体芯片1以倾斜的姿势固定到电路基板10。

3. 发明申请

US20060151809A1 Optical semiconductor unit 有权
公开(公告)号：US20060151809A1
公开(公告)日：2006-07-13
申请号：US10857200
申请日：2004-05-28
申请人： Shinji Isokawa
发明人： Shinji Isokawa
IPC分类号： H01L31/109
CPC分类号： H01L33/54 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： An optical semiconductor device includes an optical semiconductor chip, a light permeable member covering the chip, and a reflector formed with an accommodation space for accommodating the light permeable member. The light permeable member includes a convex lens for converging light emitted from the optical semiconductor chip. The reflector includes a reflecting surface for reflecting light emitted from the optical semiconductor chip. At least part of the convex lens is located within the accommodation space of the reflector. The light permeable member includes an extension engaging and extending along the reflecting surface. The extension includes a light emitting surface surrounding the convex lens.

4. 发明申请

US20050116246A1 Light emitting diode lamp 有权
标题翻译：发光二极管灯
公开(公告)号：US20050116246A1
公开(公告)日：2005-06-02
申请号：US10506002
申请日：2003-02-24
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： H01L33/60 , H01L33/62 , H01L29/24
CPC分类号： H01L33/62 , H01L24/32 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode lamp includes a lead terminal 2 formed with a cup 8 having a conical inner circumferential surface serving as a light reflective surface 8a, an LED chip 4 bonded to a bottom surface 8b of the cup with a die bonding material H, a molded portion 6 made of a transparent synthetic resin for packaging the cup of the lead terminal. The bottom surface 8b of the cup is formed with a recess 9 or a protrusion 19 to which the LED chip 4 is bonded with the die bonding material H, whereby the light conversion efficiency of the conical light reflective surface 8a is enhanced.
摘要翻译：发光二极管灯包括形成有具有作为光反射表面8a的圆锥形内圆周表面的杯8的引线端子2，用芯片接合材料H接合到杯的底表面8b的LED芯片4 ，由用于包装引线端子的杯的透明合成树脂制成的模制部分6。杯的底面8b形成有凹部9或突起19，LED芯片4与芯片接合材料H接合，从而提高了锥形光反射表面8a的光转换效率。

5. 发明授权

US06847116B2 Chip-type semiconductor light-emitting device 有权
标题翻译：芯片型半导体发光器件
公开(公告)号：US06847116B2
公开(公告)日：2005-01-25
申请号：US09731889
申请日：2000-12-07
申请人： Shinji Isokawa
发明人： Shinji Isokawa
IPC分类号： H01L23/52 , H01L33/36 , H01L33/56 , H01L33/62 , H05K3/34 , H01L23/48
CPC分类号： H01L33/486 , H01L24/45 , H01L33/62 , H01L2224/05553 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H05K3/3442 , H01L2224/43 , H01L2924/00012 , H01L2924/01006
摘要： A chip-type semiconductor light-emitting device includes a semiconductor light-emitting chip connected to a pair of electrodes formed on a substrate. The semiconductor light-emitting chip is molded, together with respective parts of the electrodes, by resin. The electrode has a layered structure having a Cu layer, an Ni layer and an Au layer in that order from the lowermost layer, to have a step formed inside the mold by changing the wall thickness of the Cu layer.
摘要翻译：芯片型半导体发光器件包括连接到形成在衬底上的一对电极的半导体发光芯片。半导体发光芯片与电极的各个部分一起通过树脂模制。电极具有从最下层开始依次具有Cu层，Ni层和Au层的层状结构，通过改变Cu层的壁厚而形成在模具内部的台阶。

6. 发明申请

US20070246731A1 Semiconductor device using semiconductor chip 审中-公开
标题翻译：半导体器件采用半导体芯片
公开(公告)号：US20070246731A1
公开(公告)日：2007-10-25
申请号：US11810724
申请日：2007-06-07
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： H01L33/00
CPC分类号： H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/38 , H01L33/486 , H01L33/62 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83143 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.
摘要翻译：半导体器件包括具有由芯片焊盘3形成的正面的绝缘基板2，用芯片接合材料10接合到芯片焊盘的LED芯片等矩形半导体芯片7以及由合成材料制成的模制部分9 用于包装半导体芯片的树脂。管芯焊盘3可以是矩形的，其尺寸接近半导体芯片的尺寸或具有接近半导体芯片的对角线尺寸的直径的圆形，由此可以在半导体芯片的接合中精确地执行半导体芯片的定位和定向。

7. 发明授权

US07128444B2 Light emitting diode lamp 有权
标题翻译：发光二极管灯
公开(公告)号：US07128444B2
公开(公告)日：2006-10-31
申请号：US10506002
申请日：2003-02-24
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： F21V3/00
CPC分类号： H01L33/62 , H01L24/32 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode lamp includes a lead terminal 2 formed with a cup 8 having a conical inner circumferential surface serving as a light reflective surface 8a, an LED chip 4 bonded to a bottom surface 8b of the cup with a die bonding material H, a molded portion 6 made of a transparent synthetic resin for packaging the cup of the lead terminal. The bottom surface 8b of the cup is formed with a recess 9 or a protrusion 19 to which the LED chip 4 is bonded with the die bonding material H, whereby the light conversion efficiency of the conical light reflective surface 8a is enhanced.
摘要翻译：发光二极管灯包括形成有具有作为光反射表面8a的圆锥形内圆周表面的杯8的引线端子2，用芯片接合材料H接合到杯的底表面8b的LED芯片4 ，由用于包装引线端子的杯的透明合成树脂制成的模制部分6。杯的底面8b形成有凹部9或突起19，LED芯片4与芯片接合材料H接合，从而提高了锥形光反射表面8a的光转换效率。

8. 发明申请

US20060163602A1 Optical semiconductor device 有权
标题翻译：光半导体器件
公开(公告)号：US20060163602A1
公开(公告)日：2006-07-27
申请号：US10559447
申请日：2004-06-07
申请人： Shinji Isokawa
发明人： Shinji Isokawa
IPC分类号： H01L33/00 , H01L29/24
CPC分类号： H01L33/60 , H01L25/0753 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： An optical semiconductor device (A1) comprises a light reflector (5) and an optical semiconductor chip (3). The reflector (5) includes two first reflecting surfaces (50a) spaced from each other in direction x, and two second reflecting surfaces (50b) spaced from each other in direction y. The chip (3) includes a rectangular upper surface and a rectangular lower surface spaced from each other in direction z perpendicular to both of the directions x and y. The chip (3) further includes at least one light-emitting surface (31) extending between the upper and the lower surfaces. The light-emitting surface (31) faces a corresponding one of the second reflecting surfaces (50b). The light-emitting surface (31) is non-parallel to the corresponding second reflecting surfaces (50b) as viewed in parallel to the direction z.
摘要翻译：光学半导体器件（A 1）包括光反射器（5）和光学半导体芯片（3）。反射器（5）包括在方向x上彼此间隔开的两个第一反射表面（50a）和在y方向上彼此间隔开的两个第二反射表面（50b）。芯片（3）包括矩形上表面和矩形下表面，它们在垂直于两个方向x和y的方向z上彼此间隔开。芯片（3）还包括在上表面和下表面之间延伸的至少一个发光表面（31）。发光面（31）面对相应的一个第二反射面（50b）。与Z方向平行地观察时，发光面（31）不对应于相应的第二反射面（50b）。

9. 发明授权

US06670648B2 Semiconductor light-emitting device having a reflective case 有权
标题翻译：具有反射壳体的半导体发光器件
公开(公告)号：US06670648B2
公开(公告)日：2003-12-30
申请号：US10196205
申请日：2002-07-17
申请人： Shinji Isokawa , Tadahiro Okazaki
发明人： Shinji Isokawa , Tadahiro Okazaki
IPC分类号： H01L2922
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2933/0091 , H01L2924/00014
摘要： A semiconductor light-emitting device has a semiconductor light-emitting element 3 mounted on an electrode 2 formed on a surface of an insulating substrate 1, and has a reflective case 5 provided on the insulating substrate 1 so as to reflect the light from the light-emitting element 3, with the space inside the reflective case 5 sealed with a translucent resin 6. The reflective case 5 has a grained portion 51 formed over at least part of the surface thereof over which it makes contact with the translucent resin 6. This effectively prevents the translucent resin from coming off the reflective case. To enable the semiconductor light-emitting device to emit light with more even intensity in all directions, the grained portion is formed, preferably, at least in the portions of the reflective case 5 that face the side surfaces of the semiconductor light-emitting element.
摘要翻译：半导体发光装置具有安装在形成于绝缘基板1的表面上的电极2上的半导体发光元件3，并且具有设置在绝缘基板1上的反射壳体5，以反射来自光的光发光元件3，其中反射壳体5内的空间用半透明树脂6密封。反射壳体5具有在其与透光性树脂6接触的表面的至少一部分上形成的纹理部分51。有效地防止半透明树脂从反射壳体脱落。为了使半导体发光元件能够在各个方向上均匀地发光，最好至少在反射壳体5的面对半导体发光元件的侧面的部分形成纹理部分。

10. 发明授权

US6121637A Semiconductor light emitting device with increased luminous power 有权
标题翻译：具有增加发光功率的半导体发光器件
公开(公告)号：US6121637A
公开(公告)日：2000-09-19
申请号：US165284
申请日：1998-10-02
申请人： Shinji Isokawa , Hidekazu Toda
发明人： Shinji Isokawa , Hidekazu Toda
IPC分类号： H01L33/48 , H01L33/00
CPC分类号： H01L33/486 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265
摘要： In a chip-type light emitting device in which first and second terminal electrodes are formed on both ends of an insulating substrate with a light emitting device chip being mounted on the surface side, the LED chip is directly formed on the insulating substrate, and at least a portion of the insulating substrate on which the LED chip is mounted is formed by a whitish material. Alternatively, in a lamp-type semiconductor light emitting device in which the LED chip is mounted on the top of a lead, and is covered with a dome-shaped package, or in a chip-type semiconductor light emitting device, a bonding material used for bonding the LED chip is made of a whitish material. Therefore, it becomes possible to reflect light that proceeds toward the back surface side of the LED chip efficiently, and consequently to increase the necessary luminosity even if the light-emitting efficiency inside the LED chip remains the same.
摘要翻译：在其中在表面侧安装有发光器件芯片的绝缘基板的两端上形成有第一和第二端子电极的芯片型发光器件中，LED芯片直接形成在绝缘基板上，并且在通过发白材料形成安装有LED芯片的绝缘基板的至少一部分。或者，在其中LED芯片安装在引线顶部并被圆顶形封装覆盖的灯型半导体发光器件中或在芯片型半导体发光器件中使用的接合材料用于粘合LED芯片由发白材料制成。因此，即使LED芯片内的发光效率保持相同，也能够有效地反射朝向LED芯片的背面侧的光反射，并且因此增加必要的亮度。

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