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1. 发明申请

US20080042150A1 White Light Emitting Device and Method for Manufacturing the Same 审中-公开
标题翻译：白光发射装置及其制造方法
公开(公告)号：US20080042150A1
公开(公告)日：2008-02-21
申请号：US11629999
申请日：2005-06-22
申请人： Tomoji Yamaguchi
发明人： Tomoji Yamaguchi
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L24/97 , H01L33/32 , H01L33/501 , H01L2224/05573 , H01L2224/11 , H01L2224/73204 , H01L2224/92125
摘要： There are provided a white light emitting device of high luminous efficiency prevented from luminance deterioration even in large electric current range, and a method for manufacturing the same with high production yield. The white light emitting device (1) is composed of a blue LED element (4) and an oxide layer (8) containing a fluorescent material which is integrated with the blue LED element (4). In the blue LED element (4), a p-side electrode (11) is formed on a surface of a p-type layer of epitaxial layers (6) formed by laminating GaN based compound semiconductor layers on a surface of a light transmitting crystal substrate (3), and an n-side electrode (10) is formed on a bottom surface of a recessed portion (9) which is an n-type layer exposed by selectively etching a part of the p-type layer and the light emitting layer. The oxide layer (8) is formed by sintering a YAG fluorescent material and a glass binder containing mainly SiO2, B2O3 and PbO for binding the fluorescent material. The white light emitting device emits white light to the out side by converting blue light emitted from the blue LED element in the oxide layer (8).
摘要翻译：提供了即使在大的电流范围也能够防止亮度劣化的高发光效率的白色发光元件及其制造方法。白色发光器件（1）由蓝色LED元件（4）和含有与蓝色LED元件（4）集成的荧光材料的氧化物层（8）组成。在蓝色LED元件（4）中，p型电极（11）形成在通过在透光晶体的表面上层叠GaN基化合物半导体层而形成的外延层（6）的p型层的表面上基板（3）和n侧电极（10）形成在通过选择性蚀刻p型层的一部分而暴露的n型层的凹部（9）的底面上，发光层。氧化物层（8）通过烧结YAG荧光材料和主要含有SiO 2，B 2 O 3 3和PbO的玻璃粘合剂形成用于粘合荧光材料。白色发光装置通过转换从氧化物层（8）中的蓝色LED元件发出的蓝色光向外侧发射白色光。

2. 发明申请

US20050156187A1 Semiconductor device using semiconductor chip 有权
标题翻译：半导体器件采用半导体芯片
公开(公告)号：US20050156187A1
公开(公告)日：2005-07-21
申请号：US10506826
申请日：2003-02-24
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： H01L23/498 , H01L33/38 , H01L33/48 , H01L33/62 , H01L29/24
CPC分类号： H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/38 , H01L33/486 , H01L33/62 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83143 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.
摘要翻译：半导体器件包括具有由芯片焊盘3形成的正面的绝缘基板2，用芯片接合材料10接合到芯片焊盘的LED芯片等矩形半导体芯片7以及由合成材料制成的模制部分9 用于包装半导体芯片的树脂。管芯焊盘3可以是矩形的，其尺寸接近半导体芯片的尺寸或具有接近半导体芯片的对角线尺寸的直径的圆形，由此可以在半导体芯片的接合中精确地执行半导体芯片的定位和定向。

3. 发明申请

US20070246731A1 Semiconductor device using semiconductor chip 审中-公开
标题翻译：半导体器件采用半导体芯片
公开(公告)号：US20070246731A1
公开(公告)日：2007-10-25
申请号：US11810724
申请日：2007-06-07
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： H01L33/00
CPC分类号： H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/38 , H01L33/486 , H01L33/62 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83143 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.
摘要翻译：半导体器件包括具有由芯片焊盘3形成的正面的绝缘基板2，用芯片接合材料10接合到芯片焊盘的LED芯片等矩形半导体芯片7以及由合成材料制成的模制部分9 用于包装半导体芯片的树脂。管芯焊盘3可以是矩形的，其尺寸接近半导体芯片的尺寸或具有接近半导体芯片的对角线尺寸的直径的圆形，由此可以在半导体芯片的接合中精确地执行半导体芯片的定位和定向。

4. 发明授权

US07128444B2 Light emitting diode lamp 有权
标题翻译：发光二极管灯
公开(公告)号：US07128444B2
公开(公告)日：2006-10-31
申请号：US10506002
申请日：2003-02-24
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： F21V3/00
CPC分类号： H01L33/62 , H01L24/32 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode lamp includes a lead terminal 2 formed with a cup 8 having a conical inner circumferential surface serving as a light reflective surface 8a, an LED chip 4 bonded to a bottom surface 8b of the cup with a die bonding material H, a molded portion 6 made of a transparent synthetic resin for packaging the cup of the lead terminal. The bottom surface 8b of the cup is formed with a recess 9 or a protrusion 19 to which the LED chip 4 is bonded with the die bonding material H, whereby the light conversion efficiency of the conical light reflective surface 8a is enhanced.
摘要翻译：发光二极管灯包括形成有具有作为光反射表面8a的圆锥形内圆周表面的杯8的引线端子2，用芯片接合材料H接合到杯的底表面8b的LED芯片4 ，由用于包装引线端子的杯的透明合成树脂制成的模制部分6。杯的底面8b形成有凹部9或突起19，LED芯片4与芯片接合材料H接合，从而提高了锥形光反射表面8a的光转换效率。

5. 发明授权

US06392294B1 Semiconductor device with stable protection coating 有权
标题翻译：具有稳定保护涂层的半导体器件
公开(公告)号：US06392294B1
公开(公告)日：2002-05-21
申请号：US09464488
申请日：1999-12-15
申请人： Tomoji Yamaguchi
发明人： Tomoji Yamaguchi
IPC分类号： H01L2348
CPC分类号： H01L33/54 , H01L23/3121 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L24/97 , H01L33/486 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15151 , H01L2924/181 , H01L2924/18301 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is provided which includes an insulating substrate, a conductive terminal supported by the substrate, a semiconductor chip mounted on the substrate, and a protection coating for enclosing the chip. The protection coating is integrally formed with an anchoring portion. The substrate is formed with an engaging portion for engagement with the anchoring portion of the coating.
摘要翻译：提供一种半导体器件，其包括绝缘衬底，由衬底支撑的导电端子，安装在衬底上的半导体芯片以及用于封装芯片的保护涂层。保护涂层与锚定部分一体地形成。衬底形成有用于与涂层的锚定部分接合的接合部分。

6. 发明授权

US07242033B2 Semiconductor device using LED chip 有权
标题翻译：半导体器件采用LED芯片
公开(公告)号：US07242033B2
公开(公告)日：2007-07-10
申请号：US10506826
申请日：2003-02-24
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： H01L33/00 , H01L23/48 , H01L23/52
CPC分类号： H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/38 , H01L33/486 , H01L33/62 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83143 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.
摘要翻译：半导体器件包括具有由芯片焊盘3形成的正面的绝缘基板2，用芯片接合材料10接合到芯片焊盘的LED芯片等矩形半导体芯片7以及由合成材料制成的模制部分9 用于包装半导体芯片的树脂。管芯焊盘3可以是矩形的，其尺寸接近半导体芯片的尺寸或具有接近半导体芯片的对角线尺寸的直径的圆形，由此可以在半导体芯片的接合中精确地执行半导体芯片的定位和定向。

7. 发明授权

US5564819A LED lamp and arrangement for mounting LED lamps on a substrate 失效
标题翻译： LED灯和用于将LED灯安装在基板上的布置
公开(公告)号：US5564819A
公开(公告)日：1996-10-15
申请号：US411541
申请日：1995-03-28
申请人： Tomoji Yamaguchi
发明人： Tomoji Yamaguchi
IPC分类号： G09F9/33 , H01L25/075 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , F21V7/00
CPC分类号： H01L25/0753 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , H01L33/60 , H01L33/62 , Y10S362/80
摘要： An LED lamp has a first lead formed with a reflecting plate at an upper end and a pair of further leads spaced on opposite sides of the first lead, and a plurality of LED chips mounted in linear spaced relation on the reflecting plate. The direction Y of the spacing of the plurality of LED chips is inclined at a predetermined angle .alpha. to the spacing direction X of the leads. The reflecting plate has an elongated shape and the plurality of LED chips are spaced in the direction of elongation of the reflecting plate.
摘要翻译： LED灯具有在上端形成有反射板的第一引线和在第一引线的相对侧上间隔开的一对另外的引线，以及在反射板上以线性间隔的关系安装的多个LED芯片。多个LED芯片的间隔的方向Y以与引线的间隔方向X成预定角度α倾斜。反射板具有细长形状，并且多个LED芯片在反射板的伸长方向上间隔开。

8. 发明申请

US20050116246A1 Light emitting diode lamp 有权
标题翻译：发光二极管灯
公开(公告)号：US20050116246A1
公开(公告)日：2005-06-02
申请号：US10506002
申请日：2003-02-24
申请人： Shinji Isokawa , Tomoji Yamaguchi
发明人： Shinji Isokawa , Tomoji Yamaguchi
IPC分类号： H01L33/60 , H01L33/62 , H01L29/24
CPC分类号： H01L33/62 , H01L24/32 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode lamp includes a lead terminal 2 formed with a cup 8 having a conical inner circumferential surface serving as a light reflective surface 8a, an LED chip 4 bonded to a bottom surface 8b of the cup with a die bonding material H, a molded portion 6 made of a transparent synthetic resin for packaging the cup of the lead terminal. The bottom surface 8b of the cup is formed with a recess 9 or a protrusion 19 to which the LED chip 4 is bonded with the die bonding material H, whereby the light conversion efficiency of the conical light reflective surface 8a is enhanced.
摘要翻译：发光二极管灯包括形成有具有作为光反射表面8a的圆锥形内圆周表面的杯8的引线端子2，用芯片接合材料H接合到杯的底表面8b的LED芯片4 ，由用于包装引线端子的杯的透明合成树脂制成的模制部分6。杯的底面8b形成有凹部9或突起19，LED芯片4与芯片接合材料H接合，从而提高了锥形光反射表面8a的光转换效率。

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