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    • 6. 发明授权
    • Resist coating apparatus
    • 抗蚀涂层设备
    • US08505479B2
    • 2013-08-13
    • US12877187
    • 2010-09-08
    • Kousuke YoshiharaTomohiro Iseki
    • Kousuke YoshiharaTomohiro Iseki
    • B05C11/00B05C11/02
    • H01L21/6715G03F7/162
    • A resist coating apparatus supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.
    • 抗蚀涂层装置在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心,然后使基板的旋转减速到低于第一转速的第二转速,或 直到旋转停止,随着转速变得更接近于第二转速或转动停止,减速步骤中的减速度变小,并且将基板的旋转加速到高于第二转速的第三转速,以使其脱离 抗蚀剂溶液的残留物。
    • 7. 发明授权
    • Coating treatment method, coating treatment apparatus, and computer-readable storage medium
    • 涂布处理方法,涂布处理装置和计算机可读存储介质
    • US08414972B2
    • 2013-04-09
    • US12530345
    • 2008-02-28
    • Kousuke YoshiharaTomohiro IsekiKoji Takayanagi
    • Kousuke YoshiharaTomohiro IsekiKoji Takayanagi
    • B05D3/12
    • H01L21/02104B05D1/005G03F7/162H01L21/02282H01L21/6715
    • In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.
    • 在涂布步骤中,基板高速旋转,并且在该状态下,将抗蚀剂溶液从第一喷嘴排出到基板的中心部分,以将抗蚀剂溶液涂覆在基板上。 随后,在平坦化步骤中,基板的旋转减速,并且基板以低速旋转以使基板上的抗蚀剂溶液平坦化。 在这种情况下,在涂布步骤中,通过第一喷嘴对抗蚀剂溶液的排出进行到平坦化阶段的中间,并且当在平坦化步骤中完成抗蚀剂溶液的排出时,第一喷嘴移动 抗蚀剂溶液从衬底的中心部分的放电位置。 根据本发明,能够将抗蚀剂溶液均匀地涂布在基板内。
    • 10. 发明授权
    • Coating treatment method, coating treatment apparatus, and computer-readable storage medium
    • 涂布处理方法,涂布处理装置和计算机可读存储介质
    • US08318247B2
    • 2012-11-27
    • US12205999
    • 2008-09-08
    • Kousuke YoshiharaTomohiro IsekiKoji Takayanagi
    • Kousuke YoshiharaTomohiro IsekiKoji Takayanagi
    • B05D3/12
    • G03F7/162
    • The present invention includes: a first step of discharging a coating solution from a nozzle to a center portion of the substrate to apply the coating solution on a surface of the substrate while rotating the substrate; a second step of decelerating, after the first step, the rotation of the substrate and continuously rotating the substrate; and a third step of accelerating, after the second step, the rotation of the substrate to dry the coating solution on the substrate, wherein: the substrate is rotated at a fixed speed of a first speed immediately before the first step; and in the first step, the rotation of the substrate which is at the first speed before start of the first step is gradually accelerated after the start of the first step so as to make the speed continuously change, and the acceleration of the rotation of the substrate is gradually decreased so as to make the speed of the rotation of the substrate converge in a second speed higher than the first speed at end of the first step.
    • 本发明包括:第一步骤,将涂布液从喷嘴排出到基板的中心部分,以在旋转基板的同时将涂布溶液施加到基板的表面上; 在第一步骤之后使基板旋转并使基板连续旋转的第二步骤; 以及第三步骤,在所述第二步骤之后加速所述基板的旋转以使所述基板上的所述涂布溶液干燥,其中:所述基板在所述第一步骤之前以一速度的固定速度旋转; 并且在第一步骤中,在第一步骤开始之后以第一速度的基板的旋转在第一步骤开始之后逐渐加速,以使得速度连续变化,并且旋转的加速度 基板逐渐减小,以使得基板的旋转速度在第一步骤结束时以比第一速度高的第二速度会聚。