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1. 发明授权

US6043572A Linear motor, stage device, and exposing device 有权
标题翻译：直线电机，平台装置和曝光装置
公开(公告)号：US6043572A
公开(公告)日：2000-03-28
申请号：US172163
申请日：1998-10-14
申请人： Shingo Nagai , Toyoshige Sasaki , Shigeto Kamata
发明人： Shingo Nagai , Toyoshige Sasaki , Shigeto Kamata
IPC分类号： H01L21/027 , G03F7/20 , H02K41/03 , H02K41/00
CPC分类号： G03F7/70691 , H02K41/03
摘要： A linear motor includes a coil for receiving an electrical current and a first plurality of permanent magnets. The coil and the first plurality of permanent magnets move relative to each other in a direction of relative movement when an electrical current flows through the coil. The permanent magnets are arrayed in the direction of relative movement to form a first array. The direction of polarity of each permanent magnet in the first plurality of permanent magnets is oriented 90.degree. relative to the direction of polarity of an adjacent permanent magnet in the first plurality of permanent magnets. The first plurality of permanent magnets has a main portion and an end portion comprising plural corrective permanent magnets. Each of the plural corrective permanent magnets is smaller than the permanent magnets in the main portion having the same or opposite direction of polarity.
摘要翻译：线性电动机包括用于接收电流的线圈和第一多个永磁体。当电流流过线圈时，线圈和第一多个永磁体在相对移动的方向上相对于彼此移动。永磁体在相对移动的方向上排列以形成第一阵列。第一多个永磁体中的每个永磁体的极性方向相对于第一多个永磁体中的相邻永磁体的极性方向取向为90度。第一多个永磁体具有主要部分和包括多个校正永磁体的端部。多个校正永磁体中的每一个小于具有相同或相反极性方向的主要部分中的永磁体。

2. 发明申请

US20090205849A1 HERMETIC ENVELOPE AND IMAGE DISPLAY APPARATUS USING THE SAME 有权
标题翻译：使用它的HERMETIC ENVELOPE和IMAGE DISPLAY APPARATUS
公开(公告)号：US20090205849A1
公开(公告)日：2009-08-20
申请号：US12372287
申请日：2009-02-17
申请人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
发明人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
IPC分类号： H05K5/06
CPC分类号： H05K5/061
摘要： A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.
摘要翻译：密封壳包括第一板，第二板和设置在第一板和第二板之间以形成内部空间的框架。第一接合部设置在框架和第一板之间，以将框架和第一板彼此接合，并且第一邻接部分设置在框架和第一板之间，并且位于比第一板更接近内部空间的位置粘接部分。第二接合部设置在框架和第二板之间，以将框架和第二板彼此接合，并且第二抵接部分设置在框架和第二板之间，并且定位成比第二接合更靠近内部空间部分。第二接合部位于比第一接合部更靠近内部空间的位置。

3. 发明授权

US06937041B2 Method for manufacturing a substrate and a display device 失效
标题翻译：制造基板和显示装置的方法
公开(公告)号：US06937041B2
公开(公告)日：2005-08-30
申请号：US10789996
申请日：2004-03-02
申请人： Akihiro Kimura , Kazuhiro Oki , Shigeto Kamata
发明人： Akihiro Kimura , Kazuhiro Oki , Shigeto Kamata
IPC分类号： G01R1/06 , H01J9/02 , G01R31/02
CPC分类号： H01J9/02 , H01J2201/3165 , H01J2329/00 , Y10T29/49204
摘要： A probe for applying a voltage to lines provided on a substrate comprises (a) a conductive sheet, the conductive sheet including a mesh sheet in which linear members are woven into a mesh and a conductive material which coats the mesh sheet, (b) an elastic member for pressing the conductive sheet against the lines, and (c) a holding member for holding the conductive sheet and the elastic member together. The probe has improved electrical connectivity and durability, and achieves a reduction in size and facilitation of operations of an apparatus for manufacturing an electron source.
摘要翻译：用于对设置在基板上的线施加电压的探针包括（a）导电片，所述导电片包括网状片，所述网片将线状构件编织成网状物，以及涂覆网片的导电材料，（b）用于将导电片压靠在线上的弹性构件，以及（c）用于将导电片和弹性构件保持在一起的保持构件。探针具有改善的电连接性和耐久性，并且实现了用于制造电子源的装置的操作的尺寸的减小和便利化。

4. 发明申请

US20050075031A1 Electron source manufacturing apparatus and electron source manufacturing method 失效
标题翻译：电子源制造装置和电子源制造方法
公开(公告)号：US20050075031A1
公开(公告)日：2005-04-07
申请号：US10957839
申请日：2004-10-05
申请人： Shigeto Kamata , Kazuhiro Oki , Akihiro Kimura , Kazumasa Takatsu
发明人： Shigeto Kamata , Kazuhiro Oki , Akihiro Kimura , Kazumasa Takatsu
IPC分类号： H01J9/02 , H01J9/42
CPC分类号： H01J9/42 , H01J9/027 , H01J2201/3165 , H01J2329/00
摘要： In an electron source manufacturing apparatus, the quantity of heat generated from an electron source substrate is measured. A temperature of a support member for the electron source substrate is controlled based on the measured quantity of heat generated. A variation in performances of electron source substrates is suppressed, which increase their life.
摘要翻译：在电子源制造装置中，测量从电子源基板产生的热量。基于所测量的热量来控制电子源基板的支撑部件的温度。抑制了电子源基板的性能变化，延长了使用寿命。

5. 发明授权

US5701041A Weight supporting apparatus 失效
标题翻译：配重设备
公开(公告)号：US5701041A
公开(公告)日：1997-12-23
申请号：US316887
申请日：1994-10-03
申请人： Kotaro Akutsu , Eiji Osanai , Shigeto Kamata
发明人： Kotaro Akutsu , Eiji Osanai , Shigeto Kamata
IPC分类号： B23Q1/00 , B23Q1/26 , B23Q1/38 , F16C29/02 , F16C32/06 , G03F7/20 , H01L21/027 , H01L21/68 , H01L21/687 , H02K33/18
CPC分类号： F16C29/025 , B23Q1/262 , B23Q1/385 , F16C32/0614 , F16C32/0662 , G03F7/70716 , Y10T74/20207
摘要： A weight supporting apparatus supports the weight of a structure required to have very high surface precision, without affecting the surface precision of the structure. The weight support apparatus includes a driving unit for moving a driven body in the direction of gravity with respect to a base, and a supporting unit for supporting the weight of the driven body at a position after being driven, wherein the driving unit and supporting unit are so arranged that the drive force of the driving unit and the support force of the supporting unit are on the same axis.
摘要翻译：重量支撑装置支撑要求具有非常高的表面精度的结构的重量，而不影响结构的表面精度。重量支撑装置包括：驱动单元，用于相对于基座在重力方向上移动从动体;以及支撑单元，用于将驱动体的重量支撑在驱动后的位置，其中驱动单元和支撑单元被布置成使得驱动单元的驱动力和支撑单元的支撑力在同一轴线上。

6. 发明授权

US08115391B2 Hermetic envelope and image display apparatus using the same 有权
标题翻译：密封信封和使用其的图像显示装置
公开(公告)号：US08115391B2
公开(公告)日：2012-02-14
申请号：US12372287
申请日：2009-02-17
申请人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
发明人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
IPC分类号： H01J17/16 , H01L33/00
CPC分类号： H05K5/061
摘要： A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.
摘要翻译：密封壳包括第一板，第二板和设置在第一板和第二板之间以形成内部空间的框架。第一接合部设置在框架和第一板之间，以将框架和第一板彼此接合，并且第一邻接部分设置在框架和第一板之间，并且位于比第一板更接近内部空间的位置粘接部分。第二接合部设置在框架和第二板之间，以将框架和第二板彼此接合，并且第二抵接部分设置在框架和第二板之间，并且定位成比第二接合更靠近内部空间部分。第二接合部位于比第一接合部更靠近内部空间的位置。

7. 发明授权

US06962516B2 Voltage applying apparatus, and apparatus and method for manufacturing electron source 失效
标题翻译：电压施加装置，以及用于制造电子源的装置和方法
公开(公告)号：US06962516B2
公开(公告)日：2005-11-08
申请号：US10236983
申请日：2002-09-09
申请人： Kazuhiro Ohki , Shigeto Kamata , Akihiro Kimura
发明人： Kazuhiro Ohki , Shigeto Kamata , Akihiro Kimura
IPC分类号： H01J9/44 , H01J9/02 , H01J9/39 , H01J9/00 , H01J9/42
CPC分类号： H01J9/025 , H01J9/027
摘要： A voltage applying apparatus including a holder, a probe and the like as voltage applying means enabling the application of a voltage to electrode wiring connected with electric conductors formed on a substrate on which the electrode wiring is formed. The apparatus is equipped with aligning means making the position of the probe follow to the changes of the position of the electrode wiring to coincide with them. The aligning means makes the position of the probe follow the position of the electrode wiring so that the probe aligns the electrode wiring by the thermal expansion of the holder.
摘要翻译：一种电压施加装置，包括保持器，探针等作为电压施加装置，其能够施加与形成在其上形成有电极布线的基板上的电导体连接的电极布线的电压。该装置配备有对准装置，使得探针的位置跟随电极布线的位置的变化与它们重合。对准装置使探针的位置跟随电极布线的位置，使得探针通过保持器的热膨胀来对准电极布线。

8. 发明申请

US20050074230A1 Thermal treatment equipment, thermal treatment method and manufacturing method of image display apparatus 有权
标题翻译：热处理设备，图像显示装置的热处理方法和制造方法
公开(公告)号：US20050074230A1
公开(公告)日：2005-04-07
申请号：US10944760
申请日：2004-09-21
申请人： Shigeto Kamata , Akihiro Kimura
发明人： Shigeto Kamata , Akihiro Kimura
IPC分类号： H01L21/00 , B05D5/12 , F21V7/00 , G02B17/00
CPC分类号： H01L21/67109
摘要： In an apparatus for performing heating treatment of a structure composed of a substrate and a structure arranged on the front surface of the substrate, the latter structure having thermal capacity smaller than that of the substrate, heaters are arranged to be opposed to the front surface and the back surface of the substrate, respectively, and a cooling body is arranged at a position opposed to the back surface of the substrate to sandwich the heater of the back surface between the cooling body and the substrate. Thereby, the heating and the cooling of the substrate are performed rapidly to shorten the time of a heating process, and the deformation and the damage of the substrate at the time of heating are prevented.
摘要翻译：在用于对由基板和布置在基板的前表面上的结构构成的结构进行加热处理的装置中，后者结构的热容量小于基板的热容量，加热器布置成与前表面相对，基板的背面和冷却体配置在与基板的背面相对的位置，将背面的加热器夹在冷却体与基板之间。因此，快速地进行基板的加热和冷却，缩短加热处理的时间，并且防止加热时的基板的变形和损坏。

9. 发明申请

US20050029243A1 Method of effecting heating and cooling in reduced pressure atmosphere 有权
标题翻译：在减压气氛中进行加热和冷却的方法
公开(公告)号：US20050029243A1
公开(公告)日：2005-02-10
申请号：US10912141
申请日：2004-08-06
申请人： Shigeto Kamata , Akihiro Kimura
发明人： Shigeto Kamata , Akihiro Kimura
IPC分类号： F27B5/14 , F27B17/00 , F27D9/00 , F27D19/00 , F27D99/00
CPC分类号： F27D99/0001 , F27B17/0016 , F27D9/00 , F27D19/00
摘要： The present invention provides a method of effecting high temperature vacuum heating and cooling suitable for conducting heat treatment to be performed on components used in a display apparatus. The present invention's heating/cooling method comprises the steps of: heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member; and cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function. In one aspect of the present invention, the cooling plate is designed to have a emissivity of not less than 0.50 but not more than 0.80 so as to minimizes a sum of a requisite time for the heating step and a requisite time for the cooling step. In another aspect of the present invention, the plate-like member to be heated has two main surfaces differing from each in an in-plane distribution of emissivity and the heating means is opposed to one of the two main surfaces, which has a smaller distribution ratio, thereby realizing uniform and efficient heating/cooling.
摘要翻译：本发明提供一种实现对在显示装置中使用的部件进行热处理的高温真空加热和冷却的方法。本发明的加热/冷却方法包括以下步骤：通过与板状部件相对的加热装置将设置在减压气氛中的板状部件加热到室内; 并且通过与板状构件相对的冷却板将板状构件冷却，其间具有加热装置，冷却板具有热反射功能。在本发明的一个方面，冷却板被设计为具有不小于0.50但不大于0.80的发射率，以使加热步骤的必要时间和冷却步骤的必要时间之和最小化。在本发明的另一方面，待加热的板状构件具有两个主表面，每个在发射率的面内分布中各自不同，并且加热装置与两个主表面中的一个相对，分布较小比例，从而实现均匀有效的加热/冷却。

10. 发明授权

US07972461B2 Hermetically sealed container and manufacturing method of image forming apparatus using the same 失效
标题翻译：密封容器及使用其的成像装置的制造方法
公开(公告)号：US07972461B2
公开(公告)日：2011-07-05
申请号：US12136181
申请日：2008-06-10
申请人： Mitsutoshi Hasegawa , Kazuo Koyanagi , Masahiro Tagawa , Nobuhiro Ito , Yasuo Ohashi , Shigeto Kamata
发明人： Mitsutoshi Hasegawa , Kazuo Koyanagi , Masahiro Tagawa , Nobuhiro Ito , Yasuo Ohashi , Shigeto Kamata
IPC分类号： B32B37/12
CPC分类号： H01J9/261 , B23K1/0056 , Y10T156/10
摘要： A manufacturing method of a hermetically sealed container, comprises steps of placing, on a first member, a first bonding material and a second bonding material having a larger compressibility in relation to a pressing force than a compressibility of the first bonding material, such that the first and second bonding materials are arranged side-to-side relationship, and the first bonding material has a height lower than a height of the second bonding material; pressing a second member to the second bonding material; heating and melting sequentially part by part the first bonding material; and cooling the first bonding material to bond together the first and second members.
摘要翻译：一种气密密封容器的制造方法，包括以下步骤：在第一构件上，相对于第一接合材料的压缩性，将与第一接合材料的压制力相比具有较大压缩性的第一接合材料和第二接合材料放置，第一接合材料和第二接合材料的侧面对侧配置，第一接合材料的高度低于第二接合材料的高度; 将第二构件按压到所述第二接合材料; 依次逐个加热和熔化第一粘合材料; 以及冷却所述第一接合材料以将所述第一和第二构件结合在一起。

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