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1. 发明申请

US20130200784A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20130200784A1
公开(公告)日：2013-08-08
申请号：US12294850
申请日：2007-03-28
申请人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
发明人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
IPC分类号： H05B33/02 , F21V13/04
CPC分类号： H05B33/02 , F21V13/04 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/83385 , H01L2224/83951
摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).
摘要翻译：为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1），安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件），其设置在透明构件（3）上。在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u））。

2. 发明申请

US20090296367A1 Package For Light-Emitting Device, Light-Emitting Apparatus, and Illuminating Apparatus 有权
标题翻译：发光装置，发光装置和照明装置的封装
公开(公告)号：US20090296367A1
公开(公告)日：2009-12-03
申请号：US11909592
申请日：2006-03-23
申请人： Fumiaki Sekine , Daisuke Sakumoto , Yuki Mori , Mitsuo Yanagisawa , Shingo Matsuura
发明人： Fumiaki Sekine , Daisuke Sakumoto , Yuki Mori , Mitsuo Yanagisawa , Shingo Matsuura
IPC分类号： F21V9/16 , F21V7/00
CPC分类号： H01L33/60 , H01L33/62 , H01L2224/16
摘要： A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.
摘要翻译：一种包装体，包括具有用于安装发光装置的安装部的基体，安装在基体的上表面的框状的第一反射构件，其内周面成形为第一光反射面，围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件，其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间，围绕第一反射构件的周边表面，并且在第一反射构件的上端上方的位置具有第二光反射表面。

3. 发明授权

US08710737B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US08710737B2
公开(公告)日：2014-04-29
申请号：US12294850
申请日：2007-03-28
申请人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
发明人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
IPC分类号： H01J1/62
CPC分类号： H05B33/02 , F21V13/04 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/83385 , H01L2224/83951
摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).
摘要翻译：为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1），安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件），其设置在透明构件（3）上。在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u））。

4. 发明申请

US20110084295A1 Light Emitting Device 失效
标题翻译：发光装置
公开(公告)号：US20110084295A1
公开(公告)日：2011-04-14
申请号：US12810487
申请日：2008-12-25
申请人： Shingo Matsuura , Daisuke Sakumoto
发明人： Shingo Matsuura , Daisuke Sakumoto
IPC分类号： H01L33/50 , H01L33/54
CPC分类号： H01L33/60 , H01L33/507 , H01L33/54 , H01L33/642 , H01L2224/14 , H01L2224/16225
摘要： A light emitting device includes a light emitting element, a base, and a transparent layer. The base has an upper side portion including a first portion and a second portion. The first portion includes a mounting region of the light emitting element, and has a first porosity. The second portion surrounds the first portion, includes a plurality of transparent particles, and has a second porosity larger than the first porosity. The light transmitting layer encapsulates the light emitting element, and is attached to the first portion in a state where the transparent layer is apart from the second portion.
摘要翻译：发光器件包括发光元件，基底和透明层。底座具有包括第一部分和第二部分的上侧部分。第一部分包括发光元件的安装区域，并且具有第一孔隙率。第二部分围绕第一部分，包括多个透明颗粒，并且具有大于第一孔隙率的第二孔隙率。透光层封装发光元件，并且在透明层与第二部分分离的状态下附着到第一部分。

5. 发明申请

US20090152580A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20090152580A1
公开(公告)日：2009-06-18
申请号：US12056893
申请日：2008-03-27
申请人： Shingo Matsuura , Mitsuo Yanagisawa , Daisuke Sakumoto
发明人： Shingo Matsuura , Mitsuo Yanagisawa , Daisuke Sakumoto
IPC分类号： H01L33/00 , H01L21/02
CPC分类号： H01L33/54 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/00012
摘要： A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.
摘要翻译：发光芯片包括基底，透明材料层和发光芯片。底座具有包括导电图案的上表面。透明材料层设置在基座的上表面上，并且具有位于导电图案的至少一部分的区域上的开口部。发光芯片安装在导电图案上并且位于透明材料层的开口部分中。

6. 发明授权

US08384119B2 Light emitting device 失效
标题翻译：发光装置
公开(公告)号：US08384119B2
公开(公告)日：2013-02-26
申请号：US12810487
申请日：2008-12-25
申请人： Shingo Matsuura , Daisuke Sakumoto
发明人： Shingo Matsuura , Daisuke Sakumoto
IPC分类号： H01L33/48
CPC分类号： H01L33/60 , H01L33/507 , H01L33/54 , H01L33/642 , H01L2224/14 , H01L2224/16225
摘要： A light emitting device includes a light emitting element, a base, and a transparent layer. The base has an upper side portion including a first portion and a second portion. The first portion includes a mounting region of the light emitting element, and has a first porosity. The second portion surrounds the first portion, includes a plurality of transparent particles, and has a second porosity larger than the first porosity. The light transmitting layer encapsulates the light emitting element, and is attached to the first portion in a state where the transparent layer is apart from the second portion.
摘要翻译：发光器件包括发光元件，基底和透明层。底座具有包括第一部分和第二部分的上侧部分。第一部分包括发光元件的安装区域，并且具有第一孔隙率。第二部分围绕第一部分，包括多个透明颗粒，并且具有大于第一孔隙率的第二孔隙率。透光层封装发光元件，并且在透明层与第二部分分离的状态下附着到第一部分。

7. 发明授权

US07994528B2 Light emitting device and method for manufacturing the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US07994528B2
公开(公告)日：2011-08-09
申请号：US12056893
申请日：2008-03-27
申请人： Shingo Matsuura , Mitsuo Yanagisawa , Daisuke Sakumoto
发明人： Shingo Matsuura , Mitsuo Yanagisawa , Daisuke Sakumoto
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/00012
摘要： A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.
摘要翻译：发光芯片包括基底，透明材料层和发光芯片。底座具有包括导电图案的上表面。透明材料层设置在基座的上表面上，并且具有位于导电图案的至少一部分的区域上的开口部。发光芯片安装在导电图案上并且位于透明材料层的开口部分中。

8. 发明授权

US08029152B2 Package for light-emitting device, light-emitting apparatus, and illuminating apparatus 有权
标题翻译：发光装置，发光装置和照明装置的封装
公开(公告)号：US08029152B2
公开(公告)日：2011-10-04
申请号：US11909592
申请日：2006-03-23
申请人： Fumiaki Sekine , Daisuke Sakumoto , Yuki Mori , Mitsuo Yanagisawa , Shingo Matsuura
发明人： Fumiaki Sekine , Daisuke Sakumoto , Yuki Mori , Mitsuo Yanagisawa , Shingo Matsuura
IPC分类号： F21V9/16
CPC分类号： H01L33/60 , H01L33/62 , H01L2224/16
摘要： A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.
摘要翻译：一种包装体，包括具有用于安装发光装置的安装部的基体，安装在基体的上表面的框状的第一反射构件，其内周面成形为第一光反射面，围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件，其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间，围绕第一反射构件的周边表面，并且在第一反射构件的上端上方的位置具有第二光反射表面。

9. 发明申请

US20050133808A1 Package for housing light-emitting element, light-emitting apparatus and illumination apparatus 审中-公开
标题翻译：发光元件用包装体，发光装置和照明装置
公开(公告)号：US20050133808A1
公开(公告)日：2005-06-23
申请号：US10978302
申请日：2004-10-29
申请人： Mitsugu Uraya , Daisuke Sakumoto , Akira Miyake , Fumiaki Sekine , Yuki Mori , Mitsuo Yanagisawa , Hiroshi Shibayama , Shingo Matsuura
发明人： Mitsugu Uraya , Daisuke Sakumoto , Akira Miyake , Fumiaki Sekine , Yuki Mori , Mitsuo Yanagisawa , Hiroshi Shibayama , Shingo Matsuura
IPC分类号： H01L33/38 , H01L33/48 , H01L33/50 , H01L33/60 , H01L33/62 , H01L33/00
CPC分类号： H01L33/486 , B41J2/455 , H01L33/508 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/1815 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 μm.
摘要翻译：发光装置提供陶瓷制的基体，框体，发光元件，导体层和透光构件。基体在其上表面上具有用于发光元件的安装部分。框架体以围绕安装部的方式与基体的上表面接合，其内周面形成为反射面。布线导体的一端形成在基体的上表面上并与发光元件电连接，另一端被引导到基体的侧面或下表面。透光构件设置在框体内，以覆盖包含用于进行波长转换的荧光材料的发光元件。基体的设计使得陶瓷晶粒的平均粒径范围为1〜5μm。

10. 发明申请

US20090295265A1 Light Emitting Device and Illumination Apparatus 有权
标题翻译：发光装置和照明装置
公开(公告)号：US20090295265A1
公开(公告)日：2009-12-03
申请号：US11721807
申请日：2005-07-27
申请人： Tomoya Tabuchi , Akira Miyake , Daisuke Sakumoto
发明人： Tomoya Tabuchi , Akira Miyake , Daisuke Sakumoto
IPC分类号： F21V13/08
CPC分类号： H01L33/56 , H01L33/507 , H01L2224/13
摘要： A light emitting device includes a base on which a wiring conductor is formed from the top surface to the bottom surface or the side face; a light emitting chip mounted on the top surface of the base and electrically connected with the wiring conductor; a first light transmitting member which covers the light emitting chip; a second light transmitting member provided above the first light transmitting member to cover the first light transmitting member, the second light transmitting member being formed of a light transmitting material containing fluorescent materials for converting in wavelength the light emitted from the light emitting chip; and a third light transmitting member provided between the first and second light transmitting members, wherein the refractive index n1 of the first light transmitting member, the refractive index n2 of the second light transmitting member and the refractive index n3 of the third light transmitting member satisfy the relation: n3
摘要翻译：发光器件包括从顶表面到底表面或侧面形成布线导体的基底; 发光芯片安装在基座的顶表面上并与布线导体电连接; 覆盖发光芯片的第一透光构件; 第二透光构件，设置在第一透光构件上方以覆盖第一透光构件，第二透光构件由包含荧光材料的透光材料形成，用于使波长从发光芯片发射的光转换; 以及第三透光构件，设置在第一透光构件和第二透光构件之间，其中第一透光构件的折射率n1，第二透光构件的折射率n2和第三透光构件的折射率n3满足关系：n3

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