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1. 发明申请

US20050141826A1 Package for housing optical semiconductor element and optical semiconductor apparatus 失效
标题翻译：外壳光半导体元件和光半导体器件封装
公开(公告)号：US20050141826A1
公开(公告)日：2005-06-30
申请号：US10977557
申请日：2004-10-29
申请人： Akiko Matsuzaki , Hiroshi Shibayama
发明人： Akiko Matsuzaki , Hiroshi Shibayama
IPC分类号： H01L23/02 , G02B6/42 , H01L31/0203 , H01S5/022 , G02B6/36
CPC分类号： H01L31/0203 , G02B6/4202 , H01L2224/48091 , H01L2924/3011 , H01S5/02212 , H01S5/02284 , H01L2924/00014 , H01L2924/00
摘要： Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.
摘要翻译：提供一种用于容纳光学半导体元件的封装，包括：金属制的基体; 金属制的盖体; 透光构件; 以及连接到基体的上主表面以便覆盖通孔的输入/输出端子。输入/输出端子包括：电介质制造的第一板部分; 从一个基体侧边缘延伸到另一边缘的线路导体; 电介质制造的第二板部分，其与其第一板部分齐平的一个基体侧端面堆叠; 制成高于第一板部并与其一个基体侧端面堆叠的金属板与第一板部齐平; 以及引线端子，其连接到位于所述通孔内部的所述输入/输出端子的下表面并电连接到所述线路导体。

2. 发明授权

US4338077A Method for controlling temperature of multi-zone heating furnace 失效
标题翻译：多区加热炉温度控制方法
公开(公告)号：US4338077A
公开(公告)日：1982-07-06
申请号：US210830
申请日：1980-11-26
申请人： Hiroshi Shibayama , Shinya Tanifuji , Yasuo Morooka , Kozo Nakai , Nobuyuki Togashi
发明人： Hiroshi Shibayama , Shinya Tanifuji , Yasuo Morooka , Kozo Nakai , Nobuyuki Togashi
IPC分类号： C21D1/52 , C21D9/00 , C21D11/00 , F27B9/40 , F27D19/00 , G05D23/00 , G05D23/20 , F27D3/00
CPC分类号： C21D11/00 , C21D9/0081 , F27B9/40 , G05D23/1917 , G05D23/20 , F27D2019/0018 , F27D2019/004
摘要： This invention relates to a method of controlling the temperature of a heating furnace which has at least one furnace zone capable of being controlled by heating means and which conveys materials to be heated, that are introduced thereinto, by conveyor means such as a walking beam or a pusher so that the materials are heated to a predetermined temperature until they are withdrawn from the discharge side.More specifically, the present invention relates to a method of controlling set furnace zone temperature of the heating furnace when the materials to be heated, that are introduced into the heating furnace, have different temperature elevation patterns. The method of the invention is specifically characterized in that the predetermined set temperatures of each zone is used when the temperature elevation patterns of slabs are different with each other. The invention is directed to minimize the idle time inside the furnace when the materials having different temperature elevation patterns are sequentially introduced into the furnace, in order to conserve energy. The method is especially effective when the cold and hot materials are introduced into the furnace.
摘要翻译：本发明涉及一种控制加热炉温度的方法，该加热炉具有至少一个能够由加热装置控制的炉区，并且通过输送装置（例如步进梁或输送装置）传送待加热材料，推动器，使得材料被加热到预定温度，直到它们从排出侧排出。更具体地，本发明涉及当被加热的材料被引入加热炉中时具有不同的温度升高图案的方法来控制加热炉的设定炉区温度。本发明的方法的特征在于，当板坯的温度升高图案彼此不同时，使用每个区域的预定设定温度。本发明旨在使具有不同温度升高图案的材料被顺序地引入炉中以最小化炉内的空闲时间，以便节约能量。当将冷和热的材料引入炉中时，该方法特别有效。

3. 发明授权

US07165899B2 Package for housing optical semiconductor element and optical semiconductor apparatus 失效
标题翻译：外壳光半导体元件和光半导体器件封装
公开(公告)号：US07165899B2
公开(公告)日：2007-01-23
申请号：US10977557
申请日：2004-10-29
申请人： Akiko Matsuzaki , Hiroshi Shibayama
发明人： Akiko Matsuzaki , Hiroshi Shibayama
IPC分类号： G02B6/36
CPC分类号： H01L31/0203 , G02B6/4202 , H01L2224/48091 , H01L2924/3011 , H01S5/02212 , H01S5/02284 , H01L2924/00014 , H01L2924/00
摘要： Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.
摘要翻译：提供一种用于容纳光学半导体元件的封装，包括：金属制的基体; 金属制的盖体; 透光构件; 以及连接到基体的上主表面以便覆盖通孔的输入/输出端子。输入/输出端子包括：电介质制造的第一板部分; 从一个基体侧边缘延伸到另一边缘的线路导体; 电介质制造的第二板部分，其与其第一板部分齐平的一个基体侧端面堆叠; 制成高于第一板部并与其一个基体侧端面堆叠的金属板与第一板部齐平; 以及引线端子，其连接到位于所述通孔内部的所述输入/输出端子的下表面并电连接到所述线路导体。

4. 发明申请

US20050133808A1 Package for housing light-emitting element, light-emitting apparatus and illumination apparatus 审中-公开
标题翻译：发光元件用包装体，发光装置和照明装置
公开(公告)号：US20050133808A1
公开(公告)日：2005-06-23
申请号：US10978302
申请日：2004-10-29
申请人： Mitsugu Uraya , Daisuke Sakumoto , Akira Miyake , Fumiaki Sekine , Yuki Mori , Mitsuo Yanagisawa , Hiroshi Shibayama , Shingo Matsuura
发明人： Mitsugu Uraya , Daisuke Sakumoto , Akira Miyake , Fumiaki Sekine , Yuki Mori , Mitsuo Yanagisawa , Hiroshi Shibayama , Shingo Matsuura
IPC分类号： H01L33/38 , H01L33/48 , H01L33/50 , H01L33/60 , H01L33/62 , H01L33/00
CPC分类号： H01L33/486 , B41J2/455 , H01L33/508 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/1815 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 μm.
摘要翻译：发光装置提供陶瓷制的基体，框体，发光元件，导体层和透光构件。基体在其上表面上具有用于发光元件的安装部分。框架体以围绕安装部的方式与基体的上表面接合，其内周面形成为反射面。布线导体的一端形成在基体的上表面上并与发光元件电连接，另一端被引导到基体的侧面或下表面。透光构件设置在框体内，以覆盖包含用于进行波长转换的荧光材料的发光元件。基体的设计使得陶瓷晶粒的平均粒径范围为1〜5μm。

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