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1. 发明专利

JP2014095051A Thermosetting epoxy resin composition, reflector for led using the composition, and led device 审中-公开
标题翻译：热固性环氧树脂组合物，使用组合物的LED的反射器和LED器件
公开(公告)号：JP2014095051A
公开(公告)日：2014-05-22
申请号：JP2012248346
申请日：2012-11-12
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： FUKUI KENJI , TSUTSUMI YOSHIHIRO , AOKI TAKAYUKI
IPC分类号： C08G59/42 , C08K3/00 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition giving a set matter maintaining heat resistance and light resistance and having a reduced yellowing change, and also having high strength and high toughness using an epoxy resin and an acid anhydride setting agent, a reflector for LED formed with the composition, and an LED apparatus.SOLUTION: Provided is a thermosetting epoxy resin composition comprising: (A) an epoxy resin; (B) a setting agent; (C) a setting catalyst; and (D) an inorganic filler (wherein, the amount of the (D) component is 50 to 1,100 pts.mass to 100 pts.mass of the total of the (A) component and the (B) component), and, as the setting agent in the (B) component, acid anhydride represented by the general formula (1) is included.
摘要翻译：要解决的问题：为了提供一种提供保持耐热性和耐光性并且具有减少的黄变的凝固物并且还使用环氧树脂和酸酐固化剂也具有高强度和高韧性的热固性树脂组合物， LED组成的LED和LED装置。解决方案：提供一种热固性环氧树脂组合物，其包含：（A）环氧树脂; （B）定型剂; （C）固化催化剂; 和（D）无机填料（其中，（D）成分的量为（A）成分和（B）成分的总量的50〜1100重量份〜100重量份），作为包括（B）成分中的固化剂，由通式（1）表示的酸酐。

2. 发明专利

JP2003026764A Epoxy resin composition for semiconductor sealing and semiconductor device 有权
标题翻译：环氧树脂组合物用于半导体密封和半导体器件
公开(公告)号：JP2003026764A
公开(公告)日：2003-01-29
申请号：JP2001216735
申请日：2001-07-17
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KIMURA YASUO , TOMIYOSHI KAZUTOSHI , AOKI TAKAYUKI , ASANO HIDEKAZU , SHIMODA TARO , SHIOBARA TOSHIO
IPC分类号： C08K9/02 , C08G59/20 , C08G59/62 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in workability and fluidity and gives a lead-free cured item excellent in flame retardancy and solder crack resistance even when a halogenated epoxy resin and an antimony compound are not contained.
SOLUTION: This epoxy resin composition essentially contains (A) a modified epoxy resin prepared by glycidylating a mixture of 4,4'-biphenol and a phenol resin represented by formula (1), (B) a phenol resin represented by formula (1) and/or a phenol resin represented by formula (2), (C) a cure accelerator, and (D) an inorganic filler.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种半导体密封用的环氧树脂组合物，其加工性和流动性优异，并且即使不含卤化环氧树脂和锑化合物，也能够提供阻燃性和耐焊料龟裂性优异的无铅固化物质。解决方案：该环氧树脂组合物基本上含有（A）通过将由式（1）表示的4,4'-联苯酚和酚醛树脂的混合物缩水化而制备的改性环氧树脂，（B）由式（1）表示的酚醛树脂，和/或由式（2）表示的酚醛树脂，（C）固化促进剂和（D）无机填料。

3. 发明专利

JP2005132948A Epoxy resin composition and semiconductor device 有权
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：JP2005132948A
公开(公告)日：2005-05-26
申请号：JP2003370119
申请日：2003-10-30
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： OSADA MASAKAZU , AOKI TAKAYUKI , SHIMODA TARO
IPC分类号： C08K3/00 , C08G59/62 , C08K5/00 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving a highly reliable semiconductor device causing no poor conduction when undergoing a burn-in test, and to provide the semiconductor device sealed with the cured product of the composition. SOLUTION: The epoxy resin composition for sealing semiconductors essentially comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, (D) a curing promoter and (E) a releasant. In this composition, aldehyde-, ketone- or carboxylic acid-derived gas components generated when the cured product of this composition is heated at 125°C for 60 min are 1,000 ng or less per 1 g of the cured product. The semiconductor device sealed with the cured product of this composition can be highly reliable without causing poor conduction when undergoing a burn-in test. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种环氧树脂组合物，当进行老化试验时，提供高度可靠的半导体器件，导致不良导通，并提供用该组合物的固化产物密封的半导体器件。解决方案：用于密封半导体的环氧树脂组合物基本上包含（A）环氧树脂，（B）固化剂，（C）无机填料，（D）固化促进剂和（E）还原剂。在该组合物中，当该组合物的固化产物在125℃下加热60分钟时产生的醛，酮或羧酸衍生气体组分每1g固化产物为1,000ng或更少。用该组合物的固化产物密封的半导体器件可以高度可靠，而在经历老化试验时不会导致不良的导电。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2003026779A Epoxy resin composition for semiconductor sealing and semiconductor device 审中-公开
标题翻译：环氧树脂组合物用于半导体密封和半导体器件
公开(公告)号：JP2003026779A
公开(公告)日：2003-01-29
申请号：JP2001216748
申请日：2001-07-17
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KIMURA YASUO , TOMIYOSHI KAZUTOSHI , SHIMODA TARO , ASANO HIDEKAZU , AOKI TAKAYUKI , SHIOBARA TOSHIO
IPC分类号： C08K3/00 , C08G59/62 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is lead-free, is useful as an environmental protection measure, and gives a cured item excellent in solder crack resistance and flame retardancy even when it does not contain a halogenated epoxy resin and an antimony trioxide compound.
SOLUTION: This epoxy resin composition contains (A) an epoxy resin which has an epoxy equivalent of 185 or higher and a molecular backbone structure containing at least one structure wherein two benzene rings can be directly conjugated with each other and of which at least 50% of the carbon atoms have an SP
2 -type atomic orbital, (B) a phenol resin represented by formula (1) (wherein R
1 is H or a 1-4C alkyl; and n is a natural number of 1-15), (C) a cure accelerator, and (D) an inorganic filler.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供无铅的半导体密封用环氧树脂组合物，作为环境保护措施是有用的，即使不含有卤化环氧树脂，也具有优异的耐焊锡裂纹性和阻燃性的固化物树脂和三氧化锑化合物。解决方案：该环氧树脂组合物含有（A）环氧当量为185或更高的环氧树脂和至少含有一个结构的分子骨架结构，其中两个苯环可以彼此直接共轭，并且其中至少50％的碳原子具有SP 2原子轨道，（B）由式（1）表示的酚醛树脂（其中R 1是H或1-4C烷基; n是1的自然数） -15），（C）固化促进剂，（D）无机填料。

5. 发明专利

JP2009024185A Method for producing thermosetting epoxy resin composition 有权
标题翻译：生产热固性环氧树脂组合物的方法
公开(公告)号：JP2009024185A
公开(公告)日：2009-02-05
申请号：JP2008286371
申请日：2008-11-07
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： AOKI TAKAYUKI , SHIOBARA TOSHIO
IPC分类号： C08G59/42 , C08J3/12
CPC分类号： C08G59/42 , C08G59/3245 , C08L63/00 , H01L23/293 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , Y10T428/239 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition which has an excellent hardening property and good strength and keeps heat resistance and light resistance over a long period of time and from which a uniformly hardened material hardly turning yellow is obtained and to provide semiconductor-electronic equipment apparatus having a light receiving element such as a photocoupler, which is useful particularly industrially and is sealed by the hardened material of this thermosetting epoxy resin composition. SOLUTION: The method for producing the thermosetting epoxy resin composition comprises the steps of: reacting (A) a triazine derivative/epoxy resin with (B) an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups; pulverizing the obtained reaction solid matter; and blending the pulverized material as a resin component. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决问题的方法：提供一种具有优异的硬化性能和良好强度并且长时间保持耐热性和耐光性并且均匀硬化的材料几乎不变黄的热固性环氧树脂组合物，提供具有光电耦合器等光接收元件的半导体电子设备装置，其特别在工业上有用，并被该热固性环氧树脂组合物的硬化材料密封。＆lt; P＆gt;解决方案：热固性环氧树脂组合物的制造方法包括以下步骤：使（A）三嗪衍生物/环氧树脂与（B）酸酐以使环氧基的量为0.6〜 2.0当量酸酐基团; 粉碎所得反应固体物质; 并将粉碎材料作为树脂成分混合。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2007231252A Epoxy resin composition for sealing semiconductor and semiconductor-device sealed by the same 审中-公开
标题翻译：用于密封半导体的环氧树脂组合物及其密封的半导体器件
公开(公告)号：JP2007231252A
公开(公告)日：2007-09-13
申请号：JP2007016102
申请日：2007-01-26
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： OSADA MASAKAZU , AOKI TAKAYUKI
IPC分类号： C08G59/20 , H01L23/29 , H01L23/31
CPC分类号： C08G59/38 , C08G59/621 , C08L63/00 , H01L23/293 , H01L23/295 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition having satisfactory moldability by which a semiconductor device can be sealed without causing warpage. SOLUTION: This epoxy resin composition comprises: (A) an epoxy resin having at least three epoxy groups in one molecule thereof and having an epoxy equivalent of 170 or less; (B) an epoxy resin having one diphenol core and two epoxy groups in one molecule thereof, in an amount in a mass ratio to (A) an epoxy resin of 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxy groups contained in the phenolic curing agent relative to one mole of epoxy groups contained in the whole composition is 0.5 to 1.5; and (D) an inorganic filler in an amount of 86 to 92% by mass, based on the total mass of the whole composition. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有令人满意的成型性的环氧树脂组合物，通过该环氧树脂组合物可以密封半导体器件而不引起翘曲。该环氧树脂组合物包含：（A）在其一分子中具有至少三个环氧基并具有170或更小的环氧当量的环氧树脂; （B）在一分子中具有一个二酚核心和两个环氧基团的环氧树脂的量与（A）环氧树脂的质量比为35/65至65/35; （C）酚醛固化剂，其量使酚醛固化剂中所含的酚羟基与全部组合物中所含的1摩尔环氧基的摩尔比为0.5〜1.5; 和（D）相对于整个组合物的总质量为86〜92质量％的无机填料。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007063549A Epoxy resin composition and semiconductor device 有权
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：JP2007063549A
公开(公告)日：2007-03-15
申请号：JP2006212280
申请日：2006-08-03
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： AOKI TAKAYUKI , SHIOBARA TOSHIO
IPC分类号： C08G59/40 , C08K3/00 , C08K5/00 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/621 , C08K5/54 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reliability in that the cured composition with which a semiconductor device is encapsulated restrains corrosion of copper wiring, migration of copper, and formation of intermetallic compounds at the joint between aluminum and gold, and to provide a semiconductor device encapsulated with a cured product of the composition. SOLUTION: The invention relates to the epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a cure accelerator, (E) an adhesion promoter, and (F) a metal oxide, wherein the metal oxide (F) is a combination of (a) a magnesium-aluminum ion exchanger, (b) a hydrotalcite ion exchanger, and (c) a rare earth oxide in a ratio of (a):(b):(c)=0.5-20:0.5-20:0.01-10 pts by mass, relative to 100 pts by mass of the epoxy resin (A) and curing agent (B) combined, and the invention relates to the semiconductor device comprising a semiconductor element encapsulated with a cured product of the composition. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供可靠性优异的环氧树脂组合物，其中封装有半导体器件的固化组合物抑制铜布线的腐蚀，铜迁移和在铝和铝之间的接合处形成金属间化合物金，并提供封装有组合物的固化产物的半导体器件。本发明涉及环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料，（D）固化促进剂，（E）粘合促进剂，和（F）金属氧化物，其中所述金属氧化物（F）是（a）镁 - 铝离子交换剂，（b）水滑石离子交换剂和（c）稀土氧化物的组合，相对于100质量份的环氧树脂（A）和固化剂（B）的组合，（a）:( b）：（c）= 0.5〜20：0.5〜20：0.01-10质量份，本发明涉及包含用该组合物的固化产物包封的半导体元件的半导体器件。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2008189833A Thermosetting epoxy resin composition and semiconductor apparatus 审中-公开
标题翻译：热固性环氧树脂组合物和半导体装置
公开(公告)号：JP2008189833A
公开(公告)日：2008-08-21
申请号：JP2007026659
申请日：2007-02-06
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： AOKI TAKAYUKI , IKEDA KAZUHARU
IPC分类号： C08L63/06 , C08G59/42 , C08K5/103 , H01L23/29 , H01L23/31 , H01L31/12
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting epoxy resin composition that provides a cured product keeping whiteness, heat resistance and light resistance for a long period of time and having uniformity and slight yellowing and has excellent moldability, especially mold release characteristics and to provide a semiconductor apparatus in which a semiconductor element (a light-emitting element such as an LED element, etc., is omitted and a photocoupler, in which a light-emitting element and a photodetector are integrated, is included) is sealed with the cured material of the composition. SOLUTION: The thermosetting epoxy resin composition comprises (A) a reaction product obtained by reacting a triazine derivative epoxy resin with an acid anhydride in the ratio of epoxy group equivalent/acid anhydride group equivalent of 0.6-2.0, (B) an internal mold release agent, (C) a reflecting member, (D) an inorganic filler and (E) a curing catalyst as essential components. The internal mold release agent of the component (B) comprises a component that is represented by formula (1): R 1 CH 2 -CHR 2 -CH 2 R 3 (wherein R 1 , R 2 , R 3 each is any of H, -OH, -OR and -OCOC a H b and at least one of them is -OCOC a H b ; R is C n H 2n+1 alkyl group; a is an integer of 10-30; and b is an integer of 17-61) and has a melting point of 50-90°C. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题的方法为获得长时间保持白度，耐热性和耐光性的固化产物并且具有均匀性和轻微变黄并且具有优异的成型性，特别是脱模特性的热固性环氧树脂组合物，为了提供半导体元件（省略了LED元件等的发光元件，并且包含发光元件和光电检测器的光电耦合器）的半导体装置被密封组合物的固化材料。解决方案：热固性环氧树脂组合物包含（A）通过使三嗪衍生物环氧树脂与酸酐以环氧当量/酸酐基当量为0.6-2.0的比例反应获得的反应产物，（B）内部脱模剂，（C）反射构件，（D）无机填料和（E）固化催化剂作为必要成分。组分（B）的内部脱模剂包含由式（1）表示的组分：R 1 SP 2 CH 2 S / >其中R 1 ，R 2 ，R 3 >各自为H，-OH，-OR和-OCOC a B 中的任一种，并且它们中的至少一个为-OCOC a 其中R为C ~~N 2n + 1 烷基; a为10-30的整数; b为整数17 -61），熔点为50-90℃。版权所有（C）2008，JPO＆INPIT~~

9. 发明专利

JP2008189827A Thermosetting epoxy resin composition and semiconductor apparatus 审中-公开
标题翻译：热固性环氧树脂组合物和半导体装置
公开(公告)号：JP2008189827A
公开(公告)日：2008-08-21
申请号：JP2007026508
申请日：2007-02-06
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： AOKI TAKAYUKI , IKEDA KAZUHARU
IPC分类号： C08L63/06 , C08G59/14 , C08K3/00 , C08K7/02 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To obtain a resin composition for providing a cured product having excellent molded article strength, toughness, especially thermal shock resistance and keeping heat resistance and light resistance for a long period of time and having uniformity and slight yellowing. SOLUTION: The thermosetting epoxy resin composition comprises (A) a reaction product obtained by reacting a triazine derivative epoxy resin with an acid anhydride in the ratio of epoxy group equivalent/acid anhydride group equivalent of 0.6-2.0, (B) a whisker-like fiber of inorganic substance, (C) a reflecting member, (D) an inorganic filler and (E) a curing catalyst as essential components. The component (B) contains 0.001-30 mass% based on the whole composition of a whisker-like fiber of inorganic substance having an average fiber diameter of 0.05-50 μm and an average fiber length of 1.0-1,000 μm. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：为了获得具有优异的模制品强度，韧性，特别是耐热冲击性并且长时间保持耐热性和耐光性并具有均匀性和轻微变黄的固化产物的树脂组合物。解决方案：热固性环氧树脂组合物包含（A）通过使三嗪衍生物环氧树脂与酸酐以环氧当量/酸酐基当量为0.6-2.0的比例反应获得的反应产物，（B）a 无机物的须状纤维，（C）反射构件，（D）无机填料和（E）固化催化剂作为必要成分。组分（B）基于平均纤维直径为0.05-50μm，平均纤维长度为1.0-1,000μm的无机物的须状纤维的整体组成为0.001-30质量％。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2006299249A Epoxy resin composition and semiconductor device 有权
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：JP2006299249A
公开(公告)日：2006-11-02
申请号：JP2006078565
申请日：2006-03-22
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KIMURA YASUO , AOKI TAKAYUKI , ASANO HIDEKAZU , SHIOBARA TOSHIO
IPC分类号： C08G59/62 , C08G59/20 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition good in fluidity and giving a cured product that has low coefficient of linear expansion, exhibits low hygroscopicity despite having high glass transition temperature and is also excellent in lead-free soldering crack resistance.
SOLUTION: The epoxy resin composition essentially comprises (A) an epoxy resin 175-210 in epoxy equivalent, containing (a) an epoxy resin having in one molecule at least one (substituted) naphthalene ring, (B) a phenolic resin having in one molecule at least one (substituted) naphthalene ring and (C) an inorganic filler. In this composition, the (substituted) naphthalene ring in the epoxy resin(a) is contained at 45-60 mass% in the total content of the epoxy resin(A).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了提供流动性好的环氧树脂组合物和具有低线膨胀系数的固化产物，尽管具有高的玻璃化转变温度，但是具有低的吸湿性，并且在无铅焊接裂纹性方面也是优异的。环氧树脂组合物基本上包含（A）环氧当量的环氧树脂175-210，其包含（a）在一分子中具有至少一个（取代的）萘环的环氧树脂，（B）酚醛树脂在一个分子中具有至少一个（取代的）萘环和（C）无机填料。在该组成中，环氧树脂（a）中的（取代）萘环的含量为环氧树脂（A）的总含量为45〜60质量％。版权所有（C）2007，JPO＆INPIT

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