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1. 发明授权

US06869908B2 Thermal recording material 失效
标题翻译：热敏记录材料
公开(公告)号：US06869908B2
公开(公告)日：2005-03-22
申请号：US10321821
申请日：2002-12-18
申请人： Shiki Ueki , Kazumori Minami
发明人： Shiki Ueki , Kazumori Minami
IPC分类号： B41M5/28 , B41M5/30 , B41M5/323 , B41M5/337 , B41M5/34
CPC分类号： B41M5/3375
摘要： The invention provides a thermal recording material, which includes at least one recording layer containing an electron donating dye precursor and an electron accepting compound, and additionally, the recording layer includes a polymerizable compound having an ethylenic unsaturated bond.
摘要翻译：本发明提供了一种热敏记录材料，其包括至少一个含有给电子染料前体和电子接受性化合物的记录层，此外，记录层包括具有烯属不饱和键的聚合性化合物。

2. 发明授权

US06703344B2 Thermal recording material 失效
标题翻译：热敏记录材料
公开(公告)号：US06703344B2
公开(公告)日：2004-03-09
申请号：US10173566
申请日：2002-06-18
申请人： Shiki Ueki , Kazumori Minami
发明人： Shiki Ueki , Kazumori Minami
IPC分类号： B41M530
CPC分类号： G03C1/52 , B41M5/287 , B41M5/3372
摘要： The invention provides a thermal recording material comprising a support and at least one thermal recording layer disposed on the support, wherein the layer comprises at least one electron-accepting compound, and microcapsules, which encapsulate an electron-donating dye precurser and are formed using a compound represented by the following general formula (I) and a compound represented by the following general formula Formula (II): wherein each of R1 and R2 represents an alkyl group; n is an integer selected from 0 to 3; and M represents Na, Mg, K or Ca.
摘要翻译：本发明提供一种热敏记录材料，其包括载体和设置在载体上的至少一个热记录层，其中所述层包含至少一种受电子化合物和微胶囊，其封装给电子染料前体并使用由以下通式（I）表示的化合物和由以下通式（II）表示的化合物：其中R 1和R 2各自表示烷基; n为0〜3的整数; M表示Na，Mg，K或Ca。

3. 发明申请

US20100273014A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF 审中-公开
标题翻译：金属剥离基材及其生产方法
公开(公告)号：US20100273014A1
公开(公告)日：2010-10-28
申请号：US12810762
申请日：2008-12-24
申请人： Shiki Ueki
发明人： Shiki Ueki
IPC分类号： B32B15/08 , B05D5/12
CPC分类号： H05K3/181 , H05K1/0373 , H05K2201/0236 , Y10T428/31678
摘要： A method for producing a metal-clad substrate, the method including: (a) forming, on a substrate, a resin layer containing a plating catalyst or a precursor thereof, which resin layer satisfies the following requirement 1; and (b) performing plating on the resin layer, Requirement 1: the resin layer contains the plating catalyst or a precursor thereof within a portion extending from a surface to a depth of 25 nm of the resin layer, in an amount in the range of 3×10−20 mol/nm3 to 30×10−20 mol/nm3 in terms of a content of a metal element thereof.
摘要翻译：一种金属包覆基板的制造方法，其特征在于，包括：（a）在基板上形成含有电镀催化剂或其前体的树脂层，所述树脂层满足以下要求1; （b）在树脂层上进行电镀，要素1：树脂层在从树脂层的表面延伸到深度25nm的部分内含有电镀催化剂或其前体，其量在 3×10-20mol / nm 3〜30×10〜20mol / nm 3。

4. 发明申请

US20100190029A1 METAL LAYER LAMINATE HAVING ROUGHENED METAL SURFACE LAYER AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：具有粗化金属表面层的金属层叠层及其制造方法
公开(公告)号：US20100190029A1
公开(公告)日：2010-07-29
申请号：US12666807
申请日：2008-06-09
申请人： Shiki Ueki
发明人： Shiki Ueki
IPC分类号： B32B5/00 , C25D5/56 , B05D5/12
CPC分类号： C23C2/04 , B32B15/08 , B32B15/20 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/32 , B32B27/36 , B32B27/38 , B32B27/42 , B32B2307/202 , B32B2307/206 , B32B2307/704 , B32B2457/08 , C23C28/00 , H05K3/181 , H05K3/384 , H05K3/386 , H05K2201/0179 , H05K2201/0358 , H05K2203/072 , Y10T428/12993
摘要： Provided are a metal layer laminate that includes a roughened metal surface layer having a surface profile capable of strongly adhering to resin materials even when the surface roughness is small, and a simple method for producing a metal layer laminate having good adhesion to resin materials such as a resin substrate for a metal layer and an insulating resin film formed on the surface of a metal wiring portion. The metal layer laminate includes a metal layer, a resin thin film, and a roughened metal surface layer, wherein the resin thin film and the roughened metal surface layer are formed on the surface of the metal layer, a fractal-shaped interface structure appears between the resin thin film and the roughened metal surface layer, when the metal layer laminate is cut in a normal direction, and the interface structure has a fractal dimension of 1.05 to 1.50 as calculated using a box counting method with the measurement object region being set to from 50 nm to 5 μm and the box size (pixel size) being set to 1/100 or less of the measurement object region. The metal layer laminate is obtained by a production method including the steps of forming a resin thin film on the surface of a metal layer and subjecting the resin thin film-carrying metal layer to a plating process.
摘要翻译：提供一种金属层叠体，其具有即使在表面粗糙度小的情况下也具有能够强烈地附着在树脂材料上的表面轮廓的粗糙金属表面层，以及与树脂材料（例如，用于金属层的树脂基板和形成在金属布线部分的表面上的绝缘树脂膜。金属层层叠体包括金属层，树脂薄膜和粗糙化的金属表面层，其中树脂薄膜和粗糙金属表面层形成在金属层的表面上，分形形状的界面结构出现在树脂薄膜和粗糙金属表面层，当金属层层压板沿正向切割时，并且界面结构的分形维数为1.05至1.50，使用盒计数方法计算，其中测量对象区域设置为从50nm到5μm，并且盒尺寸（像素尺寸）被设置为测量对象区域的1/100或更小。通过包括以下步骤的制造方法获得金属层层叠体：在金属层的表面上形成树脂薄膜，对树脂薄膜负载金属层进行电镀处理。

5. 发明授权

US06835692B2 Heat-sensitive recording material containing oxonol dye 失效
标题翻译：含有oxonol染料的热敏记录材料
公开(公告)号：US06835692B2
公开(公告)日：2004-12-28
申请号：US10678640
申请日：2003-10-06
申请人： Kimi Ikeda , Shiki Ueki
发明人： Kimi Ikeda , Shiki Ueki
IPC分类号： B41M520
CPC分类号： B41M5/3375 , B41M5/287 , B41M5/30
摘要： The present invention provides a heat-sensitive recording material having a support and a heat-sensitive recording layer, which contains a diazonium salt compound and a coupler compound that reacts with the diazonium salt to develop a color, wherein the recording material contains an oxonol dye.
摘要翻译：本发明提供一种具有支撑体和热敏记录层的热敏记录材料，其含有重氮盐化合物和与重氮盐反应产生颜色的成色剂化合物，其中记录材料含有氧杂菁染料。

6. 发明授权

US08076264B2 Conductive substance-adsorbing resin film, method for producing conductive substance-adsorbing resin film, metal layer-coated resin film using the same, and method for producing metal layer-coated resin film 有权
标题翻译：导电性物质吸附树脂膜，导电性物质吸附树脂膜的制造方法，使用该导电性物质吸附树脂膜的金属层被覆树脂膜以及金属层被覆树脂膜的制造方法
公开(公告)号：US08076264B2
公开(公告)日：2011-12-13
申请号：US12593922
申请日：2008-01-11
申请人： Mitsuyuki Tsurumi , Shiki Ueki
发明人： Mitsuyuki Tsurumi , Shiki Ueki
IPC分类号： B01J20/26 , B01J20/00 , B01J20/22
CPC分类号： H05K3/387 , C23C18/1641 , C23C18/1653 , C23C18/1658 , C23C18/206 , C23C18/208 , C23C18/2086 , C23C18/24 , C23C18/26 , C23C18/285 , C23C18/30 , C25D5/56 , H05K1/0393 , H05K3/105 , H05K3/426 , H05K2203/1105 , H05K2203/1157 , H05K2203/121 , Y10T156/1052 , Y10T156/1062
摘要： The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal. This conductive substance-adsorbing resin film is allowed to adsorb a metal and subjected to plating, whereby a metal layer-coated resin film can be obtained.
摘要翻译：本发明提供一种导电性物质吸附树脂膜，其中可以容易地形成其与树脂膜的粘附性优异并且在与树脂膜的界面处具有较小不均匀性的导电层，其制造方法，金属层 - 通过使用本发明的导电性物质吸附树脂膜可以容易地形成具有优异的与绝缘树脂膜的粘附性的高分辨率布线的涂布树脂膜，以及金属层涂覆树脂膜的制造方法这是能够容易地制造具有高清晰度布线的印刷电路板的材料。本发明还提供一种包含至少两个树脂层的导电物质吸附树脂膜，其中至少一个树脂层是具有吸附导电物质或金属的吸附树脂层。使该导电性物质吸附树脂膜吸附金属并进行电镀，由此可以得到金属层被覆的树脂膜。

7. 发明申请

US20100113264A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM 有权
标题翻译：导电性物质 - 吸附树脂膜，用于生产导电性物质 - 吸附树脂膜的方法，使用其的金属层涂覆树脂膜以及用于生产金属层涂树脂膜的方法
公开(公告)号：US20100113264A1
公开(公告)日：2010-05-06
申请号：US12593922
申请日：2008-01-11
申请人： Mitsuyuki Tsurumi , Shiki Ueki
发明人： Mitsuyuki Tsurumi , Shiki Ueki
IPC分类号： B01J20/26 , B32B37/14 , B32B38/04
CPC分类号： H05K3/387 , C23C18/1641 , C23C18/1653 , C23C18/1658 , C23C18/206 , C23C18/208 , C23C18/2086 , C23C18/24 , C23C18/26 , C23C18/285 , C23C18/30 , C25D5/56 , H05K1/0393 , H05K3/105 , H05K3/426 , H05K2203/1105 , H05K2203/1157 , H05K2203/121 , Y10T156/1052 , Y10T156/1062
摘要： The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal. This conductive substance-adsorbing resin film is allowed to adsorb a metal and subjected to plating, whereby a metal layer-coated resin film can be obtained.
摘要翻译：本发明提供一种导电性物质吸附树脂膜，其中可以容易地形成其与树脂膜的粘附性优异并且在与树脂膜的界面处具有较小不均匀性的导电层，其制造方法，金属层 - 通过使用本发明的导电性物质吸附树脂膜可以容易地形成具有优异的与绝缘树脂膜的粘附性的高分辨率布线的涂布树脂膜，以及金属层涂覆树脂膜的制造方法这是能够容易地制造具有高清晰度布线的印刷电路板的材料。本发明还提供一种包含至少两个树脂层的导电物质吸附树脂膜，其中至少一个树脂层是具有吸附导电物质或金属的吸附树脂层。使该导电性物质吸附树脂膜吸附金属并进行电镀，由此可以得到金属层被覆的树脂膜。

8. 发明授权

US07576036B2 Heat-sensitive recording material, heat-sensitive recording method and method for manufacturing heat-sensitive recording material 有权
标题翻译：热敏记录材料，热敏记录方法和制造热敏记录材料的方法
公开(公告)号：US07576036B2
公开(公告)日：2009-08-18
申请号：US11497400
申请日：2006-08-02
申请人： Hideo Nagasaki , Hisato Nagase , Toshihide Aoshima , Shiki Ueki
发明人： Hideo Nagasaki , Hisato Nagase , Toshihide Aoshima , Shiki Ueki
IPC分类号： B41M5/42
CPC分类号： B41M5/423 , B41M2205/04 , B41M2205/12 , B41M2205/40 , G03C1/002 , G03C1/52
摘要： A heat-sensitive recording material including at least one heat-sensitive recording layer and a protective layer provided in this order on a support, wherein the protective layer contains a compound represented by the following Formula (1) and/or a compound represented by the following Formula (2), a method for manufacturing the heat-sensitive recording material, and a heat-sensitive recording method using the heat-sensitive recording material provided.
摘要翻译：一种热敏记录材料，包括至少一个热敏记录层和保护层，其依次设置在载体上，其中保护层含有由下式（1）表示的化合物和/或由以下公式（2），热敏记录材料的制造方法和使用设置的热敏记录材料的热敏记录方法。

9. 发明申请

US20070032381A1 Heat-sensitive recording material, heat-sensitive recording method and method for manufacturing heat-sensitive recording material 有权
标题翻译：热敏记录材料，热敏记录方法和制造热敏记录材料的方法
公开(公告)号：US20070032381A1
公开(公告)日：2007-02-08
申请号：US11497400
申请日：2006-08-02
申请人： Hideo Nagasaki , Hisato Nagase , Toshihide Aoshima , Shiki Ueki
发明人： Hideo Nagasaki , Hisato Nagase , Toshihide Aoshima , Shiki Ueki
IPC分类号： B41M5/24
CPC分类号： B41M5/423 , B41M2205/04 , B41M2205/12 , B41M2205/40 , G03C1/002 , G03C1/52
摘要： A heat-sensitive recording material including at least one heat-sensitive recording layer and a protective layer provided in this order on a support, wherein the protective layer contains a compound represented by the following Formula (1) and/or a compound represented by the following Formula (2), a method for manufacturing the heat-sensitive recording material, and a heat-sensitive recording method using the heat-sensitive recording material provided.
摘要翻译：一种热敏记录材料，包括至少一个热敏记录层和保护层，其依次设置在载体上，其中保护层含有由下式（1）表示的化合物和/或由以下公式（2），热敏记录材料的制造方法和使用设置的热敏记录材料的热敏记录方法。

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