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1. 发明申请

US20130119528A1 STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AND ASSOCIATED SYSTEMS AND METHODS 有权
公开(公告)号：US20130119528A1
公开(公告)日：2013-05-16
申请号：US13613540
申请日：2012-09-13
申请人： Steven K. Groothuis , Jian Li , Haojun Zhang , Paul A. Silvestri , Xiao Li , Shijian Luo , Luke G. England , Brent Keeth , Jaspreet Gandhi
发明人： Steven K. Groothuis , Jian Li , Haojun Zhang , Paul A. Silvestri , Xiao Li , Shijian Luo , Luke G. England , Brent Keeth , Jaspreet Gandhi
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/3736 , H01L23/42 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/15311
摘要： Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.

2. 发明授权

US09153520B2 Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods 有权
标题翻译：具有多个热路径和相关系统和方法的堆叠式半导体管芯组件
公开(公告)号：US09153520B2
公开(公告)日：2015-10-06
申请号：US13613540
申请日：2012-09-13
申请人： Steven K. Groothuis , Jian Li , Haojun Zhang , Paul A. Silvestri , Xiao Li , Shijian Luo , Luke G. England , Brent Keeth , Jaspreet Gandhi
发明人： Steven K. Groothuis , Jian Li , Haojun Zhang , Paul A. Silvestri , Xiao Li , Shijian Luo , Luke G. England , Brent Keeth , Jaspreet Gandhi
IPC分类号： H01L23/36 , H01L23/367 , H01L23/373 , H01L23/42 , H01L25/065 , H01L25/18
CPC分类号： H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/3736 , H01L23/42 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/15311
摘要： Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.
摘要翻译：本文公开了具有多个热路径和相关系统和方法的堆叠的半导体管芯组件。在一个实施例中，半导体管芯组件可以包括布置在堆叠中的多个第一半导体管芯和承载第一半导体管芯的第二半导体管芯。第二半导体管芯可以包括横向向外延伸超过第一半导体管芯的至少一侧的周边部分。半导体管芯组件还可以包括在第二半导体管芯的周边部分处的热传递特征。第一半导体管芯可以限定第一热路径，并且热转移特征可以限定与第一半导体管芯分离的第二热路径。

3. 发明申请

US20130119527A1 SEMICONDUCTOR DIE ASSEMBLIES WITH ENHANCED THERMAL MANAGEMENT, SEMICONDUCTOR DEVICES INCLUDING SAME AND RELATED METHODS 有权
标题翻译：具有增强热管理的半导体组件，包括其的半导体器件及相关方法
公开(公告)号：US20130119527A1
公开(公告)日：2013-05-16
申请号：US13613235
申请日：2012-09-13
申请人： Shijian Luo , Xiao Li , Jian Li
发明人： Shijian Luo , Xiao Li , Jian Li
IPC分类号： H01L23/34 , F28F7/00
CPC分类号： H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/3736 , H01L23/42 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/15311
摘要： A semiconductor die assembly comprises a plurality of semiconductor dice in a stack. Another semiconductor die is adjacent to the stack and has a region, which may comprise a relatively higher power density region, extends peripherally beyond the stack. Conductive elements extend between and electrically interconnect integrated circuits of semiconductor dice in the stack and of the other semiconductor die. Thermal pillars are interposed between semiconductor dice of the stack, and a heat dissipation structure, such as a lid, is in contact with an uppermost die of the stack and the high power density region of the other semiconductor die. Other die assemblies, semiconductor devices and methods of managing heat transfer within a semiconductor die assembly are also disclosed.
摘要翻译：半导体管芯组件包括堆叠中的多个半导体管芯。另一个半导体管芯与堆叠相邻并且具有可以包括相对较高功率密度区域的区域，其周边延伸超过堆叠。导电元件在堆叠和另一个半导体管芯中的半导体管芯的集成电路之间延伸并电互连。热柱被插入在堆叠的半导体管芯之间，并且诸如盖子的散热结构与堆叠的最上面的管芯和另一个半导体管芯的高功率密度区域接触。还公开了其他管芯组件，半导体器件和管理半导体管芯组件内的热传递的方法。

4. 发明授权

US09269646B2 Semiconductor die assemblies with enhanced thermal management and semiconductor devices including same 有权
标题翻译：具有增强的热管理的半导体管芯组件和包括其的半导体器件
公开(公告)号：US09269646B2
公开(公告)日：2016-02-23
申请号：US13613235
申请日：2012-09-13
申请人： Shijian Luo , Xiao Li , Jian Li
发明人： Shijian Luo , Xiao Li , Jian Li
IPC分类号： H01L23/52 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/42 , H01L25/065 , H01L25/18
CPC分类号： H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/3736 , H01L23/42 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/15311
摘要： A semiconductor die assembly comprises a plurality of semiconductor dice in a stack. Another semiconductor die is adjacent to the stack and has a region, which may comprise a relatively higher power density region, extends peripherally beyond the stack. Conductive elements extend between and electrically interconnect integrated circuits of semiconductor dice in the stack and of the other semiconductor die. Thermal pillars are interposed between semiconductor dice of the stack, and a heat dissipation structure, such as a lid, is in contact with an uppermost die of the stack and the higher power density region of the other semiconductor die. Other die assemblies, semiconductor devices and methods of managing heat transfer within a semiconductor die assembly are also disclosed.
摘要翻译：半导体管芯组件包括堆叠中的多个半导体管芯。另一个半导体管芯与堆叠相邻并且具有可以包括相对较高功率密度区域的区域，其周边延伸超过堆叠。导电元件在堆叠和另一个半导体管芯中的半导体管芯的集成电路之间延伸并电互连。散热柱插入在堆叠的半导体管芯之间，散热结构（例如盖子）与堆叠的最上面的管芯和另一个半导体管芯的较高功率密度区域接触。还公开了其他管芯组件，半导体器件和管理半导体管芯组件内的热传递的方法。

5. 发明授权

US08492242B2 Dry flux bonding device and method 有权
标题翻译：干焊剂结合装置及方法
公开(公告)号：US08492242B2
公开(公告)日：2013-07-23
申请号：US12787187
申请日：2010-05-25
申请人： Owen Fay , Xiao Li , Josh Woodland , Shijian Luo , Jaspreet Gandhi , Te-Sung Wu
发明人： Owen Fay , Xiao Li , Josh Woodland , Shijian Luo , Jaspreet Gandhi , Te-Sung Wu
IPC分类号： H01L33/48 , H01L23/12 , B23K1/20
CPC分类号： H01L33/62 , H01L24/29 , H01L24/83 , H01L24/94 , H01L33/0079 , H01L33/0095 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/94 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2224/83 , H01L2924/00
摘要： Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.
摘要翻译：描述了包括LED器件在内的器件形成方法。装置可以包括氟化化合物层。所述的方法可以利用等离子体处理来形成氟化化合物层。所描述的方法可以操作以产生金属间化合物层，其以相对有效和廉价的方式将诸如半导体晶片的两个基板结合在一起。

6. 发明申请

US20110291146A1 DRY FLUX BONDING DEVICE AND METHOD 有权
标题翻译：干流焊接装置和方法
公开(公告)号：US20110291146A1
公开(公告)日：2011-12-01
申请号：US12787187
申请日：2010-05-25
申请人： Owen Fay , Xiao Li , Josh Woodland , Shijian Luo , Jaspreet Gandhi , Te-Sung Wu
发明人： Owen Fay , Xiao Li , Josh Woodland , Shijian Luo , Jaspreet Gandhi , Te-Sung Wu
IPC分类号： H01L33/62 , H01L33/48 , B23K31/02
CPC分类号： H01L33/62 , H01L24/29 , H01L24/83 , H01L24/94 , H01L33/0079 , H01L33/0095 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/94 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2224/83 , H01L2924/00
摘要： Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.
摘要翻译：描述了包括LED器件在内的器件形成方法。装置可以包括氟化化合物层。所述的方法可以利用等离子体处理来形成氟化化合物层。所描述的方法可以操作以产生金属间化合物层，其以相对有效和廉价的方式将诸如半导体晶片的两个基板结合在一起。

7. 发明授权

US08908689B2 Apparatus and method for processing packet 有权
标题翻译：用于处理数据包的装置和方法
公开(公告)号：US08908689B2
公开(公告)日：2014-12-09
申请号：US12672110
申请日：2008-07-09
申请人： Xiangqing Chang , Xiao Li , Xudong Zou
发明人： Xiangqing Chang , Xiao Li , Xudong Zou
IPC分类号： H04L12/28 , H04L12/56 , H04J3/24 , H04L12/58 , H04L12/933 , H04L12/931 , H04L12/911
CPC分类号： H04L12/58 , H04L47/825 , H04L49/15 , H04L49/40 , H04L51/00
摘要： The present invention provides an apparatus and method for processing a packet. An interface processing module selects one from all service processing modules as a service processing module for processing a packet; if the service processing module needs to perform tunnel processing for the packet, the service processing module transmits the packet after performing the tunnel processing; if another service processing module needs to perform tunnel processing for the packet, the service processing module transmits the packet to a service processing module needing to perform tunnel processing for the packet. According to the present invention, the packet can be processed uniformly by the service processing module, so it is not unnecessary to store session states in the service processing modules, and also not unnecessary to perform synchronization between the service processing modules, which greatly decreases complexity of processing the packet and saves system bandwidth.
摘要翻译：本发明提供一种用于处理分组的装置和方法。接口处理模块从所有服务处理模块中选择一个作为处理分组的服务处理模块; 如果业务处理模块需要对报文进行隧道处理，则业务处理模块在进行隧道处理后发送报文; 如果另一业务处理模块需要对该报文执行隧道处理，则业务处理模块将该报文发送给需要对该报文进行隧道处理的业务处理模块。根据本发明，服务处理模块可以均匀地处理分组，所以不必在服务处理模块中存储会话状态，也不必在服务处理模块之间进行同步，这大大降低了复杂度处理数据包并节省系统带宽。

8. 发明授权

US08615388B2 Intra-language statistical machine translation 有权
标题翻译：语言间统计机器翻译
公开(公告)号：US08615388B2
公开(公告)日：2013-12-24
申请号：US12058328
申请日：2008-03-28
申请人： Xiao Li , Yun-Cheng Ju , Geoffrey Zweig , Alex Aero
发明人： Xiao Li , Yun-Cheng Ju , Geoffrey Zweig , Alex Aero
IPC分类号： G06F17/28
CPC分类号： G06F17/2818 , G06F17/2827
摘要： Training data may be provided, the training data including pairs of source phrases and target phrases. The pairs may be used to train an intra-language statistical machine translation model, where the intra-language statistical machine translation model, when given an input phrase of text in the human language, can compute probabilities of semantic equivalence of the input phrase to possible translations of the input phrase in the human language. The statistical machine translation model may be used to translate between queries and listings. The queries may be text strings in the human language submitted to a search engine. The listing strings may be text strings of formal names of real world entities that are to be searched by the search engine to find matches for the query strings.
摘要翻译：可以提供训练数据，训练数据包括源短语和目标短语对。这些对可以用于训练语言间统计机器翻译模型，其中语言内统计机器翻译模型在给予人类语言的文本的输入短语时可以计算输入短语的语义等同性的可能性输入短语在人类语言中的翻译。统计机器翻译模型可用于在查询和列表之间进行翻译。查询可以是提交给搜索引擎的人类语言中的文本字符串。列表字符串可以是要由搜索引擎搜索以查找查询字符串的匹配的真实世界实体的正式名称的文本串。

9. 发明授权

US08559423B2 Method and apparatus for packet processing 有权
标题翻译：分组处理方法和装置
公开(公告)号：US08559423B2
公开(公告)日：2013-10-15
申请号：US12670766
申请日：2008-06-26
申请人： Ju Wang , Zhanming Wei , Xudong Zou , Xiao Li , Xiangqing Chang
发明人： Ju Wang , Zhanming Wei , Xudong Zou , Xiao Li , Xiangqing Chang
IPC分类号： H04L12/58
CPC分类号： H04L67/16 , H04L67/14 , H04L69/32
摘要： The present invention discloses a packet processing apparatus and method. The packet processing apparatus is applied to an L4˜L7 network device, including a plurality of interface processing units and a plurality of service processing units, the interface processing units are connected with the service processing units through a first connection unit; and each of the interface processing units is adapted to select, after receiving a packet from outside, a service processing unit from all the service processing units and transmit the packet to the selected service processing unit; and each of the service processing units is adapted to perform service processing to the packet after receiving the packet. The present invention improves packet processing capability and reliability of the L4˜L7 network device.
摘要翻译：本发明公开了一种分组处理装置和方法。分组处理装置应用于包括多个接口处理单元和多个业务处理单元的L4〜L7网络设备，接口处理单元通过第一连接单元与业务处理单元连接; 并且每个接口处理单元适于在从外部接收到分组之后从所有服务处理单元选择服务处理单元，并将所述分组发送到所选择的服务处理单元; 并且每个服务处理单元适于在接收到分组之后对分组执行服务处理。本发明提高了L4〜L7网络设备的分组处理能力和可靠性。

10. 发明申请

US20130119419A1 MAGNETICALLY ADJUSTING COLOR-CONVERTING MATERIALS WITHIN A MATRIX AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS 有权
标题翻译：在矩阵和相关设备，系统和方法中磁性调整颜色转换材料
公开(公告)号：US20130119419A1
公开(公告)日：2013-05-16
申请号：US13294780
申请日：2011-11-11
申请人： Sameer S. Vadhavkar , Tim J. Corbett , Xiao Li
发明人： Sameer S. Vadhavkar , Tim J. Corbett , Xiao Li
IPC分类号： H01L33/50 , H01L33/44 , H01L31/18 , C09K11/80 , G01J3/46 , H01F1/00 , H01F1/06 , H01L31/0232 , H01L21/66
CPC分类号： H01L33/502 , H01F1/083 , H01L33/504 , H01L33/507 , H01L2933/0041
摘要： Magnetically adjusting color-converting particles within a matrix and associated devices, systems, and methods are disclosed herein. A magnetic-adjustment process can include applying a magnetic field to a mixture including a non-solid matrix and a plurality of color-converting particles (e.g. magnetically anisotropic color-converting particles). The magnetic field can cause the plurality of color-converting particles to move into a generally non-random alignment (e.g., a generally non-random magnetic alignment and/or a generally non-random shape alignment) within the non-solid matrix. The non-solid matrix then can be solidified to form a solid matrix. A magnetic-adjustment process can be performed in conjunction with testing and/or product binning of solid-state radiation transducer devices. For example, a position, direction, strength, or duration of a magnetic field used to perform a magnetic-adjustment process can be controlled according to optical output collected from a solid-state radiation transducer device. Measuring the optical output and performing the magnetic-adjustment process can be at least partially concurrent.
摘要翻译：本文公开了磁矩调节矩阵内的颜色转换粒子和相关的装置，系统和方法。磁调整方法可以包括将磁场施加到包括非固体基质和多个颜色转换颗粒（例如磁各向异性颜色转换颗粒）的混合物中。磁场可以使多个颜色转换粒子移动到非固体基质内的大致非随机对准（例如，通常非随机的磁性取向和/或一般非随机的形状对准）中。然后可以固化非固体基质以形成固体基质。可以结合固态辐射换能器装置的测试和/或产品分组来执行磁调整过程。例如，可以根据从固体辐射换能器装置收集的光输出来控制用于执行磁调整处理的磁场的位置，方向，强度或持续时间。测量光输出并执行磁调整过程可以至少部分同步。

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