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    • 2. 发明申请
    • Vertical light-emitting diode and method for manufacturing the same
    • 垂直发光二极管及其制造方法
    • US20070057275A1
    • 2007-03-15
    • US11264774
    • 2005-10-31
    • Shi-Ming Chen
    • Shi-Ming Chen
    • H01L33/00H01L21/00
    • H01L33/0079
    • A vertical light-emitting diode and a method for manufacturing the same are described. In the method for manufacturing the vertical light-emitting diode, a sapphire substrate is provided. An illuminant epitaxial structure is formed on the sapphire substrate. Next, a first conductivity type electrode is formed on a surface of the illuminant epitaxial structure. Then, a local removal step is performed to remove a portion of the sapphire substrate from another surface of the illuminant epitaxial structure and to expose a portion of the other surface of the illuminant epitaxial structure, wherein the other surface is opposite to the surface of the illuminant epitaxial structure. Subsequently, a second conductivity type electrode is formed on the exposed portion of the other surface of the illuminant epitaxial structure, wherein the first conductivity type electrode and the second conductivity type electrode are opposite conductivity types.
    • 对垂直发光二极管及其制造方法进行说明。 在制造垂直发光二极管的方法中,提供蓝宝石衬底。 在蓝宝石衬底上形成发光体外延结构。 接下来,在发光体外延结构的表面上形成第一导电型电极。 然后,执行局部去除步骤以从发光体外延结构的另一表面去除蓝宝石衬底的一部分,并且暴露光源外延结构的另一表面的一部分,其中另一个表面与 光源外延结构。 随后,在发光体外延结构的另一个表面的暴露部分上形成第二导电型电极,其中第一导电型电极和第二导电型电极是相反的导电类型。
    • 8. 发明授权
    • Lighting device and method for manufacturing the same
    • 照明装置及其制造方法
    • US07301272B2
    • 2007-11-27
    • US11105402
    • 2005-04-14
    • Chang-Hsin ChuKuo-Hui Yu ChuShi-Ming Chen
    • Chang-Hsin ChuKuo-Hui Yu ChuShi-Ming Chen
    • H01J1/62
    • H01L33/38H01L33/20H01L33/44H01L2933/0016
    • A lighting device and a method for manufacturing the same are described. First, a semiconductor layer of a first electrical property, an active layer and a semiconductor layer of a second electrical property are sequentially formed, and part of them are removed to form a mesa. A transparent contact layer is formed thereon, and thus forms a stack. Afterwards, a passivation layer is deposited on the stack and a first part of the semiconductor layer of the first electrical property adjacent to the stack. Part of the passivation layer is removed to expose part of the transparent contact layer. Then, an electrode of the second electrical property is formed on the exposed transparent contact layer. Afterwards, the electrode of the second electrical property is extended to the passivation layer on the first part of the semiconductor layer of the first electrical property to form a guard ring.
    • 对照明装置及其制造方法进行说明。 首先,依次形成具有第一电特性的半导体层,有源层和第二电性质的半导体层,并且去除其中的一部分以形成台面。 在其上形成透明接触层,从而形成叠层。 之后,钝化层沉积在堆叠上,并且与堆叠相邻的第一电性质的半导体层的第一部分被沉积。 去除钝化层的一部分以暴露部分透明接触层。 然后,在露出的透明接触层上形成第二电性质的电极。 之后,第二电性能的电极延伸到第一电性能的半导体层的第一部分上的钝化层以形成保护环。
    • 10. 再颁专利
    • Fabrication method of transparent electrode on visible light-emitting diode
    • 可见光发光二极管上透明电极的制作方法
    • USRE43426E1
    • 2012-05-29
    • US13152124
    • 2011-06-02
    • Tse-Liang YingShi-Ming Chen
    • Tse-Liang YingShi-Ming Chen
    • H01L21/00
    • H01L33/42Y10S438/956
    • A method for forming a transparent electrode on a visible light-emitting diode is described. A visible light-emitting diode element is provided, and the visible light-emitting diode element has a substrate, an epitaxial structure and a metal electrode. The metal electrode and the epitaxial structure are located on the same side of the substrate, or located respectively on the different sides of the substrate. An ohmic metal layer is formed on a surface of the epitaxial structure. The ohmic metal layer is annealed. The ohmic metal layer is removed to expose the surface of the epitaxial structure. A transparent electrode layer is formed on the exposed surface. A metal pad is formed on the transparent electrode layer.
    • 描述了在可见光发光二极管上形成透明电极的方法。 提供了可见光发光二极管元件,可见光发光二极管元件具有基板,外延结构和金属电极。 金属电极和外延结构位于基板的同一侧,或分别位于基板的不同侧。 在外延结构的表面上形成欧姆金属层。 欧姆金属层退火。 去除欧姆金属层以露出外延结构的表面。 在露出的表面上形成透明电极层。 在透明电极层上形成金属焊盘。