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1. 发明申请

US20050249933A1 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US20050249933A1
公开(公告)日：2005-11-10
申请号：US10660054
申请日：2003-09-11
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： H05K1/09 , B32B5/00 , B32B5/14 , B32B15/08 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/40 , D04H1/00
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

2. 发明授权

US07754321B2 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US07754321B2
公开(公告)日：2010-07-13
申请号：US10660054
申请日：2003-09-11
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： B32B27/04
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

3. 发明授权

US06833042B2 Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US06833042B2
公开(公告)日：2004-12-21
申请号：US10149667
申请日：2002-10-09
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： B29C6500
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

4. 发明授权

US06993836B2 Circuit board and method of manufacturing same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06993836B2
公开(公告)日：2006-02-07
申请号：US10648187
申请日：2003-08-27
申请人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
发明人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
IPC分类号： H01K3/10
CPC分类号： H05K3/462 , H05K1/0268 , H05K3/386 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/066 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.
摘要翻译：可以获得具有稳定的连接电阻的电路板。多层电路板包括以下步骤：在不可压缩的基板上形成通孔，该基板在其任一侧经由接合层具有膜; 将导电膏填充到通孔中; 从基板去除膜; 将金属箔层叠到基板的任一侧并在压力下加热相同以使粘合层硬化，将金属箔粘合到基板上并将基板的侧面彼此电连接; 并通过加工金属箔形成电路图案。

5. 发明授权

US06700071B2 Multi-layer circuit board having at least two or more circuit patterns connected 失效
标题翻译：具有连接至少两个或更多个电路图案的多层电路板
公开(公告)号：US06700071B2
公开(公告)日：2004-03-02
申请号：US09928966
申请日：2001-08-14
申请人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
发明人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
IPC分类号： H05K103
CPC分类号： H05K3/462 , H05K1/0268 , H05K3/386 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/066 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.
摘要翻译：可以获得具有稳定的连接电阻的电路板。多层电路板包括以下步骤：在不可压缩的基板上形成通孔，该基板在其任一侧经由接合层具有膜; 将导电膏填充到通孔中; 从基板去除膜; 将金属箔层叠到基板的任一侧并在压力下加热相同以使粘合层硬化，将金属箔粘合到基板上并将基板的侧面彼此电连接; 并通过加工金属箔形成电路图案。

6. 发明授权

US06528733B2 Multi-layer circuit board and method of manufacturing same 失效
公开(公告)号：US06528733B2
公开(公告)日：2003-03-04
申请号：US09902800
申请日：2001-07-12
申请人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
发明人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
IPC分类号： H05K103
CPC分类号： H05K3/4614 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155
摘要： An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.

7. 发明授权

US06890449B2 Method for manufacturing printed-circuit board 失效
标题翻译：印刷电路板制造方法
公开(公告)号：US06890449B2
公开(公告)日：2005-05-10
申请号：US10048927
申请日：2001-06-05
申请人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka , Toshihiro Nishii
发明人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka , Toshihiro Nishii
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H01K13/00 , H05K3/36
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2201/09827 , H05K2201/09845 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126
摘要： A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.
摘要翻译：一种制造PCB的方法，包括以下步骤：在前面和背面上形成具有释放层的衬底中的通孔; 在通孔中填充导电膏; 去除释放层并在金属箔的两个面上设置金属箔; 并热压它们。通孔的直径大于形成在释放层上的相应孔的直径。根据本发明，当导电膏被压缩时，从基板的表面突出的导电糊被截留在通孔的边缘。这种配置可以防止出现不良布线图形的短路。因此，足够量的导电膏可以从基板的表面突出。因此，在压缩之后，确保导电浆料内部和导电性糊料与金属箔之间的稳定的电连接，从而可以制造出具有高可靠性的PCB。

8. 发明授权

US07105277B2 Printing plate, circuit board and method of printing circuit board 有权
标题翻译：印版，电路板和印刷电路板的方法
公开(公告)号：US07105277B2
公开(公告)日：2006-09-12
申请号：US10490482
申请日：2003-09-19
申请人： Toshiaki Takenaka , Toshihiro Nishii , Hideaki Komoda , Toshikazu Kondo , Shinji Nakamura
发明人： Toshiaki Takenaka , Toshihiro Nishii , Hideaki Komoda , Toshikazu Kondo , Shinji Nakamura
IPC分类号： G03F7/00 , G03F7/20
CPC分类号： H05K3/1225 , B41F15/36 , B41F35/003 , B41M1/12 , B41N1/24 , B41N1/248 , H05K3/0052 , H05K3/4053 , H05K3/4069 , H05K2201/09063 , H05K2201/09709 , H05K2203/0191
摘要： The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.
摘要翻译：本发明的目的在于提供一种印版，其能够防止粘贴在刮板的边缘上的高粘度浆料通过刮板方法被填充时被转移到印刷电路板的通孔上并留在印刷电路板的通孔上。印版具有设置有形成在其上的刮板清洁部（7）的金属板（3），并固定在安装在板框架（1）上的掩模（2）的倾斜区域（5）的背面。印刷电路板的通孔只有在通过刮板清洁部分（7）除去粘附到刮板的边缘的高粘度的浆料之后才能填充糊料，以防止糊料留在通孔上，从而实现印刷电路板质量优良。

9. 发明授权

US07018672B2 Circuit board producing method and circuit board producing device 失效
公开(公告)号：US07018672B2
公开(公告)日：2006-03-28
申请号：US10182632
申请日：2001-12-04
申请人： Toshiaki Takenaka , Toshihiro Nishii , Yuichiro Sugita , Shinji Nakamura , Hideaki Komoda , Toshikazu Kondo
发明人： Toshiaki Takenaka , Toshihiro Nishii , Yuichiro Sugita , Shinji Nakamura , Hideaki Komoda , Toshikazu Kondo
IPC分类号： B05D5/12 , B05D3/12 , B41M1/12 , B41F9/10
CPC分类号： H05K3/4069 , H05K1/095 , H05K3/1233 , H05K3/247 , H05K2201/035 , H05K2201/0355 , H05K2203/1461 , H05K2203/1476 , Y10T29/49155 , Y10T29/49165
摘要： A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.

10. 发明授权

US07356916B2 Circuit-formed substrate and method of manufacturing circuit-formed substrate 失效
标题翻译：电路形成基片及制造电路形成基片的方法
公开(公告)号：US07356916B2
公开(公告)日：2008-04-15
申请号：US10362448
申请日：2002-07-16
申请人： Toshihiro Nishii , Yasuharu Fukui , Kiyohide Tatsumi , Yoshihiro Kawakita , Shinji Nakamura , Hideaki Komoda
发明人： Toshihiro Nishii , Yasuharu Fukui , Kiyohide Tatsumi , Yoshihiro Kawakita , Shinji Nakamura , Hideaki Komoda
IPC分类号： H05K3/36
CPC分类号： H05K3/4069 , H05K1/0366 , H05K3/4614 , H05K3/4652 , H05K2201/0278 , H05K2201/029 , H05K2201/0355 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T428/24917
摘要： A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.
摘要翻译：提供了具有可靠电气连接的电路板。具有用于将层连接到另一层的连接的绝缘板材料包括加强构件。整个绝缘板材料的厚度至少等于且不超过加强件厚度的1.5倍。

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