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    • 3. 发明授权
    • Electronic component and electronic equipment using the same
    • 电子元件和电子设备使用相同
    • US06680528B2
    • 2004-01-20
    • US09897423
    • 2001-07-03
    • Satoshi MatsuoKunihiro FujiiTakafumi KogaKozo Murakami
    • Satoshi MatsuoKunihiro FujiiTakafumi KogaKozo Murakami
    • H01L2312
    • H01L23/49805H01L23/13H01L2224/48227
    • An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability to a brazing material and helps extra material flow into the recess easily. In addition, the interface between the top end face of the recess and the side face is curved to make the brazing material flow into the recess easily. When the opening of the package is sealed with a lid using the brazing material, the extra brazing material flows into the recess. This prevents the brazing material from protruding outside of the package and thus improves dimensional accuracy of the electronic component. Therefore, mounting accuracy of the electronic component can be improved and short circuit can be prevented.
    • 一种电子部件,其在其封装的侧面上具有凹部,用于在其中容纳电气元件。 在凹部的表面上形成没有到达封装的底端的金属层。 金属层对钎焊材料具有优异的润湿性,并且有助于额外的材料容易地流入凹部。 此外,凹部的顶端面与侧面之间的界面是弯曲的,以使钎焊材料容易地流入凹部。 当使用钎焊材料用盖子密封包装的开口时,额外的钎焊材料流入凹部。 这防止钎焊材料突出到包装外部,从而提高电子部件的尺寸精度。 因此,能够提高电子部件的安装精度,能够防止短路。