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    • 4. 发明授权
    • Redundancy circuit for repairing defective bits in semiconductor memory
device
    • 用于修复半导体存储器件中的有缺陷的位的冗余电路
    • US5574729A
    • 1996-11-12
    • US338817
    • 1994-11-10
    • Mitsuya KinoshitaShigeru MoriYoshikazu MorookaHiroshi MiyamotoShigeru KikudaMakoto Suwa
    • Mitsuya KinoshitaShigeru MoriYoshikazu MorookaHiroshi MiyamotoShigeru KikudaMakoto Suwa
    • G11C11/401G11C29/00G11C29/04G06F11/00
    • G11C29/848
    • A semiconductor memory device includes a plurality of memory blocks, i main row or column select lines extending over the plurality of memory blocks, and a decoder for selecting one of the main row or column select lines in accordance with an applied address signal. The decoder includes i outputs. Each of the memory blocks includes a plurality of memory cells arranged in rows and columns and at least (i+1) sub row or column select lines each for selecting one row or one column of memory cells. A shift redundancy circuit is provided for each of the memory blocks, for connecting the main row or column select line and the sub row or column select line. The shift redundancy circuit includes a switch circuit for connecting one main row or column select line to one of the plurality of adjacent sub row or column select lines, and a circuit for setting a connection path of the switch circuit. The shift redundancy circuit connects successively adjacent sub row or column select lines to main row or column select lines in one to one correspondence except a defective sub row or column select line associated with a defective bit.
    • 一种半导体存储器件包括多个存储块,i个在多个存储块上延伸的主行或列选择线,以及用于根据所施加的地址信号选择主行或列选择线中的一个的解码器。 解码器包括i个输出。 每个存储块包括排列成行和列的多个存储器单元和至少(i + 1)个子行或列选择线,每个用于选择一行或一列存储单元。 为每个存储块提供移位冗余电路,用于连接主行或列选择线和子行或列选择线。 移位冗余电路包括用于将一个主行或列选择线连接到多个相邻子行或列选择线中的一个的开关电路和用于设置开关电路的连接路径的电路。 除了与有缺陷的位相关联的有缺陷的子行或列选择线之外,移位冗余电路将连续相邻的子行或列选择线以一对一的对应方式连接到主行或列选择线。
    • 8. 发明授权
    • Semiconductor memory device including a redundancy circuitry for
repairing a defective memory cell and a method for repairing a
defective memory cell
    • 包括用于修复有缺陷的存储单元的冗余电路的半导体存储器件以及用于修复有缺陷的存储器单元的方法
    • US5146429A
    • 1992-09-08
    • US617737
    • 1990-11-26
    • Shinji KawaiShigeru MoriShigeru Kikuda
    • Shinji KawaiShigeru MoriShigeru Kikuda
    • G11C11/413G11C29/00G11C29/04
    • G11C29/848
    • A semicondcutor memory device includes an array of a plurality of memory cells arranged in a matrix manner, and a row or column decoder responsive to an external address signal for generating a row or column selecting signal. The memory cell array comprises (n+1) rows or columns. The row or column decoder comprises n output nodes. Transmission gates are provided between the decoder output node and row lines or column selecting lines for connecting each output node and each row line or column selecting line. The transmission gates are formed of a pair of CMOS transmission gates, whereby one output node is connected to two adjacent row lines or column selecting lines. This memory device further includes a circuit defining the connection manner of the transmission gate. This defining circuit turns one pair of CMOS transmission gates ON and OFF complementally. When there is a defective memory cell, the decoder output nodes are grouped into a first group including the output node corresponding to the faulty row or column having the defective memory cell, and a second group formed of the remaining output nodes. The defining circuit applies control signals to the CMOS transmission gates so that the ON/OFF states of the CMOS transmission gate pair related to the first group of output nodes and the CMOS transmission gate pair related to the second group of output node differ. The memory device further includes switching devices provided corresponding to each row line or column selecting line, responsive to the control signal from the defining cirucit to be turned on/off. This switching device connects only the faulty row line or the faulty column selecting line to the reference potential fixedly.
    • 半切割器存储器件包括以矩阵方式布置的多个存储器单元的阵列,以及响应于用于产生行或列选择信号的外部地址信号的行或列解码器。 存储单元阵列包括(n + 1)行或列。 行或列解码器包括n个输出节点。 在解码器输出节点和用于连接每个输出节点和每行行或列选择线的行线或列选择线之间提供传输门。 传输门由一对CMOS传输门形成,其中一个输出节点连接到两个相邻的行线或列选择线。 该存储装置还包括限定传输门的连接方式的电路。 该定义电路互补地将一对CMOS传输门ON和OFF。 当存在有缺陷的存储器单元时,解码器输出节点被分组为包括与具有缺陷存储单元的故障行或列相对应的输出节点的第一组,以及由剩余输出节点形成的第二组。 定义电路将控制信号施加到CMOS传输门,使得与第一组输出节点相关的CMOS传输门对的ON / OFF状态和与第二组输出节点相关的CMOS传输门对不同。 存储器件还包括响应于来自定义电路的控制信号而被打开/关闭而对应于每行行或列选择线提供的开关装置。 该开关装置仅将故障行线或故障列选择线固定为参考电位。
    • 9. 再颁专利
    • Dynamic random access memory with isolated well structure
    • 具有隔离井结构的动态随机存取存储器
    • USRE35613E
    • 1997-09-23
    • US496569
    • 1995-06-29
    • Kenichi YasudaMakoto SuwaShigeru Mori
    • Kenichi YasudaMakoto SuwaShigeru Mori
    • H01L27/02H01L27/105H01L27/108
    • H01L27/10805H01L27/0218H01L27/105
    • A semiconductor memory device includes a first conductivity type well in a first conductivity type semiconductor substrate surrounded by a second conductivity type well, one of a memory cell and an external input circuit arranged on the first conductivity type well and the other disposed outside the second conductivity type well. A predetermined power supply voltage is applied to the second conductivity type well and the first conductivity type well is connected to ground. In the structure, charge carriers injected from the external input circuit are absorbed in the second conductivity type well. As a result, the charge carriers are prevented from reaching the memory cell and destroying data stored therein. Therefore, it is possible to miniaturize transistors and increase integration density of dynamic random access memory devices without degrading the source to drain dielectric strength.
    • 半导体存储器件包括第一导电类型的半导体衬底中的第一导电类型的阱,该第一导电类型的半导体衬底由第二导电类型阱围绕,存储单元和布置在第一导电类型阱上的外部输入电路之一,另一个位于第二导电类型 类型很好。 对第二导电类型阱施加预定的电源电压,并且将第一导电类型阱连接到地。 在该结构中,从外部输入电路注入的电荷载流子被吸收在第二导电型阱中。 结果,防止电荷载体到达存储单元并破坏其中存储的数据。 因此,可以使晶体管小型化并提高动态随机存取存储器件的集成密度,而不会使源极降低介电强度。
    • 10. 发明授权
    • Dynamic random access memory with isolated well structure
    • 具有隔离井结构的动态随机存取存储器
    • US5281842A
    • 1994-01-25
    • US722164
    • 1991-06-27
    • Kenichi YasudaMakoto SuwaShigeru Mori
    • Kenichi YasudaMakoto SuwaShigeru Mori
    • H01L27/02H01L27/105H01L27/108
    • H01L27/10805H01L27/0218H01L27/105
    • A semiconductor memory device includes a first conductivity type well in a first conductivity type semiconductor substrate surrounded by a second conductivity type well, one of a memory cell and an external input circuit arranged on the first conductivity type well and the other disposed outside the second conductivity type well. A predetermined power supply voltage is applied to the second conductivity type well and the first conductivity type well is connected to ground. In the structure, charge carriers injected from the external input circuit are absorbed in the second conductivity type well. As a result, the charge carriers are prevented from reaching the memory cell and destroying data stored therein. Therefore, it is possible to miniaturize transistors and increase integration density of dynamic random access memory devices without degrading the source to drain dielectric strength.
    • 半导体存储器件包括第一导电类型的半导体衬底中的第一导电类型的阱,该第一导电类型的半导体衬底由第二导电类型阱围绕,存储单元和布置在第一导电类型阱上的外部输入电路中的一个, 类型很好。 对第二导电类型阱施加预定的电源电压,并且将第一导电类型阱连接到地。 在该结构中,从外部输入电路注入的电荷载流子被吸收在第二导电型阱中。 结果,防止电荷载体到达存储单元并破坏其中存储的数据。 因此,可以使晶体管小型化并提高动态随机存取存储器件的集成密度,而不会使源极降低介电强度。