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1. 发明申请

US20090242129A1 THERMAL PROCESSING APPARATUS AND PROCESSING SYSTEM 审中-公开
标题翻译：热处理设备和加工系统
公开(公告)号：US20090242129A1
公开(公告)日：2009-10-01
申请号：US12409664
申请日：2009-03-24
申请人： Tadashi Onishi , Shigeki Tozawa , Yusuke Muraki , Takafumi Nitoh
发明人： Tadashi Onishi , Shigeki Tozawa , Yusuke Muraki , Takafumi Nitoh
IPC分类号： B44C1/22 , C23C16/46
CPC分类号： H01L21/67069 , H01L21/31116 , H01L21/67109
摘要： A heat treatment apparatus for heat-treating a silicon substrate includes a mounting table for mounting and heating the silicon substrate thereon, wherein a cover made of any of silicon, silicon carbide, and aluminum nitride is placed on an upper surface of the mounting table. By covering the upper surface of the mounting table by the cover made of silicon or the like, metal contamination of the lower surface of the silicon substrate is suppressed.
摘要翻译：用于热处理硅衬底的热处理设备包括用于在其上安装和加热硅衬底的安装台，其中由硅，碳化硅和氮化铝中的任何一个制成的盖子被放置在安装台的上表面上。通过用硅等覆盖安装台的上表面，抑制了硅衬底的下表面的金属污染。

2. 发明授权

US09105586B2 Etching of silicon oxide film 有权
标题翻译：刻蚀氧化硅膜
公开(公告)号：US09105586B2
公开(公告)日：2015-08-11
申请号：US12078958
申请日：2008-04-08
申请人： Shigeki Tozawa , Yusuke Muraki
发明人： Shigeki Tozawa , Yusuke Muraki
IPC分类号： H01L21/306 , H01L21/311 , H01L21/67
CPC分类号： H01L21/31138 , H01L21/67069 , H01L21/67155
摘要： An etching method includes preparing a target object such that a first oxide film made of silicon oxide containing at least one of B and P is formed on a substrate, a second oxide film made of silicon oxide containing neither of B and P is formed on the first oxide film, and a contact portion is present below an interface between the first oxide film and the second oxide film. The etching method further includes etching the second oxide film and the first oxide film, thereby forming a hole reaching the contact portion, and etching the first oxide film by a dry process using a gas containing HF, thereby expanding a portion of the hole adjacent to an upper side of the contact portion and inside the first oxide film.
摘要翻译：蚀刻方法包括制备目标物体，使得在基板上形成由含有B和P中的至少一个的氧化硅制成的第一氧化物膜，在不含有B和P的氧化硅中形成的第二氧化物膜形成在第一氧化物膜和接触部分存在于第一氧化物膜和第二氧化物膜之间的界面之下。蚀刻方法还包括蚀刻第二氧化物膜和第一氧化物膜，从而形成到达接触部分的孔，并且通过使用含有HF的气体的干法来蚀刻第一氧化物膜，从而使孔的一部分与接触部分的上侧和第一氧化膜内部。

3. 发明申请

US20100163179A1 Substrate Processing Apparatus 审中-公开
标题翻译：基板加工装置
公开(公告)号：US20100163179A1
公开(公告)日：2010-07-01
申请号：US12086634
申请日：2006-12-12
申请人： Shigeki Tozawa , Yusuke Muraki , Tadashi Iino , Daisuke Hayashi
发明人： Shigeki Tozawa , Yusuke Muraki , Tadashi Iino , Daisuke Hayashi
IPC分类号： B08B13/00
CPC分类号： H01L21/02057 , H01L21/6719 , H01L21/67207 , H01L21/823807 , H01L21/823814 , H01L29/165 , H01L29/66636 , H01L29/7848
摘要： [Problem] To provide a substrate processing apparatus capable of preventing adherence of hydrogen fluoride to an inner surface the like of a chamber.[Means for Solving] An apparatus housing and processing a substrate W in a chamber includes a hydrogen fluoride gas supply path 61 for supplying a hydrogen fluoride gas into a chamber 40, wherein a part or whole of an inner surface of the chamber 40 is formed of Al or Al alloy which has not been subjected to surface oxidation treatment. The chamber 40 includes a lid 52 closing an upper opening of a chamber main body 51, and at least an inner surface of the lid 52 is formed of the Al or Al alloy which has not been subjected to alumite treatment.
摘要翻译： [问题]提供一种能够防止氟化氢与室的内表面粘附的基板处理装置。 [解决手段]在室内容纳和处理基板W的装置包括用于将氟化氢气体供应到室40中的氟化氢气体供给路径61，其中形成室40的内表面的一部分或全部的未经表面氧化处理的Al或Al合金。室40包括封闭室主体51的上开口的盖52，并且盖52的至少内表面由未进行防氧化处理的Al或Al合金形成。

4. 发明申请

US20120178263A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工设备
公开(公告)号：US20120178263A1
公开(公告)日：2012-07-12
申请号：US13423722
申请日：2012-03-19
申请人： Shigeki TOZAWA , Yusuke Muraki , Tadashi Ilno , Daisuke Hayashi
发明人： Shigeki TOZAWA , Yusuke Muraki , Tadashi Ilno , Daisuke Hayashi
IPC分类号： H01L21/31
CPC分类号： H01L21/02057 , H01L21/6719 , H01L21/67207 , H01L21/823807 , H01L21/823814 , H01L29/165 , H01L29/66636 , H01L29/7848
摘要： [Problem] To provide a substrate processing apparatus capable of preventing adherence of hydrogen fluoride to an inner surface the like of a chamber.[Means for Solving] An apparatus housing and processing a substrate W in a chamber includes a hydrogen fluoride gas supply path 61 for supplying a hydrogen fluoride gas into a chamber 40, wherein a part or whole of an inner surface of the chamber 40 is formed of Al or Al alloy which has not been subjected to surface oxidation treatment. The chamber 40 includes a lid 52 closing an upper opening of a chamber main body 51, and at least an inner surface of the lid 52 is formed of the Al or Al alloy which has not been subjected to alumite treatment.
摘要翻译： [问题]提供一种能够防止氟化氢与室的内表面粘附的基板处理装置。 [解决手段]在室内容纳和处理基板W的装置包括用于将氟化氢气体供应到室40中的氟化氢气体供给路径61，其中形成室40的内表面的一部分或全部的未经表面氧化处理的Al或Al合金。室40包括封闭室主体51的上开口的盖52，并且盖52的至少内表面由未进行防氧化处理的Al或Al合金形成。

5. 发明申请

US20110035957A1 GAS PROCESSING APPARATUS, GAS PROCESSING METHOD, AND STORAGE MEDIUM 审中-公开
标题翻译：气体加工设备，气体加工方法和储存介质
公开(公告)号：US20110035957A1
公开(公告)日：2011-02-17
申请号：US12439960
申请日：2007-12-20
申请人： Yusuke Muraki , Shigeki Tozawa
发明人： Yusuke Muraki , Shigeki Tozawa
IPC分类号： F26B25/00
CPC分类号： H01L21/31116 , H01L21/02057 , H01L21/67173 , H01L21/67742 , H01L21/67745 , H01L21/67748
摘要： A gas processing apparatus includes a chamber 40 configured to accommodate a wafer W; a transfer mechanism 17 configured to continuously transfer a plurality of wafers W one by one into the chamber 40; a gas supply mechanism configured to supply into the chamber 40 a process gas having a clinging property and prepared for performing a gas process on each of the wafers W; and a control section 90 preset to control the gas supply mechanism and the transfer mechanism to supply the process gas into the chamber before transferring a first target object into the chamber, and then to transfer the first target object into the chamber after the elapse of a predetermined time.
摘要翻译：气体处理装置包括：构造成容纳晶片W的室40; 传送机构17，被配置为将多个晶片W一个一个地连续地传送到室40中; 气体供给机构，其构造成向所述室40供给具有附着性并且准备用于对所述晶片W进行气体处理的处理气体; 以及控制部90，用于控制气体供给机构和传送机构，以在将第一目标物体转移到室内之前将处理气体供给到室中，然后在经过了第一目标物体之后将第一目标物体转移到室中预定时间

6. 发明申请

US20100216296A1 Processing Method and Recording Medium 审中-公开
标题翻译：处理方法和记录介质
公开(公告)号：US20100216296A1
公开(公告)日：2010-08-26
申请号：US12084132
申请日：2006-10-20
申请人： Yusuke Muraki , Shigeki Tozawa , Takehiko Orii
发明人： Yusuke Muraki , Shigeki Tozawa , Takehiko Orii
IPC分类号： H01L21/20 , H01L21/306
CPC分类号： H01L29/165 , H01L21/02057 , H01L29/66636 , H01L29/7834 , H01L29/7848
摘要： [Object] To provide a processing method capable of removing an oxide film adhering on a Si layer from the Si layer without adversely affecting parts other than the oxide film and capable of surely forming a SiGe layer with good film quality without roughening the crystal structure of a surface of the Si layer from which the oxide film has been removed, and to provide a recording medium.[Means for Solving the Problems] A processing method for removing an oxide film growing on a surface of a Si layer, and forming a SiGe layer on the surface of the exposed Si layer includes: supplying gas containing a halogen element and basic gas to the surface of the Si layer, and causing the oxide film growing on the surface of the Si layer to chemically react with the gas containing the halogen element and the basic gas to turn the oxide film into a reaction product; removing the reaction product by heating; and thereafter forming the SiGe layer on the surface of the exposed Si layer.
摘要翻译：本发明提供一种能够从Si层除去附着在Si层上的氧化膜的处理方法，而不会不利地影响氧化膜以外的部分，并且能够确保形成具有良好膜质量的SiGe层，而不会使晶体结构变粗糙已经除去氧化膜的Si层的表面，并提供记录介质。解决问题的手段用于去除在Si层表面生长的氧化膜并在暴露的Si层的表面上形成SiGe层的处理方法包括：将含有卤素元素和碱性气体的气体供给到使Si层表面生长的氧化膜与含有卤素元素和碱性气体的气体发生化学反应，将氧化膜转化成反应产物; 通过加热除去反应产物; 然后在暴露的Si层的表面上形成SiGe层。

7. 发明申请

US20080254636A1 Etching of silicon oxide film 有权
标题翻译：刻蚀氧化硅膜
公开(公告)号：US20080254636A1
公开(公告)日：2008-10-16
申请号：US12078958
申请日：2008-04-08
申请人： Shigeki Tozawa , Yusuke Muraki
发明人： Shigeki Tozawa , Yusuke Muraki
IPC分类号： H01L21/306
CPC分类号： H01L21/31138 , H01L21/67069 , H01L21/67155
摘要： An etching method includes preparing a target object such that a first oxide film made of silicon oxide containing at least one of B and P is formed on a substrate, a second oxide film made of silicon oxide containing neither of B and P is formed on the first oxide film, and a contact portion is present below an interface between the first oxide film and the second oxide film. The etching method further includes etching the second oxide film and the first oxide film, thereby forming a hole reaching the contact portion, and etching the first oxide film by a dry process using a gas containing HF, thereby expanding a portion of the hole adjacent to an upper side of the contact portion and inside the first oxide film.
摘要翻译：蚀刻方法包括制备目标物体，使得在基板上形成由含有B和P中的至少一个的氧化硅制成的第一氧化物膜，在不含有B和P的氧化硅中形成的第二氧化物膜形成在第一氧化物膜和接触部分存在于第一氧化物膜和第二氧化物膜之间的界面之下。蚀刻方法还包括蚀刻第二氧化物膜和第一氧化物膜，从而形成到达接触部分的孔，并且通过使用含有HF的气体的干法来蚀刻第一氧化物膜，从而使孔的一部分与接触部分的上侧和第一氧化膜内部。

8. 发明授权

US09153465B2 Substrate stage, substrate processing apparatus and substrate processing system 有权
标题翻译：基板台，基板加工装置及基板处理系统
公开(公告)号：US09153465B2
公开(公告)日：2015-10-06
申请号：US13172317
申请日：2011-06-29
申请人： Masaya Odagiri , Yusuke Muraki , Jin Fujihara
发明人： Masaya Odagiri , Yusuke Muraki , Jin Fujihara
IPC分类号： C23C16/50 , C23C16/00 , C23F1/00 , H01L21/306 , H01L21/67 , C23C16/40 , C23C16/458 , C23C16/46 , H01L21/687
CPC分类号： H01L21/6719 , C23C16/401 , C23C16/4582 , C23C16/46 , H01L21/67109 , H01L21/68742 , H01L21/68771 , H01L21/68785 , Y10T156/17 , Y10T156/1702
摘要： A substrate stage for mounting a substrate thereon includes a peripheral stage member on which a peripheral substrate portion of the substrate may be mounted, the peripheral substrate portion controlling a temperature of the peripheral substrate portion, a central stage member on which a central substrate portion of the substrate may be mounted, the central substrate portion controlling a temperature of the central substrate portion, and a support base that supports the peripheral stage member and the central stage member. A gap is formed between the peripheral stage member and the central stage member to keep the peripheral stage member and the central stage member from coming in contact with each other.
摘要翻译：用于在其上安装基板的基板台包括：外围台构件，可以在其上安装基板的外围基板部分，外围基板部分控制周边基板部分的温度;中心台构件，其中中心基板部分可以安装基板，中央基板部分控制中心基板部分的温度，以及支撑基座，其支撑外围台架部件和中央台部部件。在周边台架部件和中央台架部件之间形成间隙，以使周边台架部件和中央台部部件相互接触。

9. 发明授权

US08353986B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US08353986B2
公开(公告)日：2013-01-15
申请号：US11391390
申请日：2006-03-29
申请人： Yoshiaki Sasaski , Yusuke Muraki , Eiichi Nishimura , Yuko Ono
发明人： Yoshiaki Sasaski , Yusuke Muraki , Eiichi Nishimura , Yuko Ono
IPC分类号： C23F1/00 , C23C16/00 , H01L21/306
CPC分类号： H01L21/67742 , C23C16/4412 , C23C16/54 , H01L21/67017
摘要： In a substrate processing apparatus comprising a processing unit where a specific type of processing is executed on a wafer and a transfer chamber through which a wafer is carried into/out of the processing unit, the transfer chamber includes an air intake unit through which external air is drawn into the transfer chamber, a discharge unit disposed so as to face opposite the air intake unit, through which the discharge gas in the transfer chamber is discharged and a discharge gas filtering means disposed at the discharge unit and constituted with a harmful constituent eliminating filter through which a harmful constituent contained in the discharge gas, at least, is eliminated.
摘要翻译：在包括处理单元的基板处理设备中，其中在晶片上执行特定类型的处理和通过晶片被输送到处理单元的传送室，传送室包括进气单元，通过该进气单元，被抽吸到传送室中，排出单元设置成与进气单元相对，排气口中的排出气体通过排出单元排出，排出气体过滤装置设置在排出单元处，并且构成消除有害成分至少消除了排出气体中含有的有害成分的过滤器。

10. 发明授权

US07897498B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07897498B2
公开(公告)日：2011-03-01
申请号：US11794325
申请日：2005-11-29
申请人： Glenn Gale , Yoshihiro Hirota , Yusuke Muraki , Genji Nakamura , Masato Kushibiki , Naoki Shindo , Akitaka Shimizu , Shigeo Ashigaki , Yoshihiro Kato
发明人： Glenn Gale , Yoshihiro Hirota , Yusuke Muraki , Genji Nakamura , Masato Kushibiki , Naoki Shindo , Akitaka Shimizu , Shigeo Ashigaki , Yoshihiro Kato
IPC分类号： H01L21/336 , H01L21/8324 , H01L21/76 , H01L21/3205 , H01L21/4763
CPC分类号： H01L21/28123 , H01L21/31111 , H01L21/31144 , H01L21/32139 , Y10S438/931
摘要： The present invention is a method of manufacturing a semiconductor device from a layered body including: a semiconductor substrate; a high dielectric film formed on the semiconductor substrate; and an SiC-based film formed on a position upper than the high dielectric film, the SiC-based film having an anti-reflective function and a hardmask function. The present invention comprises a plasma-processing step for plasma-processing the SiC-based film and the high dielectric film to modify the SiC-based film and the high dielectric film by an action of a plasma; and a cleaning step for wet-cleaning the SiC-based film and the high dielectric film modified in the plasma-processing step to collectively remove the SiC-based film and the high dielectric film.
摘要翻译：本发明是一种从层叠体制造半导体器件的方法，包括：半导体衬底; 形成在所述半导体基板上的高电介质膜; 以及形成在高于高介电膜的位置的SiC基膜，所述SiC基膜具有抗反射功能和硬掩模功能。本发明包括等离子体处理步骤，用于等离子体处理SiC基膜和高介电膜，以通过等离子体的作用改性SiC基膜和高介电膜; 以及用于湿式清洁在等离子体处理步骤中改性的SiC基膜和高介电膜的清洁步骤，以共同地去除SiC基膜和高介电膜。

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