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    • 2. 发明授权
    • Mask pattern preparation method, semiconductor device manufacturing method and recording medium
    • 掩模图案制备方法,半导体器件制造方法和记录介质
    • US07793252B2
    • 2010-09-07
    • US12222479
    • 2008-08-11
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • G06F17/50G03F9/00
    • G03F7/70433G03F7/705
    • A lithography simulation method includes: taking in design data of a pattern to be formed on a substrate and mask data to prepare a mask pattern used in forming a latent image of the pattern on the substrate by transmission of an energy ray; obtaining the latent image of the pattern by calculation of an intensity of the energy ray; locally changing, at least in a portion corresponding to a pattern to be interested, a relative position in a direction of the intensity of the energy ray between a latent image curve and a reference intensity line in accordance with a distance between the pattern to be interested and a pattern of a neighboring region, the latent image curve being an intensity distribution curve of the energy ray constituting the latent image, the reference intensity line being defined to specify a position of an edge of the pattern to be interested; and calculating a distance between intersections of a portion of the latent image curve corresponding to the pattern to be interested and the reference intensity line in the changed relative position to define an interested line width of the pattern to be interested.
    • 光刻模拟方法包括:获取要在基板上形成的图案的设计数据,并且掩模数据,以通过透射能量线来制备用于在基板上形成图案的潜像所使用的掩模图案; 通过计算能量射线的强度来获得图案的潜像; 至少在与感兴趣的图案对应的部分中,根据感兴趣的图案之间的距离,在潜像图像曲线和参考强度线之间的能量射线的强度的方向上的相对位置 以及相邻区域的图案,所述潜像曲线是构成所述潜像的能量射线的强度分布曲线,所述基准强度线被定义为指定所述图案的边缘的位置; 以及计算与感兴趣的图案对应的潜在图像曲线的一部分的交点与变化的相对位置中的基准强度线之间的距离,以定义感兴趣的图案的感兴趣的线宽。
    • 10. 发明授权
    • Method and system for correcting a mask pattern design
    • 用于校正掩模图案设计的方法和系统
    • US07571417B2
    • 2009-08-04
    • US11012494
    • 2004-12-16
    • Kyoko IzuhaShigeki NojimaToshiya KotaniSatoshi Tanaka
    • Kyoko IzuhaShigeki NojimaToshiya KotaniSatoshi Tanaka
    • G06F17/50
    • G03F7/70441G03F1/36
    • A pattern verification method includes preparing a desired pattern and a mask pattern forming the desired pattern on a substrate, defining at least one evaluation point on an edge of the desired pattern, defining at least one process parameter to compute the transferred/formed pattern, defining a reference value and a variable range for each of the process parameters, and computing a positional displacement for each first points corresponding to the evaluation point, first points computed using correction mask pattern and a plurality of combinations of parameter values obtained by varying the process parameters within the variable range or within the respective variable ranges. The positional displacement is a displacement between first point and the evaluation point. The method further includes computing a statistics of the positional displacements for each of the evaluation points, and outputting information modifying the mask pattern according to the statistics.
    • 模式验证方法包括在衬底上制备期望图案和形成期望图案的掩模图案,在期望图案的边缘上限定至少一个评估点,限定至少一个过程参数以计算所转移/形成的图案,定义 针对每个处理参数的参考值和可变范围,并且计算与评估点相对应的每个第一点的位置偏移,使用校正掩模图案计算的第一点和通过改变处理参数获得的参数值的多个组合 在可变范围内或在相应的可变范围内。 位置偏移是第一点与评价点之间的位移。 该方法还包括计算每个评估点的位置偏移的统计量,并根据统计信息输出修改掩模图案的信息。