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1. 发明授权

US07520795B2 Grooved retaining ring 失效
标题翻译：沟槽护环
公开(公告)号：US07520795B2
公开(公告)日：2009-04-21
申请号：US11468267
申请日：2006-08-29
申请人： Shi-Ping Wang , Alain Duboust , Antoine P. Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
发明人： Shi-Ping Wang , Alain Duboust , Antoine P. Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/32
摘要： A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.
摘要翻译：描述了用于化学机械抛光的保持环。环具有具有不相交槽的底面。交替的槽彼此成相对的角度。

2. 发明申请

US20090061617A1 EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY 审中-公开
标题翻译：带ECMP技术的边缘除鳞工艺
公开(公告)号：US20090061617A1
公开(公告)日：2009-03-05
申请号：US11849714
申请日：2007-09-04
申请人： Alain Duboust , Jose Salas-Vernis , Antoine P. Manens
发明人： Alain Duboust , Jose Salas-Vernis , Antoine P. Manens
IPC分类号： H01L21/3063
CPC分类号： H01L21/3063 , H01L21/02087
摘要： A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using a power ring configured to electro polish an edge of the substrate are provided. The electro polishing of the substrate edge may occur simultaneously with the electrochemical mechanical processing of a substrate face. In certain embodiments a method of electrochemically polishing a substrate having a conductive material disposed thereon is provided. A substrate is coupled with a carrier head comprising a power ring which surrounds an edge of the substrate, wherein the edge of the substrate includes the conductive material. A polishing pad is contacted with a face of the substrate. A first voltage is applied to the power ring to remove conductive material from the edge of the substrate. A second voltage different from the first voltage is applied to the polishing pad to remove a portion of the conductive material from the face of the substrate.
摘要翻译：提供了一种用于使用构造为电抛光衬底的边缘的功率环沿着衬底的边缘去除沉积的导电层的方法和装置。衬底边缘的电抛光可以与衬底面的电化学机械加工同时发生。在某些实施例中，提供了一种电化学抛光其上布置有导电材料的基板的方法。衬底与包括围绕衬底的边缘的功率环的载体头耦合，其中衬底的边缘包括导电材料。抛光垫与基板的表面接触。向功率环施加第一电压以从衬底的边缘去除导电材料。将不同于第一电压的第二电压施加到抛光垫，以从衬底的表面去除一部分导电材料。

3. 发明申请

US20110132884A1 LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING 审中-公开
标题翻译：激光模块和薄膜太阳能电池板激光扫描的工艺
公开(公告)号：US20110132884A1
公开(公告)日：2011-06-09
申请号：US12851442
申请日：2010-08-05
申请人： Antoine P. Manens , Wei-Sheng Lei , Wei-Yung Hsu , Bassam Shamoun , Yan Wang
发明人： Antoine P. Manens , Wei-Sheng Lei , Wei-Yung Hsu , Bassam Shamoun , Yan Wang
IPC分类号： B23K26/00
CPC分类号： H01L31/18 , B23K26/0673 , B23K26/082 , B23K26/364
摘要： Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface.
摘要翻译：提供激光划线的激光系统。该系统包括通过电缆耦合到激光模块的远程模块。远程模块包括控制器和冷却器。激光模块至少具有激光源和冷却板。激光模块可操作以从工件的至少一部分去除材料。该系统还包括通过多根光纤耦合到激光模块的多个端接模块。每个终端模块包括机械接口。机械接口耦合到相应的光纤。该系统还包括可操作以控制来自激光器的输出位置的多个扫描装置。每个扫描装置耦合到相应的机械接口。

4. 发明授权

US08066552B2 Multi-layer polishing pad for low-pressure polishing 有权
标题翻译：用于低压抛光的多层抛光垫
公开(公告)号：US08066552B2
公开(公告)日：2011-11-29
申请号：US11043361
申请日：2005-01-26
申请人： Alain Duboust , Shou-Sung Chang , Wei Lu , Siew Neo , Yan Wang , Antoine P. Manens , Yongsik Moon
发明人： Alain Duboust , Shou-Sung Chang , Wei Lu , Siew Neo , Yan Wang , Antoine P. Manens , Yongsik Moon
IPC分类号： B24B29/00
CPC分类号： B24B37/013 , B24B37/046 , B24B37/205 , B24B37/22 , B24B37/26 , B24D11/02
摘要： A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.
摘要翻译：抛光垫具有固定到抛光层的抛光层和背衬层。抛光层具有抛光表面，第一厚度，第一可压缩性和约40至80肖氏D之间的硬度。背衬层具有大于第一可压缩性的第二厚度并具有第二可压缩性。第一厚度，第一可压缩性，第二厚度和第二可压缩性使得抛光表面在1.5psi或更小的施加压力下偏转大于抛光层的厚度不均匀性。

5. 发明授权

US06962524B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US06962524B2
公开(公告)日：2005-11-08
申请号：US10642128
申请日：2003-08-15
申请人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
IPC分类号： B23H5/00 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/04 , B24B49/16 , B24B53/007 , B24D13/14 , C25D17/00 , C25D17/10 , H01L21/321 , B24D11/02
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
摘要翻译：提供球组件的实施例。在一个实施例中，球组件包括壳体，球，导电适配器和接触元件。壳体具有延伸到内部通道的第一端的环形座。导电适配器联接到壳体的第二端。接触元件将适配器和球电耦合并保持在座椅和适配器之间的壳体中。

6. 发明申请

US20110139755A1 MULTI-WAVELENGTH LASER-SCRIBING TOOL 审中-公开
标题翻译：多波长激光切割工具
公开(公告)号：US20110139755A1
公开(公告)日：2011-06-16
申请号：US12939137
申请日：2010-11-03
申请人： Antoine P. Manens , Wei-Yung Hsu , Manivannan Thothadri , Arthur Kenichi Yasuda
发明人： Antoine P. Manens , Wei-Yung Hsu , Manivannan Thothadri , Arthur Kenichi Yasuda
IPC分类号： B23K26/00
CPC分类号： B23K26/083 , B23K26/0622 , B23K26/0676 , B23K26/082 , B23K26/364
摘要： Multi-wavelength laser-scribing systems are disclosed. A system for scribing a workpiece includes a frame, a translation stage coupled with the frame to support the workpiece and translate the supported workpiece relative to the frame in a longitudinal direction, at least one laser operable to generate a first output having a first wavelength and generate a second output having a second wavelength, and at least one scanning device coupled with the frame and operable to control a position of the first and second outputs. Each of the first and second outputs are able to remove material from at least a portion of the workpiece. Laser assemblies that each include a laser and at least one scanning device can be arranged in rows to enhance the rate at which latitudinal scribe lines are formed.
摘要翻译：公开了多波长激光划线系统。用于对工件进行划线的系统包括框架，与框架联接以支撑工件并沿着纵向方向平移所支撑的工件相对于框架的平移台，可操作以产生具有第一波长的第一输出的至少一个激光器，以及产生具有第二波长的第二输出，以及至少一个与所述帧耦合的扫描装置，并可操作以控制所述第一和第二输出的位置。第一和第二输出中的每一个能够从工件的至少一部分移除材料。每个包括激光器和至少一个扫描装置的激光组件可以排列成行以增加形成纬线划线的速率。

7. 发明申请

US20100267318A1 POLISHING PAD WITH PROJECTING PORTION 审中-公开
标题翻译：抛光垫与投影部分
公开(公告)号：US20100267318A1
公开(公告)日：2010-10-21
申请号：US12823872
申请日：2010-06-25
申请人： Alain Duboust , Shou-Sung Chang , Wei Lu , Siew Neo , Yan Wang , Antoine P. Manens , Yongsik Moon
发明人： Alain Duboust , Shou-Sung Chang , Wei Lu , Siew Neo , Yan Wang , Antoine P. Manens , Yongsik Moon
IPC分类号： B24D11/02
CPC分类号： B24B37/013 , B24B37/046 , B24B37/205 , B24B37/22 , B24B37/26 , B24D11/02
摘要： A polishing pad include a polishing layer having a polishing surface and a backing layer on a side of the polishing layer opposite the polishing surface. An outer edge of the polishing layer overhangs an outer edge of the backing layer.
摘要翻译：抛光垫包括在抛光层的与研磨表面相对的一侧上具有抛光表面和背衬层的抛光层。抛光层的外边缘突出在背衬层的外边缘上。

8. 发明授权

US07207878B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07207878B2
公开(公告)日：2007-04-24
申请号：US11031545
申请日：2005-01-08
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
IPC分类号： B24D11/00
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

9. 发明授权

US06991528B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US06991528B2
公开(公告)日：2006-01-31
申请号：US10455941
申请日：2003-06-06
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
IPC分类号： B23H3/00 , B23B5/02
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

10. 发明申请

US20110253685A1 LASER PROCESSING SYSTEM WITH VARIABLE BEAM SPOT SIZE 审中-公开
标题翻译：具有可变光束尺寸的激光加工系统
公开(公告)号：US20110253685A1
公开(公告)日：2011-10-20
申请号：US13076422
申请日：2011-03-30
申请人： Wei-Yung Hsu , Antoine P. Manens
发明人： Wei-Yung Hsu , Antoine P. Manens
IPC分类号： B23K26/00
CPC分类号： B23K26/046 , B23K26/364 , B23K26/40 , B23K2103/16 , B23K2103/42 , B23K2103/50
摘要： Systems for scribing a workpiece incorporate a motorized beam expander to change a laser beam spot size incident on a workpiece. A system includes a frame, a laser coupled with the frame and generating an output to remove material from at least a portion of a workpiece, a beam expander positioned along a path of the laser output and having a motorized mechanism operable to vary a beam expansion ratio applied to the laser output, and at least one scanning device coupled with the frame and operable to control a position of the laser output, after expansion, on the workpiece. The motorized beam expander can be used to selectively vary the width of a laser beam supplied to a scanning device so as to selectively vary the size of the laser beam incident on the workpiece. Alternatively, a variable aperture can be used instead of a beam expander.
摘要翻译：用于对工件进行划线的系统包括电动束扩张器以改变入射在工件上的激光束斑点尺寸。一种系统包括框架，激光器与框架耦合并且产生输出以从工件的至少一部分移除材料;沿着激光输出路径定位的光束扩展器，并具有可操作以改变光束膨胀的电动机构以及至少一个与框架耦合的扫描装置，并可操作以控制激光输出在膨胀之后在工件上的位置。电动光束扩展器可以用于选择性地改变提供给扫描装置的激光束的宽度，以便选择性地改变入射在工件上的激光束的尺寸。或者，可以使用可变光圈来代替光束扩展器。

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