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1. 发明授权

US07190005B2 GaN LED with solderable backside metal 有权
标题翻译：具有可焊接背面金属的GaN LED
公开(公告)号：US07190005B2
公开(公告)日：2007-03-13
申请号：US10874104
申请日：2004-06-22
申请人： Shawn R. Gibb , Robert F. Karlicek , Prosanto K. Mukerji , Hari S. Venugopalan , Ivan Eliashevich
发明人： Shawn R. Gibb , Robert F. Karlicek , Prosanto K. Mukerji , Hari S. Venugopalan , Ivan Eliashevich
IPC分类号： H01L33/00 , H01L21/76
CPC分类号： H01L33/40 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting element (24) is disclosed. A light emitting diode (LED) includes a sapphire substrate (26) having front and back sides (33, 35), and a plurality of semiconductor layers (28, 30, 32) deposited on the front side (33) of the sapphire substrate (26). The semiconductor layers (28, 30, 32) define a light-emitting structure that emits light responsive to an electrical input. A metallization stack (40) includes an adhesion layer (34) deposited on the back side (35) of the sapphire substrate (26), and a solderable layer (38) connected to the adhesion layer (34) such that the solderable layer (38) is secured to the sapphire substrate (26) by the adhesion layer (34). A support structure (42) is provided on which the LED is disposed. A solder bond (44) is arranged between the LED and the support structure (42). The solder bond (44) secures the LED to the support structure (42).
摘要翻译：公开了一种发光元件（24）。发光二极管（LED）包括具有正面和背面（33,35）的蓝宝石衬底（26）和沉积在蓝宝石衬底的前侧（33）上的多个半导体层（28,30,32）（26）。半导体层（28,30,32）限定响应于电输入而发光的发光结构。金属化堆叠（40）包括沉积在蓝宝石衬底（26）的背面（35）上的粘合层（34）和连接到粘合层（34）的可焊接层（38），使得可焊层（ 38）通过粘合层（34）固定到蓝宝石衬底（26）。设置有LED的支撑结构（42）。在LED和支撑结构（42）之间布置有焊料接合（44）。焊接接合（44）将LED固定到支撑结构（42）。

2. 发明授权

US06787435B2 GaN LED with solderable backside metal 有权
标题翻译：具有可焊接背面金属的GaN LED
公开(公告)号：US06787435B2
公开(公告)日：2004-09-07
申请号：US10064359
申请日：2002-07-05
申请人： Shawn R. Gibb , Robert F. Karlicek , Prosanto K. Mukerji , Hari S. Venugopalan , Ivan Eliashevich
发明人： Shawn R. Gibb , Robert F. Karlicek , Prosanto K. Mukerji , Hari S. Venugopalan , Ivan Eliashevich
IPC分类号： H01L2120
CPC分类号： H01L33/40 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting element (24) is disclosed. A light emitting diode (LED) includes a sapphire substrate (26) having front and back sides (33, 35), and a plurality of semiconductor layers (28, 30, 32) deposited on the front side (33) of the sapphire substrate (26). The semiconductor layers (28, 30, 32) define a light-emitting structure that emits light responsive to an electrical input. A metallization stack (40) includes an adhesion layer (34) deposited on the back side (35) of the sapphire substrate (26), and a solderable layer (38) connected to the adhesion layer (34) such that the solderable layer (38) is secured to the sapphire substrate (26) by the adhesion layer (34). A support structure (42) is provided on which the LED is disposed. A solder bond (44) is arranged between the LED and the support structure (42). The solder bond (44) secures the LED to the support structure (42).
摘要翻译：公开了一种发光元件（24）。发光二极管（LED）包括具有正面和背面（33,35）的蓝宝石衬底（26）和沉积在蓝宝石衬底的前侧（33）上的多个半导体层（28,30,32）（26）。半导体层（28,30,32）限定响应于电输入而发光的发光结构。金属化堆叠（40）包括沉积在蓝宝石衬底（26）的背面（35）上的粘合层（34）和连接到粘合层（34）的可焊接层（38），使得可焊层（ 38）通过粘合层（34）固定到蓝宝石衬底（26）。设置有LED的支撑结构（42）。在LED和支撑结构（42）之间布置有焊料接合（44）。焊接接合（44）将LED固定到支撑结构（42）。

3. 发明授权

US07023022B2 Microelectronic package having improved light extraction 失效
标题翻译：微电子封装具有改进的光提取
公开(公告)号：US07023022B2
公开(公告)日：2006-04-04
申请号：US10416996
申请日：2001-11-14
申请人： Ivan Eliashevich , Robert F. Karlicek , Hari Venugopalan
发明人： Ivan Eliashevich , Robert F. Karlicek , Hari Venugopalan
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L33/22 , H01L33/44 , H01L33/46 , H01L2224/16225 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： A light-emitting package includes a substantially transparent substrate having a first surface and a second surface including a lens. The package also includes a light-emitting diode (LED) adapted to emit light having a predetermined wavelength, the LED being secured over the first surface of the substantially transparent substrate. The second surface of the substrate defines a principal light emitting surface of the package. The lens at the second surface has a grating pattern that matches the predetermined wavelength of the light emitted from the LED for controlling the emission geometry of the light emitted by the package. The grating pattern has a radial configuration including a series of circles that are concentric.
摘要翻译：发光封装包括具有第一表面和包括透镜的第二表面的基本上透明的基板。封装还包括适于发射具有预定波长的光的发光二极管（LED），LED固定在基本上透明的基板的第一表面上。衬底的第二表面限定了封装的主发光表面。在第二表面处的透镜具有与从LED发射的光的预定波长匹配的光栅图案，用于控制由封装发射的光的发射几何形状。光栅图案具有包括同心圆的一系列的径向构型。

4. 发明授权

US08092064B2 Tiled illumination assembly and related methods 有权
标题翻译：平铺照明组件及相关方法
公开(公告)号：US08092064B2
公开(公告)日：2012-01-10
申请号：US11757734
申请日：2007-06-04
申请人： Alexei A. Erchak , Robert F. Karlicek , David Doyle , Gianni Taraschi , Michael A. Joffe , Christian Hoepfner
发明人： Alexei A. Erchak , Robert F. Karlicek , David Doyle , Gianni Taraschi , Michael A. Joffe , Christian Hoepfner
IPC分类号： F21V7/04
CPC分类号： G02B6/0085 , G02B6/0018 , G02B6/0028 , G02F1/133615 , G02F2001/133628 , G02F2201/36 , Y10T29/49826
摘要： Illumination assemblies, components, and related methods are described. An illumination assembly is provided that comprises a plurality of illumination tiles each having a light emission surface. The plurality of illumination tiles are arranged in a two-dimensional array. The illumination tiles are constructed and arranged so as to provide a substantially contiguous illumination surface comprising the light emission surfaces of the plurality of the illumination tiles. Each illumination tile is illuminated by at least one solid state light-emitting device. A method of local dimming an illumination assembly of a display (e.g., LCD) backlight unit is also provided.
摘要翻译：描述照明组件，组件和相关方法。提供一种照明组件，其包括多个具有发光表面的照明瓦片。多个照明瓦片被布置成二维阵列。照明瓦片被构造和布置成提供包括多个照明瓦片的光发射表面的基本上邻接的照明表面。每个照明瓦片由至少一个固态发光装置照射。还提供了一种局部调光显示器（例如，LCD）背光单元的照明组件的方法。

5. 外观设计

USD624029S1 LED package 有权
公开(公告)号：USD624029S1
公开(公告)日：2010-09-21
申请号：US29285428
申请日：2007-03-29
申请人： Paul Panaccione , Christian Hoepfner , Georgia Chmielewski , John W. Graff , Robert F. Karlicek , Daniel Mendoza , Michael Denninger
设计人： Paul Panaccione , Christian Hoepfner , Georgia Chmielewski , John W. Graff , Robert F. Karlicek , Daniel Mendoza , Michael Denninger

6. 外观设计

USD578968S1 LED device 有权
标题翻译： LED组装
公开(公告)号：USD578968S1
公开(公告)日：2008-10-21
申请号：US29285469
申请日：2007-03-29
申请人： Robert F. Karlicek , Michael Brattain , Georgia Chmielewski , Rashmi Kumar
设计人： Robert F. Karlicek , Michael Brattain , Georgia Chmielewski , Rashmi Kumar

7. 发明授权

US08110835B2 Switching device integrated with light emitting device 有权
标题翻译：与发光装置集成的开关装置
公开(公告)号：US08110835B2
公开(公告)日：2012-02-07
申请号：US11788347
申请日：2007-04-19
申请人： Rashmi Kumar , Robert F. Karlicek
发明人： Rashmi Kumar , Robert F. Karlicek
IPC分类号： H01L27/15 , G05F3/16
CPC分类号： H05B33/0824 , H05B33/0818 , Y02B20/347 , Y10S362/80
摘要： A light emitting component can include a substrate, a light emitting device supported by the substrate, wherein the light-emitting device has first and second terminals, and a switching element supported by the substrate and having first and second terminals electrically connected to the first and second terminals of the light-emitting device, respectively. The switching element is configured to, at least in part, divert at least some current away from the light emitting device when the switching element is in a closed state. An electrical connection between the first terminal of the switching element and the first terminal of the light emitting device can have a length of less than 5 cm (e.g., less than 2 cm, less than 1 cm, less than 5 mm, less than 1 mm). A current regulator may be supported by a second substrate and can supply current to the light emitting device.
摘要翻译：发光部件可以包括衬底，由衬底支撑的发光器件，其中发光器件具有第一和第二端子，以及由衬底支撑的开关元件，并且具有电连接到第一和第二端子的第一和第二端子分别是发光装置的第二端子。开关元件被配置为当开关元件处于闭合状态时，至少部分地将至少一些电流转移离开发光器件。开关元件的第一端子和发光器件的第一端子之间的电连接可以具有小于5cm的长度（例如，小于2cm，小于1cm，小于5mm，小于1cm mm）。电流调节器可以由第二衬底支撑并且可以向发光器件供电。

8. 外观设计

USD603352S1 LED package 有权
公开(公告)号：USD603352S1
公开(公告)日：2009-11-03
申请号：US29285430
申请日：2007-03-29
申请人： Paul Panaccione , Christian Hoepfner , Georgia Chmielewski , John W. Graff , Robert F. Karlicek , Daniel Mendoza , Michael Denninger
设计人： Paul Panaccione , Christian Hoepfner , Georgia Chmielewski , John W. Graff , Robert F. Karlicek , Daniel Mendoza , Michael Denninger

9. 外观设计

USD590784S1 LED assembly 有权
标题翻译： LED组装
公开(公告)号：USD590784S1
公开(公告)日：2009-04-21
申请号：US29285431
申请日：2007-03-29
申请人： Robert F. Karlicek , Michael Brattain , Georgia Chmielewski , Rashmi Kumar
设计人： Robert F. Karlicek , Michael Brattain , Georgia Chmielewski , Rashmi Kumar

10. 外观设计

USD576968S1 LED package 有权
公开(公告)号：USD576968S1
公开(公告)日：2008-09-16
申请号：US29285433
申请日：2007-03-29
申请人： Paul Panaccione , Christian Hoepfner , Georgia Chmielewski , John W. Graff , Robert F. Karlicek , Daniel Mendoza , Michael Denninger
设计人： Paul Panaccione , Christian Hoepfner , Georgia Chmielewski , John W. Graff , Robert F. Karlicek , Daniel Mendoza , Michael Denninger

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