专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120156626A1 COATING AND DEVELOPING SYSTEM AND COATING AND DEVELOPING METHOD 审中-公开
标题翻译：涂料与开发体系及涂料与开发方法
公开(公告)号：US20120156626A1
公开(公告)日：2012-06-21
申请号：US13408302
申请日：2012-02-29
申请人： Seiki ISHIDA , Taro Yamamoto
发明人： Seiki ISHIDA , Taro Yamamoto
IPC分类号： G03F7/20
CPC分类号： G03F7/70341 , G03F7/70525 , G03F7/70991 , H01L21/0257
摘要： A coating and developing system for forming a resist film on a substrate by coating the substrate with a liquid resist and developing the resist film after the resist film has been processed by immersion exposure that forms a liquid layer on the surface of the substrate is capable of reducing difference in property among resist films formed on substrates. The coating and developing system includes: a cleaning unit; a carrying means; and a controller. A set time interval is determined such that the substrate is subjected to the immersion exposure process after contact angle drop rate at which contact angle between the cleaning liquid and a surface of the substrate drops has dropped from an initial level at the wetting time point when the surface of the substrate is wetted with the cleaning liquid to a level far lower than the initial level.
摘要翻译：一种用于在基板上形成抗蚀剂膜的涂覆和显影系统，其中通过用液体抗蚀剂涂覆基板并在抗蚀剂膜已经通过在基板表面上形成液体层的浸渍曝光进行处理之后显影抗蚀剂膜，降低在基板上形成的抗蚀剂膜之间的性能差异。涂料和显影系统包括：清洁单元; 携带手段和控制器。确定设定的时间间隔，使得在清洗液和基材表面的接触角下降的接触角下降率在浸润时间点的浸润时间点的初始水平下，使基板经受浸渍曝光处理衬底的表面被清洗液体润湿至远低于初始水平的水平。

2. 发明申请

US20070122737A1 COATING AND DEVELOPING SYSTEM AND COATING AND DEVELOPING METHOD 有权
标题翻译：涂料与开发体系和涂料与开发方法
公开(公告)号：US20070122737A1
公开(公告)日：2007-05-31
申请号：US11562648
申请日：2006-11-22
申请人： Seiki ISHIDA , Taro YAMAMOTO
发明人： Seiki ISHIDA , Taro YAMAMOTO
IPC分类号： G03B27/52 , G03C5/00
CPC分类号： G03F7/70341 , G03F7/70525 , G03F7/70991 , H01L21/0257
摘要： A coating and developing system for forming a resist film on a substrate by coating the substrate with a liquid resist and developing the resist film after the resist film has been processed by immersion exposure that forms a liquid layer on the surface of the substrate is capable of reducing difference in property among resist films formed on substrates. The coating and developing system includes: a cleaning unit for cleaning a surface of a substrate coated with a resist film; a carrying means for taking out the substrate from the cleaning unit and carrying the substrate to an exposure system that carries out an immersion exposure process; and a controller for controlling the carrying means such that a time interval between a wetting time point when the surface of the substrate is wetted with the cleaning liquid by the cleaning unit and a delivery time point when the substrate is delivered to the exposure system is equal to a predetermined set time interval. The set time interval is determined such that the substrate is subjected to the immersion exposure process after contact angle drop rate at which contact angle between the cleaning liquid and a surface of the substrate drops has dropped from an initial level at the wetting time point when the surface of the substrate is wetted with the cleaning liquid to a level far lower than the initial level.
摘要翻译：一种用于在基板上形成抗蚀剂膜的涂覆和显影系统，其中通过用液体抗蚀剂涂覆基板并在抗蚀剂膜已经通过在基板表面上形成液体层的浸渍曝光进行处理之后显影抗蚀剂膜，降低在基板上形成的抗蚀剂膜之间的性能差异。该涂覆和显影系统包括：用于清洁涂覆有抗蚀剂膜的基材的表面的清洁单元; 用于从所述清洁单元取出所述基板并将所述基板运送到进行浸没曝光处理的曝光系统的承载装置; 以及控制器，用于控制所述承载装置，使得当所述基板的表面被所述清洁单元与所述清洁液体接触的润湿时间点与所述基板被输送到所述曝光系统时的传送时间点之间的时间间隔相等到预定的设定时间间隔。确定设定时间间隔，使得在清洗液与基材表面之间的接触角下降的接触角下降率在浸润时间点的浸润时间点的初始水平下，使基板经受浸渍曝光处理衬底的表面被清洗液体润湿至远低于初始水平的水平。

3. 发明申请

US20100108095A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE CLEANING METHOD 审中-公开
标题翻译：基板加工设备和基板清洗方法
公开(公告)号：US20100108095A1
公开(公告)日：2010-05-06
申请号：US12611143
申请日：2009-11-03
申请人： Nobuhiko MOURI , Seiki ISHIDA , Kenji SEKIGUCHI , Takehiko ORII
发明人： Nobuhiko MOURI , Seiki ISHIDA , Kenji SEKIGUCHI , Takehiko ORII
IPC分类号： B08B3/00
CPC分类号： H01L21/67051
摘要： Disclosed are a substrate processing apparatus and a substrate cleaning method to satisfactorily clean the entire circumferential periphery of a substrate, including an upper surface circumferential periphery, an end, and a lower surface circumferential periphery of the substrate. The substrate processing apparatus includes a substrate supporter to support the substrate, a first cleaner to clean the upper surface circumferential periphery of the substrate with a pressurized cleaning liquid, and a second cleaner to clean the end and the lower surface circumferential periphery of the substrate while contacting the end and the lower surface circumferential periphery of the substrate with a cleaning member. The first cleaner cleans the upper surface circumferential periphery of the substrate, and the second cleaner cleans the end and the lower surface circumferential periphery of the substrate.
摘要翻译：公开了一种基板处理装置和基板清洗方法，以令人满意地清洁基板的整个周缘，包括基板的上表面周向周向，端部和下表面周向周边。基板处理装置包括用于支撑基板的基板支撑件，用加压清洗液清洁基板的上表面圆周的第一清洁器和用于清洁基板的端部和下表面周向周边的第二清洁器，同时使基板的端面和下表面周边与清洁件接触。第一清洁剂清洁基板的上表面周向周边，并且第二清洁器清洁基板的端部和下表面周向周边。

4. 发明申请

US20080130226A1 CENTRIFUGAL FAN DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME 审中-公开
标题翻译：离心风扇装置和具有该风扇装置的电子装置
公开(公告)号：US20080130226A1
公开(公告)日：2008-06-05
申请号：US11947739
申请日：2007-11-29
申请人： Akitomo YAMASHITA , Seiki ISHIDA
发明人： Akitomo YAMASHITA , Seiki ISHIDA
IPC分类号： H05K7/20 , F04D29/54
CPC分类号： H05K7/20172 , F04D29/281 , F04D29/30 , F04D29/667
摘要： A centrifugal fan device includes a centrifugal fan having a hub portion having a cylindrical outer peripheral surface and a plurality of blade portions extended in a centrifugal direction from the outer peripheral surface of the hub portion, and a fan casing which rotatably accommodates the centrifugal fan therein and includes a pair of inlets having an equal diameter and disposed opposite to each other with the centrifugal fan interposed therebetween, a convex portion is provided on a positive pressure face of the blade portion for receiving a wind when the blade portion is rotated, and one of ends of the convex portion is disposed on an inside of a projection region of the blade portion surrounded by an outer periphery of the inlet projected onto the blade portion and the other end of the convex portion is disposed on an outside of the projection region and an inside separated from a tip of the blade portion by a first predetermined distance.
摘要翻译：一种离心式风扇装置，具有：离心风扇，其具有圆筒状的外周面的轮毂部和从轮毂部的外周面向离心方向延伸的多个叶片部，以及将离心风扇可转动地容纳在其中的风扇壳体并且包括一对具有相同直径并且彼此相对设置的入口，其间插入有离心风扇，在叶片部分的正压面上设置有凸起部分，用于当叶片部分旋转时接收风，并且一个凸部的端部设置在由突出在叶片部分上的入口的外周围围的叶片部分的突出区域的内侧，凸部的另一端设置在突出区域的外侧，与叶片部分的尖端分开第一预定距离的内部。

5. 发明申请

US20110078898A1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工设备
公开(公告)号：US20110078898A1
公开(公告)日：2011-04-07
申请号：US12895576
申请日：2010-09-30
申请人： Seiki ISHIDA , Yukiyoshi SAITO
发明人： Seiki ISHIDA , Yukiyoshi SAITO
IPC分类号： B23P21/00
CPC分类号： H01L21/67184 , H01L21/67051 , H01L21/67173 , H01L21/67178 , H01L21/67742 , Y10T29/53313 , Y10T29/53365 , Y10T29/534
摘要： Disclosed is a substrate processing apparatus which can achieve an improvement in throughput and suppress the reduction in the operation rate of the entire apparatus even when a problem occurs. In the disclosed apparatus, at the rear end of a substrate loading block including a loading/unloading arm for transferring a wafer to a carrier, a first, a second, and a third processing blocks are disposed in that order. In the substrate loading block, transfer stages are provide for transferring a wafer from the loading/unloading arm to the first processing block, for transferring a wafer to the second processing block, and for transferring a wafer to the third processing block so that the wafer on the transfer stage is directly carried to the second processing block by a first direct carrying mechanism, and to the third processing block by a second direct carrying mechanism.
摘要翻译：公开了即使发生问题，也能够实现吞吐量的提高并且抑制整个装置的操作速率的降低的基板处理装置。在所公开的装置中，在包括用于将晶片传送到载体的装载/卸载臂的基板装载块的后端处，按照该顺序设置第一，第二和第三处理块。在基板装载块中，提供传送级用于将晶片从装载/卸载臂传送到第一处理块，用于将晶片传送到第二处理块，以及将晶片传送到第三处理块，使得晶片通过第一直接承载机构将第二处理块直接传送到第二处理块，并通过第二直接传送机构传送到第三处理块。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式