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1. 发明授权

US5779426A Loading and unloading unit for polishing apparatus 失效
标题翻译：抛光装置的装卸单元
公开(公告)号：US5779426A
公开(公告)日：1998-07-14
申请号：US677732
申请日：1996-07-08
申请人： Seiji Ishikawa , Takao Mitsukura
发明人： Seiji Ishikawa , Takao Mitsukura
IPC分类号： B24B37/00 , B24B37/04 , B24B37/30 , B24B41/00 , B24B47/02
CPC分类号： B24B37/345 , B24B41/005 , Y10T29/47
摘要： A polishing apparatus has a turntable and a top ring for gripping a semiconductor wafer to be polished by an abrasive cloth on the turntable. The polishing apparatus incorporates a loading and unloading unit having a supply holder for holding and supplying a semiconductor wafer to be polished to the top ring at a transfer position, and a reception holder for receiving a polished semiconductor wafer from the top ring at the transfer position. The reception holder and the supply holder are mounted on respective opposite ends of a support block which is angularly movable in a vertical plane by a turning mechanism for moving the supply holder and the reception holder alternatively to the transfer position.
摘要翻译：抛光装置具有转盘和顶环，用于夹持通过研磨布在转台上抛光的半导体晶片。抛光装置包括装载和卸载单元，该装载和卸载单元具有用于在转移位置处将要抛光的半导体晶片保持并提供给顶环的供应保持器，以及用于在转移位置处从顶环接收抛光的半导体晶片的接收保持器。接收支架和供电保持器安装在支撑块的相应的相对端上，支撑块的相对的两端可通过转动机构在垂直平面内成角度地移动，用于将供应架和接收架交替地移动到转移位置。

2. 发明申请

US20090067959A1 Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus 审中-公开
标题翻译：基板处理装置，基板输送装置，基板夹紧装置和药液处理装置
公开(公告)号：US20090067959A1
公开(公告)日：2009-03-12
申请号：US11665963
申请日：2007-02-21
申请人： Nobuyuki Takahashi , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
发明人： Nobuyuki Takahashi , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
IPC分类号： H01L21/67
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707
摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).
摘要翻译：本发明涉及能够提高基板处理的节拍时间的基板处理装置。作为基板处理装置的研磨装置包括：用于研磨半导体晶片（W）的多个研磨部（3a，3b）和用于转印晶片（W）的摆动传送装置（7）。摆动传送器（7）包括适于夹紧晶片（W）的晶片夹紧机构（112），用于沿着晶片夹持机构（102）的框架（102）垂直移动的垂直移动机构（104,106）抛光部分（3a）的外壳和用于使晶片夹紧机构（112）围绕与框架（102）相邻的轴摆动的摆动机构（108,110）。

3. 发明申请

US20120193506A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE CLAMP APPARATUS, AND CHEMICAL LIQUID TREATMENT APPARATUS 审中-公开
标题翻译：基板加工装置，基板转印装置，基板夹装置和化学液体处理装置
公开(公告)号：US20120193506A1
公开(公告)日：2012-08-02
申请号：US13404409
申请日：2012-02-24
申请人： Nobuyuki TAKAHASHI , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
发明人： Nobuyuki TAKAHASHI , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
IPC分类号： F16M11/20
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707
摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.
摘要翻译：本发明涉及能够提高基板处理的节拍时间的基板处理装置。作为基板处理设备的抛光装置包括用于抛光半导体晶片（W）的多个抛光部分和用于传送晶片（W）的摆动传送器。摆动传送器包括适于夹紧晶片（W）的晶片夹持机构，用于沿着抛光部分的壳体的框架垂直移动晶片夹持机构的垂直移动机构，以及用于使晶片夹紧机构摆动的摆动机构靠近框架的轴。

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