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1. 发明授权

US5581065A Sheet-framed IC carrier, method for producing the same, and IC carrier case 失效
公开(公告)号：US5581065A
公开(公告)日：1996-12-03
申请号：US283292
申请日：1994-07-28
申请人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
发明人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
IPC分类号： G06K19/077 , G06K19/06
CPC分类号： G06K19/07739 , G06K19/072 , G06K19/077 , G06K19/07745 , A45C2011/188 , G06K19/07701 , H01L2924/0002
摘要： A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

2. 发明授权

US5757116A Sheet-framed IC carrier, method for producing the same, and IC carrier case 失效
公开(公告)号：US5757116A
公开(公告)日：1998-05-26
申请号：US699034
申请日：1996-08-19
申请人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
发明人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
IPC分类号： G06K19/077 , G06K19/06
CPC分类号： G06K19/07739 , G06K19/072 , G06K19/077 , G06K19/07745 , A45C2011/188 , G06K19/07701 , H01L2924/0002
摘要： A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

3. 发明授权

US06776347B2 Sheet-framed IC carrier, method for producing the same, and IC carrier case 失效
标题翻译：片式IC载体，其制造方法和IC载体壳体
公开(公告)号：US06776347B2
公开(公告)日：2004-08-17
申请号：US10032496
申请日：2002-01-02
申请人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
发明人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
IPC分类号： G06K1500
CPC分类号： G06K19/07739 , A45C2011/188 , G06K19/072 , G06K19/077 , G06K19/07701 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
摘要翻译：片状IC载体具有具有温度的片材框架，并且在其一个表面上具有粘合到片材框架的后表面的压敏粘合剂层的背衬膜。具有IC模块的IC载体被固定在片框的温度中，粘合层在背衬膜上。当IC载体从薄片框架IC载体上移除时，不会对IC模块施加过大的负载，并且在载体基座的周边边缘上不会留下凸起。

4. 发明授权

US06398114B1 Sheet-framed IC carrier, method for producing the same, and IC carrier case 失效
标题翻译：片式IC载体，其制造方法和IC载体壳体
公开(公告)号：US06398114B1
公开(公告)日：2002-06-04
申请号：US08961501
申请日：1997-10-30
申请人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
发明人： Seiichi Nishikawa , Hiroshi Harima , Kazuyoshi Irisawa , Jun Takahashi , Akiko Moriyama , Mayumi Inada , Yoshikazu Fukushima , Masaki Wakamatsu
IPC分类号： G06K1906
CPC分类号： G06K19/07739 , A45C2011/188 , G06K19/072 , G06K19/077 , G06K19/07701 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
摘要翻译：片状IC载体具有带有孔的片状框架，并且在其一个表面上具有粘合到片材框架的后表面的压敏粘合剂层的背衬膜。具有IC模块的IC载体被固定在片状框架的孔中，粘合剂层固定在背衬膜上。当IC载体从薄片框架IC载体上移除时，不会对IC模块施加过大的负载，并且在载体基座的周边边缘上不会留下凸起。

5. 发明授权

US6076737A Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module 失效
标题翻译：制造具有保护IC模块的集成电路（IC）卡的装置和方法
公开(公告)号：US6076737A
公开(公告)日：2000-06-20
申请号：US377921
申请日：1999-08-20
申请人： Masao Gogami , Yoshikazu Fukushima
发明人： Masao Gogami , Yoshikazu Fukushima
IPC分类号： G06K19/077 , G06K19/06
CPC分类号： G06K19/07747 , G06K19/07728 , G06K19/07745 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701
摘要： An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.
摘要翻译： IC卡（1）具有基卡（2）和放置在形成在基卡（2）的一个表面上的空腔中的IC模块（10）。 IC模块（10）包括基板（11），形成在基板（11）的一个表面上的接触层（15），安装在基板（11）的另一个表面上的IC芯片（12）框架（14）附接到基板（11）的另一个表面。由框架（14）限定的空间用封装树脂（13）填充以封装IC芯片（12）。在相同负载下，基板（11）在预定负载下的每单位长度的偏转大于基板（2）的偏转。当向IC卡（1）施加弯曲力时，IC芯片（12）周围的部分被封装树脂（13）和框架（14）以及基板（11）的除围绕IC芯片（12）的部分大大地变形以吸收弯曲力。

6. 发明授权

US5975420A Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module 失效
标题翻译：制造具有保护IC模块的集成电路（IC）卡的装置和方法
公开(公告)号：US5975420A
公开(公告)日：1999-11-02
申请号：US750063
申请日：1996-12-03
申请人： Masao Gogami , Yoshikazu Fukushima
发明人： Masao Gogami , Yoshikazu Fukushima
IPC分类号： G06K19/077 , G06K19/06
CPC分类号： G06K19/07747 , G06K19/07728 , G06K19/07745 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701
摘要： An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.
摘要翻译： PCT No.PCT / JP95 / 00986 Sec。 371日期1996年12月3日第 102（e）日期1996年12月3日PCT 1996年4月10日PCT公布。 WO96 / 32696 PCT公开号日期1996年10月17日IC卡（1）具有基卡（2）和放置在形成在基卡（2）的一个表面上的空腔中的IC模块（10）。 IC模块（10）包括基板（11），形成在基板（11）的一个表面上的接触层（15），安装在基板（11）的另一个表面上的IC芯片（12）框架（14）附接到基板（11）的另一个表面。由框架（14）限定的空间用封装树脂（13）填充以封装IC芯片（12）。在相同负载下，基板（11）在预定负载下的每单位长度的偏转大于基板（2）的偏转。当向IC卡（1）施加弯曲力时，IC芯片（12）周围的部分被封装树脂（13）和框架（14）以及基板（11）的除围绕IC芯片（12）的部分大大地变形以吸收弯曲力。

7. 发明授权

US4768469A Operation control apparatus for recovery boilers 失效
标题翻译：回收锅炉操作控制装置
公开(公告)号：US4768469A
公开(公告)日：1988-09-06
申请号：US90425
申请日：1987-08-26
申请人： Kazuyuki IIzuka , Tsuguo Kumaki , Ryuichi Kuwata , Iwao Chikahisa , Yoshikazu Fukushima , Youhei Shiokoshi , Takao Matsuda , Masaru Nishimura , Takashi Tanihara , Yoshimitsu Kurosaki , Toshiyuki Itoko , Shirou Nakabayashi
发明人： Kazuyuki IIzuka , Tsuguo Kumaki , Ryuichi Kuwata , Iwao Chikahisa , Yoshikazu Fukushima , Youhei Shiokoshi , Takao Matsuda , Masaru Nishimura , Takashi Tanihara , Yoshimitsu Kurosaki , Toshiyuki Itoko , Shirou Nakabayashi
IPC分类号： F23N1/08 , F23N5/08 , F23N5/00
CPC分类号： F23N1/082 , F23N5/082
摘要： An apparatus for controlling operation of a recovery boiler for compensating a predetermined reference temperature of black liquor by a compensation value in accordance with a type of an injecting gun provided in the boiler, a compensation value set by the properties of the black liquor, a compensation value set by the temperature of charbed and a compensation value set by an air flow rate to the boiler representing the magnitude of boiler steam output or load to control the black liquor temperature supplied to the boiler.
摘要翻译：一种用于控制回收锅炉的操作的装置，用于根据设在锅炉中的喷射枪的类型，补偿值补偿黑液的预定参考温度，由黑液的性质设定的补偿值，补偿由锅炉蒸汽输出或负荷的大小计算的锅炉温度和通过锅炉的空气流量设定的补偿值，以控制供应给锅炉的黑液温度。

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