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1. 发明授权

US5975420A Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module 失效
标题翻译：制造具有保护IC模块的集成电路（IC）卡的装置和方法
公开(公告)号：US5975420A
公开(公告)日：1999-11-02
申请号：US750063
申请日：1996-12-03
申请人： Masao Gogami , Yoshikazu Fukushima
发明人： Masao Gogami , Yoshikazu Fukushima
IPC分类号： G06K19/077 , G06K19/06
CPC分类号： G06K19/07747 , G06K19/07728 , G06K19/07745 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701
摘要： An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.
摘要翻译： PCT No.PCT / JP95 / 00986 Sec。 371日期1996年12月3日第 102（e）日期1996年12月3日PCT 1996年4月10日PCT公布。 WO96 / 32696 PCT公开号日期1996年10月17日IC卡（1）具有基卡（2）和放置在形成在基卡（2）的一个表面上的空腔中的IC模块（10）。 IC模块（10）包括基板（11），形成在基板（11）的一个表面上的接触层（15），安装在基板（11）的另一个表面上的IC芯片（12）框架（14）附接到基板（11）的另一个表面。由框架（14）限定的空间用封装树脂（13）填充以封装IC芯片（12）。在相同负载下，基板（11）在预定负载下的每单位长度的偏转大于基板（2）的偏转。当向IC卡（1）施加弯曲力时，IC芯片（12）周围的部分被封装树脂（13）和框架（14）以及基板（11）的除围绕IC芯片（12）的部分大大地变形以吸收弯曲力。

2. 发明授权

US6076737A Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module 失效
标题翻译：制造具有保护IC模块的集成电路（IC）卡的装置和方法
公开(公告)号：US6076737A
公开(公告)日：2000-06-20
申请号：US377921
申请日：1999-08-20
申请人： Masao Gogami , Yoshikazu Fukushima
发明人： Masao Gogami , Yoshikazu Fukushima
IPC分类号： G06K19/077 , G06K19/06
CPC分类号： G06K19/07747 , G06K19/07728 , G06K19/07745 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701
摘要： An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.
摘要翻译： IC卡（1）具有基卡（2）和放置在形成在基卡（2）的一个表面上的空腔中的IC模块（10）。 IC模块（10）包括基板（11），形成在基板（11）的一个表面上的接触层（15），安装在基板（11）的另一个表面上的IC芯片（12）框架（14）附接到基板（11）的另一个表面。由框架（14）限定的空间用封装树脂（13）填充以封装IC芯片（12）。在相同负载下，基板（11）在预定负载下的每单位长度的偏转大于基板（2）的偏转。当向IC卡（1）施加弯曲力时，IC芯片（12）周围的部分被封装树脂（13）和框架（14）以及基板（11）的除围绕IC芯片（12）的部分大大地变形以吸收弯曲力。

3. 发明授权

US4841134A IC card 失效
标题翻译： IC卡
公开(公告)号：US4841134A
公开(公告)日：1989-06-20
申请号：US889277
申请日：1986-07-25
申请人： Yoshiaki Hida , Satoshi Ishihara , Seiji Take , Masao Gogami , Toshiyuki Suzuki
发明人： Yoshiaki Hida , Satoshi Ishihara , Seiji Take , Masao Gogami , Toshiyuki Suzuki
IPC分类号： G06K19/077
CPC分类号： G06K19/07728 , G06K19/07745 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/3025
摘要： The IC card of the present invention comprises an IC card comprising an IC module embedded in a card substrate, said IC card having a reinforcing sheet layer laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module, and/or has a reinforcing member comprising at least a part of the side portion of said IC module extended in the outer circumferential direction, and it is excellent in mechanical strength and flexibility against bending of card.
摘要翻译：本发明的IC卡包括IC卡，IC卡包括嵌入在卡片基板中的IC模块，所述IC卡具有沿卡片的平面方向铺设的加强片层，以便至少覆盖卡片的边界的周边部分卡片基板和IC模块，和/或具有加强构件，该加强构件包括沿着外周方向延伸的所述IC模块的侧部的至少一部分，并且机械强度和柔性抵抗卡弯曲性优异。

4. 发明授权

US06686650B1 Non-contact data carrier and IC chip 失效
标题翻译：非接触式数据载体和IC芯片
公开(公告)号：US06686650B1
公开(公告)日：2004-02-03
申请号：US09831632
申请日：2001-05-11
申请人： Masao Gogami , Noboru Araki , Yasuko Hirata
发明人： Masao Gogami , Noboru Araki , Yasuko Hirata
IPC分类号： H01L23495
CPC分类号： H01L24/12 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , H01L23/49855 , H01L23/645 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2223/6677 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81191 , H01L2224/81395 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01087 , H01L2924/07802 , H01L2924/14 , H01L2924/15173 , H01L2224/13099 , H01L2924/00 , H01L2224/0401
摘要： The non-contact data carrier has a resin substrate, a metallic antenna coil on the resin substrate, and an IC chip connected to the antenna coil via a plurality of bumps. Each bump of the IC chip has a base on the side of the IC chip body of the data carrier and a projection held by the base via a shoulder. Each bump is connected to the antenna coil by piercing the projection into the antenna coil.
摘要翻译：非接触式数据载体具有树脂基板，树脂基板上的金属天线线圈和经由多个凸块连接到天线线圈的IC芯片。 IC芯片的每个凸块在数据载体的IC芯片主体的一侧具有基座，并且由基座经由肩部保持的突起。每个凸块通过将突起穿入天线线圈而连接到天线线圈。

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