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1. 发明申请

US20100157507A1 ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US20100157507A1
公开(公告)日：2010-06-24
申请号：US12632823
申请日：2009-12-08
申请人： Seiichi MATSUMOTO , Toshiyuki IWANAGA , Makoto OGAWA , Akihiro MOTOKI
发明人： Seiichi MATSUMOTO , Toshiyuki IWANAGA , Makoto OGAWA , Akihiro MOTOKI
IPC分类号： H01G4/228 , H01R43/00 , H01B5/14
CPC分类号： H01G4/30 , H01G4/232
摘要： A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.
摘要翻译：在形成外部电极的电子部件中，通过直接对构成体的表面的特定区域进行电镀，能够精确地控制形成有构成外部电极的镀膜的区域。在构成体中，在形成有外部电极的区域被分隔的位置设置凸块。在电镀工艺中，构成外部电极的镀膜的生长在凸块中基本上停止或延迟。结果，可以在凸块的位置上精确地控制构成外部电极的镀膜的生长终止点。

2. 发明申请

US20100149724A1 METHOD AND APPARATUS FOR PRODUCING A CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：制造陶瓷电子元件的方法和装置
公开(公告)号：US20100149724A1
公开(公告)日：2010-06-17
申请号：US12631924
申请日：2009-12-07
申请人： Makoto OGAWA , Seiichi MATSUMOTO , Akihiro MOTOKI , Toshiyuki IWANAGA , Tatsuo KUNISHI
发明人： Makoto OGAWA , Seiichi MATSUMOTO , Akihiro MOTOKI , Toshiyuki IWANAGA , Tatsuo KUNISHI
IPC分类号： H01G4/06 , B32B37/04 , C25D5/02 , C25D17/00
CPC分类号： H01G4/00 , C23C18/1632 , C23C18/1657 , C23C18/31 , C25D1/00 , C25D1/10 , H01G4/232 , H01G4/30 , H01G13/006 , Y10T29/43
摘要： A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.
摘要翻译：陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。

3. 发明申请

US20100328843A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20100328843A1
公开(公告)日：2010-12-30
申请号：US12821305
申请日：2010-06-23
申请人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
发明人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
IPC分类号： H01G4/008 , B05D5/12
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature. These steps preliminarily diffuse copper included in the plating layers, which has a relatively high diffusion velocity, into the internal electrodes primarily including nickel, thereby reducing a difference in diffusion velocity between copper and nickel at the top temperature, which causes the occurrence of voids.
摘要翻译：在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后，为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。这些步骤将包含在具有较高扩散速度的镀层中的铜初步扩散到主要包括镍的内部电极中，从而减少了在最高温度下铜和镍之间扩散速度的差异，这导致空隙的发生。

4. 发明申请

US20120058257A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20120058257A1
公开(公告)日：2012-03-08
申请号：US13295151
申请日：2011-11-14
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： B05D5/12
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

5. 发明申请

US20120140374A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20120140374A1
公开(公告)日：2012-06-07
申请号：US13365280
申请日：2012-02-03
申请人： Kenichi KAWASAKI , Shunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Kenichi KAWASAKI , Shunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/12 , H01F5/02 , H01C7/13 , H01L41/047
CPC分类号： H01G4/005 , H01G4/008 , H01G4/232
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译：层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气连接到内部导体的暴露部分。外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。限定下镀层的金属颗粒可以是Cu颗粒。

6. 发明申请

US20120236461A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20120236461A1
公开(公告)日：2012-09-20
申请号：US13419545
申请日：2012-03-14
申请人： Yoji YAMAMOTO , Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Yoji YAMAMOTO , Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/008 , H01C7/13 , H01L41/047 , H01F5/00
CPC分类号： H01C7/008 , H01C1/14 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译：陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。

7. 发明申请

US20100118467A1 LAMINATED CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：层压陶瓷电子元件
公开(公告)号：US20100118467A1
公开(公告)日：2010-05-13
申请号：US12616844
申请日：2009-11-12
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译：在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

8. 发明申请

US20100091426A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20100091426A1
公开(公告)日：2010-04-15
申请号：US12543549
申请日：2009-08-19
申请人： Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Akihiro YOSHIDA , Takayuki KAYATANI
发明人： Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Akihiro YOSHIDA , Takayuki KAYATANI
IPC分类号： H01G4/30 , H01G7/00 , H01G4/005
CPC分类号： H01G4/2325 , H01C1/148 , H01C7/18 , H01G4/30 , Y10T29/435
摘要： A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.
摘要翻译：一种方法用于制造包括多层复合材料的多层电子部件，所述多层复合材料包括具有在所述多层复合材料的预定表面露出的端部的内部电极。在该方法中，内部电极的露出端涂覆有主要由选自Pd，Au，Pt和Ag的至少一种金属的金属膜，并且具有至少约0.1μm的厚度，通过将在含有金属离子或金属络合物的液体中的多层复合材料。然后，通过在暴露于多层复合材料的预定表面的内部电极的端部上沉积电镀金属，随后使电镀金属的沉积物彼此连接而形成连续镀层。因此，内部电极的露出端彼此电连接。

9. 发明申请

US20090323253A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20090323253A1
公开(公告)日：2009-12-31
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/30 , B05D5/12
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译：多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。

10. 发明申请

US20120188683A1 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件和陶瓷电子元件的制造方法
公开(公告)号：US20120188683A1
公开(公告)日：2012-07-26
申请号：US13357671
申请日：2012-01-25
申请人： Syunsuke TAKEUCHI , Teruyo KATAYAMA , Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI
发明人： Syunsuke TAKEUCHI , Teruyo KATAYAMA , Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI
IPC分类号： H01G4/12 , C25D7/00 , H01L41/00 , B05D3/00 , H01F5/00 , H01C7/13 , C25D5/54 , B05D5/00
CPC分类号： H01C1/148 , H01C7/008 , H01C7/18 , H01G4/012 , H01G4/232 , H01G4/30
摘要： A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
摘要翻译：陶瓷电子部件的制造方法包括以下步骤：制备包括多个第一内部电极和多个第二内部电极的陶瓷体，将所述陶瓷体加工成约102％〜约153％的内部电极曝光率，并对其进行电镀，在其上形成镀层。

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