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1. 发明申请

US20120292290A1 SUBSTRATE PROCESSING METHOD, SYSTEM AND PROGRAM 有权
标题翻译：基板处理方法，系统和程序
公开(公告)号：US20120292290A1
公开(公告)日：2012-11-22
申请号：US13565401
申请日：2012-08-02
申请人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
发明人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
IPC分类号： B44C1/22
CPC分类号： H01L21/67748 , H01J37/32743 , H01L21/67201 , H01L21/6831
摘要： A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
摘要翻译：基板处理方法用于具有基板处理装置和基板转印装置的基板处理系统。基板处理方法包括将基板转印的基板转印步骤和对基板执行预定处理的基板处理步骤。基板转印步骤和基板处理步骤包括多个操作，并且同时执行多个操作中的至少两个操作。优选地，基板处理装置包括容纳室，放置在容纳室中以安装在基板上的安装台，以及用于将传热气体供应到安装在安装台上的基板之间的空间的传热气体供应管线和安装台。

2. 发明授权

US08475623B2 Substrate processing method, system and program 有权
标题翻译：基板加工方法，系统和程序
公开(公告)号：US08475623B2
公开(公告)日：2013-07-02
申请号：US13565401
申请日：2012-08-02
申请人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
发明人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
IPC分类号： C23F1/00
CPC分类号： H01L21/67748 , H01J37/32743 , H01L21/67201 , H01L21/6831
摘要： A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
摘要翻译：基板处理方法用于具有基板处理装置和基板转印装置的基板处理系统。基板处理方法包括将基板转印的基板转印步骤和对基板执行预定处理的基板处理步骤。基板转印步骤和基板处理步骤包括多个操作，并且同时执行多个操作中的至少两个操作。优选地，基板处理装置包括容纳室，放置在容纳室中以安装在基板上的安装台，以及用于将传热气体供应到安装在安装台上的基板之间的空间的传热气体供应管线和安装台。

3. 发明授权

US08257601B2 Substrate processing method, system and program 有权
标题翻译：基板加工方法，系统和程序
公开(公告)号：US08257601B2
公开(公告)日：2012-09-04
申请号：US13073618
申请日：2011-03-28
申请人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
发明人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
IPC分类号： C23F1/00
CPC分类号： H01L21/67748 , H01J37/32743 , H01L21/67201 , H01L21/6831
摘要： A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
摘要翻译：基板处理方法用于具有基板处理装置和基板转印装置的基板处理系统。基板处理方法包括将基板转印的基板转印步骤和对基板执行预定处理的基板处理步骤。基板转印步骤和基板处理步骤包括多个操作，并且同时执行多个操作中的至少两个操作。优选地，基板处理装置包括容纳室，放置在容纳室中以安装在基板上的安装台，以及用于将传热气体供应到安装在安装台上的基板之间的空间的传热气体供应管线和安装台。

4. 发明申请

US20060090703A1 Substrate processing method, system and program 审中-公开
公开(公告)号：US20060090703A1
公开(公告)日：2006-05-04
申请号：US11263033
申请日：2005-11-01
申请人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
发明人： Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
IPC分类号： C23C16/00
CPC分类号： H01L21/67748 , H01J37/32743 , H01L21/67201 , H01L21/6831
摘要： A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.

5. 发明申请

US20050176258A1 Pressure control method and processing device 有权
标题翻译：压力控制方法及处理装置
公开(公告)号：US20050176258A1
公开(公告)日：2005-08-11
申请号：US11102709
申请日：2005-04-11
申请人： Eiji Hirose , Noriyuki Iwabuchi , Takeshi Yokouchi , Shingo Suzuki
发明人： Eiji Hirose , Noriyuki Iwabuchi , Takeshi Yokouchi , Shingo Suzuki
IPC分类号： H01L21/302 , G05D16/00 , H01J37/32 , H01L21/00 , H01L21/205 , H01L21/3065 , H01L21/461
CPC分类号： H01L21/67253 , H01J37/32449 , H01J37/32935 , H01J37/3299
摘要： First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.
摘要翻译：在不同压力检测范围内执行压力检测的第一和第二压力传感器132和134检测蚀刻装置100的处理室102内的压力。压力控制器144根据由第一和第二压力传感器132和134提供的压力数据选择对应于处理室内的压力的最佳压力数据。它还以与处理室102内的压力相对应地选择的分辨率来分析所选择的压力数据，从而获得实现预定数据密度的压力数据。压力控制器134控制压力控制阀130，以确保压力数据与预设的压力数据相匹配。

6. 发明授权

US06908864B2 Pressure control method and processing device 有权
公开(公告)号：US06908864B2
公开(公告)日：2005-06-21
申请号：US10149678
申请日：2000-12-14
申请人： Eiji Hirose , Noriyuki Iwabuchi , Takeshi Yokouchi , Shingo Suzuki
发明人： Eiji Hirose , Noriyuki Iwabuchi , Takeshi Yokouchi , Shingo Suzuki
IPC分类号： H01L21/302 , G05D16/00 , H01J37/32 , H01L21/00 , H01L21/205 , H01L21/3065
CPC分类号： H01L21/67253 , H01J37/32449 , H01J37/32935 , H01J37/3299
摘要： First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.

7. 发明授权

US07553773B2 Pressure control method and processing device 有权
标题翻译：压力控制方法及处理装置
公开(公告)号：US07553773B2
公开(公告)日：2009-06-30
申请号：US11102709
申请日：2005-04-11
申请人： Eiji Hirose , Noriyuki Iwabuchi , Takeshi Yokouchi , Shingo Suzuki
发明人： Eiji Hirose , Noriyuki Iwabuchi , Takeshi Yokouchi , Shingo Suzuki
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/67253 , H01J37/32449 , H01J37/32935 , H01J37/3299
摘要： First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.
摘要翻译：在不同压力检测范围内执行压力检测的第一和第二压力传感器132和134彼此检测蚀刻装置100的处理室102内的压力。压力控制器144根据过程中的压力选择最佳压力数据来自第一和第二压力传感器132和134提供的压力数据。它还以对应于处理室102内的压力选择的分辨率分析所选压力数据，并且因此获得实现预定数据密度的压力数据。压力控制器134控制压力控制阀130，以确保压力数据与预设的压力数据相匹配。

8. 发明申请

US20070212846A1 SUBSTRATE PROCESSING APPARATUS, METHOD FOR EXAMINING SUBSTRATE PROCESSING CONDITIONS, AND STORAGE MEDIUM 有权
标题翻译：基板处理装置，检查基板处理条件的方法和存储介质
公开(公告)号：US20070212846A1
公开(公告)日：2007-09-13
申请号：US11682490
申请日：2007-03-06
申请人： Takeshi Yokouchi , Fumiko Yagi
发明人： Takeshi Yokouchi , Fumiko Yagi
IPC分类号： H01L21/76
CPC分类号： H01L21/67276 , G05B19/41865 , G05B2219/31443 , G05B2219/32096 , G05B2219/32097 , G05B2219/45031 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67253 , H01L21/67742 , H01L21/67745 , Y02P90/20
摘要： A substrate processing apparatus includes a substrate processing unit for performing a process on substrates; a recipe protection unit for prohibiting processing conditions for the process from being changed while the process is being performed on a specific number of substrates; a protection cancellation unit for canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying unit for modifying the processing conditions. Further, a method for examining substrate processing conditions includes a protection cancellation step of canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying step of modifying the processing conditions.
摘要翻译：基板处理装置包括：基板处理单元，用于对基板进行处理; 配方保护单元，用于禁止在对特定数量的基板进行处理时改变处理的处理条件; 保护消除单元，用于在对所述特定数量的基板执行所述处理的同时，取消禁止所述处理的改变以允许改变所述处理条件; 以及修改单元，用于修改处理条件。此外，用于检查基板处理条件的方法包括：保护取消步骤，在对特定数量的基板进行处理时，取消禁止改变处理以允许改变处理条件; 以及修改处理条件的修改步骤。

9. 发明申请

US20070199655A1 SUBSTRATE PROCESSING APPARATUS, METHOD FOR MODIFYING SUBSTRATE PROCESSING CONDITIONS AND STORAGE MEDIUM 审中-公开
标题翻译：基板处理设备，修改基板处理条件和存储介质的方法
公开(公告)号：US20070199655A1
公开(公告)日：2007-08-30
申请号：US11679363
申请日：2007-02-27
申请人： Takeshi Yokouchi , Fumiko Yagi
发明人： Takeshi Yokouchi , Fumiko Yagi
IPC分类号： H01L21/306
CPC分类号： H01L21/67288
摘要： A substrate processing apparatus includes a setting unit for setting substrate processing conditions for a substrate in a substrate processing unit for performing a process on the substrate; a detection unit for detecting an abnormality of the substrate processing unit while the substrate processing unit performs the process on the substrate under the substrate processing conditions; a stopping unit for stopping the process on the substrate of the substrate processing unit if the abnormality is detected; and a modifying unit for modifying the substrate processing conditions for a substrate on which the process is stopped to be performed by the stopping unit. Further, a method for modifying substrate processing conditions includes the steps of setting processing conditions; detecting an abnormality of the substrate processing unit; stopping the process if the abnormality is detected; and modifying the processing conditions for a substrate on which the process is stopped.
摘要翻译：基板处理装置包括：设置单元，用于在基板处理单元中设置基板的基板处理条件，以在基板上进行处理; 检测单元，用于在基板处理单元在基板处理条件下对基板执行处理时检测基板处理单元的异常; 停止单元，如果检测到异常，则停止基板处理单元的基板上的处理; 以及修改单元，用于修改由停止单元执行该处理停止的基板的基板处理条件。此外，用于修改基板处理条件的方法包括设置处理条件的步骤; 检测所述基板处理单元的异常; 如果检测到异常，停止该过程; 以及修改处理停止的基板的处理条件。

10. 发明授权

US08190281B2 Substrate processing apparatus, method for examining substrate processing conditions, and storage medium 有权
标题翻译：基板处理装置，检查基板处理条件的方法和存储介质
公开(公告)号：US08190281B2
公开(公告)日：2012-05-29
申请号：US11682490
申请日：2007-03-06
申请人： Takeshi Yokouchi , Fumiko Yagi
发明人： Takeshi Yokouchi , Fumiko Yagi
IPC分类号： G06F19/00
CPC分类号： H01L21/67276 , G05B19/41865 , G05B2219/31443 , G05B2219/32096 , G05B2219/32097 , G05B2219/45031 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67253 , H01L21/67742 , H01L21/67745 , Y02P90/20
摘要： A substrate processing apparatus includes a substrate processing unit for performing a process on substrates; a recipe protection unit for prohibiting processing conditions for the process from being changed while the process is being performed on a specific number of substrates; a protection cancellation unit for canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying unit for modifying the processing conditions. Further, a method for examining substrate processing conditions includes a protection cancellation step of canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying step of modifying the processing conditions.
摘要翻译：基板处理装置包括：基板处理单元，用于对基板进行处理; 配方保护单元，用于禁止在对特定数量的基板进行处理时改变处理的处理条件; 保护消除单元，用于在对所述特定数量的基板执行所述处理的同时，取消禁止所述处理的改变以允许改变所述处理条件; 以及修改单元，用于修改处理条件。此外，用于检查基板处理条件的方法包括保护取消步骤，在对特定数量的基板进行处理的同时，取消禁止改变处理以允许改变处理条件; 以及修改处理条件的修改步骤。

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