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1. 发明授权

US08504473B2 Money transfer system and messaging system 有权
标题翻译：汇款系统和信息系统
公开(公告)号：US08504473B2
公开(公告)日：2013-08-06
申请号：US11692708
申请日：2007-03-28
申请人： Scott Paintin , Lance Marr , Michelle Kloosterman , Rebecca Loevenguth , Diane Scott
发明人： Scott Paintin , Lance Marr , Michelle Kloosterman , Rebecca Loevenguth , Diane Scott
IPC分类号： G06Q10/00 , G06Q40/00
CPC分类号： G06Q20/10 , G06Q20/02 , G06Q20/20 , G06Q20/40
摘要： A system for transferring funds from a sender to a recipient with a recorded message is disclosed. In one step the method includes receiving a request for a fund transfer from the sender. The sender may make the request for a fund transfer at a transaction processing device. In another step a payment is received from the sender for the fund transfer and a payment confirmation is transmitted to the host computer system. An identifier may then be assigned to the fund transfer. A recorded message from the sender may be received and at least a copy of the recorded message may be transmitted to a host computer system. The recorded message may then be associated with the fund transfer. A request, including the identifier, may be received from the recipient to receive the recorded messaged. In another step the recorded message may be sent to the recipient.
摘要翻译：公开了一种用于将资金从发送者转移到具有记录消息的接收者的系统。在一个步骤中，该方法包括从发送者接收资金转帐请求。发件人可以在交易处理设备处进行资金转帐请求。在另一步骤中，从发送方接收到用于资金转移的付款，并且向主计算机系统发送支付确认。然后可以将资源转移给标识符。可以接收来自发送者的记录的消息，并且至少可以将记录的消息的副本发送到主机系统。记录的消息可以与资金转移相关联。可以从接收者接收包括标识符的请求以接收所记录的消息。在另一步骤中，记录的消息可以被发送到接收者。

2. 发明授权

US09597769B2 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer 有权
公开(公告)号：US09597769B2
公开(公告)日：2017-03-21
申请号：US13488149
申请日：2012-06-04
申请人： Paul Andre Lefevre , William C. Allison , James P. LaCasse , Diane Scott , Alexander William Simpson , Ping Huang , Leslie M. Charns
发明人： Paul Andre Lefevre , William C. Allison , James P. LaCasse , Diane Scott , Alexander William Simpson , Ping Huang , Leslie M. Charns
IPC分类号： B24B37/20 , B24B37/22 , B24B37/26 , B24B37/16 , B24D11/00 , B24D18/00
CPC分类号： B24B37/205 , B24B37/16 , B24B37/22 , B24B37/26 , B24D11/003 , B24D18/0009
摘要： Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

3. 发明授权

US09180570B2 Grooved CMP pad 有权
公开(公告)号：US09180570B2
公开(公告)日：2015-11-10
申请号：US12381709
申请日：2009-03-16
申请人： Robert Kerprich , Karey Holland , Diane Scott , Sudhanshu Misra
发明人： Robert Kerprich , Karey Holland , Diane Scott , Sudhanshu Misra
IPC分类号： B24B37/00 , B24B37/26
CPC分类号： B24B37/26
摘要： CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

4. 发明授权

US08968058B2 Polishing pad with alignment feature 有权
标题翻译：具有对准功能的抛光垫
公开(公告)号：US08968058B2
公开(公告)日：2015-03-03
申请号：US13101826
申请日：2011-05-05
申请人： Robert Kerprich , William C. Allison , Diane Scott
发明人： Robert Kerprich , William C. Allison , Diane Scott
IPC分类号： B24D11/00 , B29C44/22 , B29C44/04 , B24B37/20 , B24B37/26 , B24D18/00 , B24B37/005
CPC分类号： C08J9/228 , B24B37/005 , B24B37/205 , B24B37/26 , B24D18/0009 , C08J2201/022
摘要： Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
摘要翻译：描述了具有对准标记的抛光垫。还描述了制造具有对准标记的抛光垫的方法。

5. 发明授权

US08657653B2 Homogeneous polishing pad for eddy current end-point detection 有权
标题翻译：用于涡流端点检测的均匀抛光垫
公开(公告)号：US08657653B2
公开(公告)日：2014-02-25
申请号：US12895479
申请日：2010-09-30
申请人： William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
发明人： William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
IPC分类号： B24D11/00
CPC分类号： B24D11/003 , B24B37/013 , B24B37/205
摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
摘要翻译：描述了使用涡流端点检测来研磨半导体衬底的均匀抛光垫。还描述了使用涡流端点检测来制造用于抛光半导体衬底的均匀抛光垫的方法。

6. 发明申请

US20160221145A1 LOW DENSITY POLISHING PAD 审中-公开
标题翻译：低密度抛光垫
公开(公告)号：US20160221145A1
公开(公告)日：2016-08-04
申请号：US14611064
申请日：2015-01-30
申请人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
发明人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
IPC分类号： B24B37/24 , C08J9/00 , C08J9/228
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , C08J9/0061 , C08J9/228 , C08J2333/00 , C08J2375/04 , C08J2433/00 , C08J2475/04
摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
摘要翻译：描述低密度抛光垫和制造低密度抛光垫的方法。在一个实例中，用于抛光衬底的抛光垫包括密度大约在0.4-0.55g / cc范围内的抛光体。抛光体包括热固性聚氨酯材料和分散在热固性聚氨酯材料中的多个闭孔。多个闭孔细孔中的每一个具有由丙烯酸共聚物构成的壳。

7. 发明授权

US09375823B2 Grooved CMP pads 有权
标题翻译：沟槽CMP垫
公开(公告)号：US09375823B2
公开(公告)日：2016-06-28
申请号：US14874179
申请日：2015-10-02
申请人： Robert Kerprich , Karey Holland , Diane Scott , Sudhanshu Misra
发明人： Robert Kerprich , Karey Holland , Diane Scott , Sudhanshu Misra
IPC分类号： B24B37/26
CPC分类号： B24B37/26
摘要： CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
摘要翻译：描述具有新颖凹槽结构的CMP垫。例如，这里描述的是包括主槽，辅助凹槽，凹槽图案中心和可选的端子槽的CMP垫。 CMP垫可以由聚氨酯或聚（尿烷 - 尿素）制成，并且其中产生的凹槽可以通过由成型，激光书写，水射流切割，3D印刷，热成型，真空成型，微接触印刷，热冲压及其混合物。

8. 发明授权

US09249273B2 Polishing pad with alignment feature 有权
公开(公告)号：US09249273B2
公开(公告)日：2016-02-02
申请号：US14610991
申请日：2015-01-30
申请人： Robert Kerprich , William C. Allison , Diane Scott
发明人： Robert Kerprich , William C. Allison , Diane Scott
IPC分类号： B24B37/26 , C08J9/228 , B24B37/005 , B24B37/20 , B24D18/00
CPC分类号： C08J9/228 , B24B37/005 , B24B37/205 , B24B37/26 , B24D18/0009 , C08J2201/022
摘要： Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.

9. 发明授权

US09156124B2 Soft polishing pad for polishing a semiconductor substrate 有权
标题翻译：用于抛光半导体衬底的软抛光垫
公开(公告)号：US09156124B2
公开(公告)日：2015-10-13
申请号：US12832908
申请日：2010-07-08
申请人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
发明人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
IPC分类号： B24D11/00 , B24B37/20 , B32B7/06 , B32B27/06 , B32B27/36 , B32B3/30
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译：描述了用于抛光半导体衬底的软抛光垫。软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。

10. 发明授权

US09067298B2 Polishing pad with grooved foundation layer and polishing surface layer 有权
标题翻译：抛光垫带有凹槽基础层和抛光表面层
公开(公告)号：US09067298B2
公开(公告)日：2015-06-30
申请号：US13306849
申请日：2011-11-29
申请人： Paul Andre Lefevre , William C. Allison , Diane Scott , James P. LaCasse
发明人： Paul Andre Lefevre , William C. Allison , Diane Scott , James P. LaCasse
IPC分类号： B24B37/16 , B24B37/24 , B24B37/26
CPC分类号： B24B37/26 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/00
摘要： Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.
摘要翻译：描述具有开槽基础层和抛光表面层的抛光垫。在一个示例中，用于抛光衬底的抛光垫包括其中布置有凹槽图案的基础层。连续的抛光表面层附着到基础层的凹槽的图案上。在另一个实例中，用于抛光衬底的抛光垫包括具有设置在其上的突起图案的表面的基础层。每个突起具有顶表面和侧壁。不连续的抛光表面层附着到基础层上并且包括离散的部分。每个离散部分附接到基础层的相应的一个突起的顶表面。还描述了制造具有与沟槽基础层结合的抛光表面层的抛光垫的方法。

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