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1. 发明授权

US5426263A Electronic assembly having a double-sided leadless component 失效
标题翻译：具有双面无引线元件的电子组件
公开(公告)号：US5426263A
公开(公告)日：1995-06-20
申请号：US172340
申请日：1993-12-23
申请人： Scott G. Potter , Michael J. Watkins
发明人： Scott G. Potter , Michael J. Watkins
IPC分类号： H01L23/04 , H05K1/14 , H05K1/18 , H05K3/34 , H01L23/02
CPC分类号： H05K1/147 , H01L23/04 , H05K1/145 , H05K1/186 , H05K3/3436 , H01L2224/16225 , H05K2201/10734 , H05K3/4611 , Y02P70/613
摘要： An electronic assembly has a double-sided leadless component (10) and one or more printed circuit boards (30, 32). The component has a plurality of electrical terminations or pads (18) on both opposing major surfaces. Each of the printed circuit boards has a printed circuit pattern that has a plurality of pads (34, 36) that correspond to the electrical terminations on both sides of the double-sided leadless component. The electrical terminals on one side of the component are attached to the pads on the first substrate and the electrical terminals on the other side of the leadless component are attached to the pads on the second substrate. The printed circuit boards are joined together to form a multilayered circuit board (44) so that the double-sided leadless component is buried or recessed inside. The component is attached to the pads of the printed circuit board using solder.
摘要翻译：电子组件具有双面无引线部件（10）和一个或多个印刷电路板（30,32）。该组件在两个相对的主表面上具有多个电端子或焊盘（18）。每个印刷电路板具有印刷电路图案，该印刷电路图案具有与双面无引线部件两侧的电气端子对应的多个焊盘（34,36）。部件的一侧的电气端子被附接到第一基板上的焊盘，并且无引线部件的另一侧的电端子附接到第二基板上的焊盘。印刷电路板被接合在一起以形成多层电路板（44），使得双面无引线部件被埋入或凹入内部。使用焊料将部件连接到印刷电路板的焊盘。

2. 发明授权

US06444563B1 Method and apparatus for extending fatigue life of solder joints in a semiconductor device 有权
标题翻译：用于延长半导体器件中焊点疲劳寿命的方法和装置
公开(公告)号：US06444563B1
公开(公告)日：2002-09-03
申请号：US09253876
申请日：1999-02-22
申请人： Scott G. Potter , Joseph Guy Gillette , Jesse E. Galloway , Zane Eric Johnson , Pradeep Lall
发明人： Scott G. Potter , Joseph Guy Gillette , Jesse E. Galloway , Zane Eric Johnson , Pradeep Lall
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L22/20 , H01L23/49838 , H01L23/5386 , H01L24/11 , H01L24/73 , H01L2224/13099 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H05K1/111 , H05K3/3436 , H05K2201/094 , Y02P70/613
摘要： A ball grid array (BGA) or chips scale package (CSP) integrated circuit (IC) (20) is manufactured by first identifying the most unreliable solder ball joints in the IC. These worst case joints, or joints in the vicinity of the worst case joints, are changed in pad dimension and exposed to more ball/bump conductive material than the other more robust joints (14) in the IC (20) to create a ball (24) on a larger pad (22) that is larger than the normal sized ball (14). The larger balls (24) are formed by placing multiple smaller balls (14) together on a single pad (22) to form one larger ball (24) during a reflow operation. The larger ball (24) improves the overall IC reliability by improving the reliability of the weakest joints in the IC design. In addition, the standoff of both the larger balls (24) and the smaller balls (14) are engineered to be substantially equal.
摘要翻译：通过首先识别IC中最不可靠的焊球接头，制造球栅阵列（BGA）或芯片级封装（CSP）集成电路（IC）（20）。在最坏情况接头附近的这些最坏情况的接头或接头在焊盘尺寸上改变，并暴露于比IC（20）中的其他更坚固的接头（14）更多的球/凸块导电材料以产生球（ 24）在比普通尺寸球（14）大的较大垫（22）上。在回流操作期间，通过将多个较小的球（14）放置在一个垫（22）上以形成一个更大的球（24）而形成较大的球（24）。较大的球（24）通过提高IC设计中最弱关节的可靠性，提高了整体IC的可靠性。此外，较大的球（24）和较小的球（14）的间隔被设计为基本相等。

3. 发明授权

US5676305A Method to achieve regulated force contact in pin transfer deposition of liquidus substances 失效
标题翻译：在液相线物质的针转移沉积中实现调节力接触的方法
公开(公告)号：US5676305A
公开(公告)日：1997-10-14
申请号：US634575
申请日：1996-04-18
申请人： Scott G. Potter , Barry B. Groman , Everett Alan Clayton
发明人： Scott G. Potter , Barry B. Groman , Everett Alan Clayton
IPC分类号： H02G3/04 , H05K3/34
CPC分类号： H05K3/3489 , H02G3/0487
摘要： A method for depositing a tacking agent (18) onto a circuit-carrying substrate (e.g., a printed circuit board) (22) such that a regulated volume is simultaneously deposited at multiple substrate sites (24). A first input pressure, P1, introduced through a bladder inlet (12), is supplied to a compliant bladder (14) which is in contact with a plurality of transfer pins (16). The compliant bladder imparts a substantially equal force to each of the transfer pins. The pins are then dipped into a thin film of tacking agent and removed. Subsequently, the first input pressure, P1, is adjusted to a second input pressure, P2, sufficient to force the pins to a uniform maximum extension. Finally, the second input pressure, P2, is adjusted to a third input pressure, P3, which imparts a predetermined uniform force on each of the pins, and the pins are brought in contact with the printed circuit substrate deposition sites. Thus, a uniform, predetermined volume of tacking agent is transferred to each of the board deposition sites, by regulating the force applied to the plurality of pins.
摘要翻译：一种用于将补丁剂（18）沉积到载有电路的衬底（例如印刷电路板）（22）上以使得调节体积同时沉积在多个衬底位置（24）上的方法。通过气囊入口（12）引入的第一输入压力P1被供应到与多个传送销（16）接触的柔性囊（14）。顺应性囊对每个传送销施加基本上相等的力。然后将销钉浸入到粘合剂的薄膜中并除去。随后，将第一输入压力P1调节到第二输入压力P2，足以迫使销钉达到均匀的最大延伸。最后，将第二输入压力P2调整到第三输入压力P3，这在每个销上施加预定的均匀力，并且使引脚与印刷电路基板沉积部位接触。因此，通过调节施加到多个销的力，将均匀的预定体积的定位剂转移到每个板沉积位置。

4. 发明授权

US06943777B2 Electronic device with user interface capability and method therefor 有权
标题翻译：具有用户界面功能的电子设备及其方法
公开(公告)号：US06943777B2
公开(公告)日：2005-09-13
申请号：US10268292
申请日：2002-10-10
申请人： Sivakumar Muthuswamy , Joseph G. Gillette , Scott G. Potter
发明人： Sivakumar Muthuswamy , Joseph G. Gillette , Scott G. Potter
IPC分类号： G06F3/048 , G09G5/00 , H04M1/23
CPC分类号： G06F3/04883 , H04M1/23 , H04M2250/22 , H04M2250/70
摘要： An electronic device (11) includes a keypad (22) for data entry, a character recognition system (34), and a processor (28). The keypad (22) is comprised of one or more keys (24) and one or more interstitial spaces (26) located in close proximity to one or more associated keys of the one or more keys (24). The one or more interstitial spaces (26) and the one or more keys (24) are comprised of a plurality of touch sensitive material (46). The user input to the plurality of touch sensitive material (46) produces one or more activated segments (50) used by the character recognition system (34) to create a correlating character (60).
摘要翻译：电子设备（11）包括用于数据输入的小键盘（22），字符识别系统（34）和处理器（28）。小键盘（22）由一个或多个键（24）和一个或多个间隙空间（26）构成，位于一个或多个键（24）的一个或多个相关键附近。一个或多个间隙空间（26）和一个或多个键（24）由多个触敏材料（46）组成。用户输入到多个触敏材料（46）产生由字符识别系统（34）使用的一个或多个激活的段（50）以创建相关字符（60）。

5. 发明授权

US06171114B2 Low insertion force array connector for providing a removable high density electrical interconnect to a flexible circuit 失效
标题翻译：低插入力阵列连接器，用于向柔性电路提供可移除的高密度电互连
公开(公告)号：US06171114B2
公开(公告)日：2001-01-09
申请号：US09593884
申请日：2000-06-14
申请人： Joseph G. Gillette , Scott G. Potter , Robert J. Mulligan
发明人： Joseph G. Gillette , Scott G. Potter , Robert J. Mulligan
IPC分类号： H01R1200
CPC分类号： H01R12/79 , H01R12/82 , H05K1/118 , H05K1/141 , H05K3/363 , H05K3/365 , H05K2201/049 , H05K2201/10734
摘要： A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (149) of the substrate.
摘要翻译：通过结合可移除地连接到低插入力球形阵列连接器（100）的柔性电路（140）来实现高密度电互连。柔性电路具有多个导电流道（142），并且每个流道具有终端（144）。终端以柔性电路的端部排列成阵列。低插入力连接器由在一侧具有与阵列对应的衬垫（122）的图案的衬底（120）组成。衬底的另一侧具有通过导电通孔与衬垫电连接的对应阵列（124）。对准特征（470）将柔性电路上的阵列对准衬底上的焊盘图案。柔性电路和衬底之间的接触由压缩装置（150）保持，压缩装置（150）提供足够的压缩力（310）以建立阵列和焊盘之间的电连接。柔性电路通过插入穿过衬底的z轴（149）而可移除地连接到低插入力连接器。

6. 发明授权

US6164979A System for providing a removable high density electrical interconnect for flexible circuits 失效
标题翻译：用于为柔性电路提供可移除的高密度电互连的系统
公开(公告)号：US6164979A
公开(公告)日：2000-12-26
申请号：US267429
申请日：1999-03-12
申请人： Joseph G. Gillette , Scott G. Potter , Robert J. Mulligan
发明人： Joseph G. Gillette , Scott G. Potter , Robert J. Mulligan
IPC分类号： H01R12/79 , H01R12/82 , H05K1/11 , H05K1/14 , H05K3/36 , H01R12/00 , H05K1/00
CPC分类号： H01R12/79 , H01R12/82 , H05K1/118 , H05K1/141 , H05K3/363 , H05K3/365 , H05K2201/049 , H05K2201/10734
摘要： A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (149) of the substrate.
摘要翻译：通过结合可移除地连接到低插入力球形阵列连接器（100）的柔性电路（140）来实现高密度电互连。柔性电路具有多个导电流道（142），并且每个流道具有终端（144）。终端以柔性电路的端部排列成阵列。低插入力连接器由在一侧具有与阵列对应的衬垫（122）的图案的衬底（120）组成。衬底的另一侧具有通过导电通孔与衬垫电连接的对应阵列（124）。对准特征（470）将柔性电路上的阵列对准衬底上的焊盘图案。柔性电路和衬底之间的接触由压缩装置（150）保持，压缩装置（150）提供足够的压缩力（310）以建立阵列和焊盘之间的电连接。柔性电路通过插入穿过衬底的z轴（149）而可移除地连接到低插入力连接器。

7. 发明授权

US5761093A Quality forecasting engine 失效
标题翻译：质量预测引擎
公开(公告)号：US5761093A
公开(公告)日：1998-06-02
申请号：US854130
申请日：1997-05-08
申请人： Glenn F. Urbish , William Boone Mullen, III , Scott G. Potter
发明人： Glenn F. Urbish , William Boone Mullen, III , Scott G. Potter
IPC分类号： G05B19/418 , G06F17/60
CPC分类号： G05B19/41875 , G05B2219/31324 , G05B2219/32194 , G05B2219/32196 , G05B2219/32203 , G05B2219/45035 , Y02P90/04 , Y02P90/22 , Y02P90/265
摘要： An automated method of predicting the number of defects that will occur during the manufacturing of a new electronic assembly design on a specific assembly line. Defective components are counted (214) as they are manufactured on an assembly line (210). The counted defects are stored in a historical database (220) and the defect rate is calculated. A bill of material for the new electronic design (230) is enumerated and information associated with each component is extracted from a library database (240) into a quality forecasting engine (250). The quality forecasting engine imports the enumerated bill of material and imports the stored defect rate from the historical database to perform a calculation of a predicted number of defects (260) for said new electronic assembly using the extracted library information.
摘要翻译：一种自动化方法，用于预测在特定装配线上制造新的电子组件设计过程中发生的缺陷数量。由于在组装线（210）上制造有缺陷的部件（214）。将计数的缺陷存储在历史数据库（220）中，并计算缺陷率。列举了新的电子设计（230）的物料清单，并且将与每个组件相关联的信息从库数据库（240）提取到质量预测引擎（250）中。质量预测引擎引入枚举的物料清单并从历史数据库导入存储的缺陷率，以使用所提取的库信息来执行所述新电子组件的预测的缺陷数量（260）的计算。

8. 发明授权

US5742484A Flexible connector for circuit boards 失效
标题翻译：电路板柔性连接器
公开(公告)号：US5742484A
公开(公告)日：1998-04-21
申请号：US801612
申请日：1997-02-18
申请人： Joseph G. Gillette , Scott G. Potter , Pradeep Lall
发明人： Joseph G. Gillette , Scott G. Potter , Pradeep Lall
IPC分类号： H05K1/11 , H05K1/14 , H05K3/00 , H05K3/34 , H05K3/36
CPC分类号： H01R12/52 , H05K1/148 , H05K3/363 , H01R12/62 , H05K1/118 , H05K2201/0909 , H05K2201/09709 , H05K2201/10734 , H05K2201/2009 , H05K2201/2018 , H05K3/0058 , H05K3/3457
摘要： A surface mountable flexible interconnect (10) for connecting two circuit board (30, 32) consists of a flex circuit (12) with solderable runners (14) on one side, the runners traversing the flex circuit from one end to the other. There is a solderable pad (16) at the end of each runner, and each solderable pad has a solder bump (18) fused to it. A rigid carrier ring (20) is used to hold the flex circuit in position prior to placement on the PCB. The flex circuit is formed into a U-shaped loop (26), and the loop is aligned to the carrier so that the loop is situated in an aperture (24) in the carrier. The solder pads lie directly under the carrier ring and face away from it. An adhesive (22) bonds the flex circuit to the carrier ring.
摘要翻译：用于连接两个电路板（30,32）的可表面安装的柔性互连（10）由在一侧上具有可焊接流道（14）的柔性电路（12）组成，所述滑动件从一端穿过柔性电路。在每个流道的末端有可焊垫（16），每个可焊垫具有与其熔合的焊料凸块（18）。刚性载体环（20）用于在放置在PCB上之前将柔性电路保持在适当的位置。柔性电路形成为U形环（26），并且环路与载体对准，使得环路位于载体中的孔（24）中。焊盘位于载体环的正下方，并远离其。粘合剂（22）将柔性电路结合到载体环上。

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