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    • 3. 发明授权
    • Method to achieve regulated force contact in pin transfer deposition of
liquidus substances
    • 在液相线物质的针转移沉积中实现调节力接触的方法
    • US5676305A
    • 1997-10-14
    • US634575
    • 1996-04-18
    • Scott G. PotterBarry B. GromanEverett Alan Clayton
    • Scott G. PotterBarry B. GromanEverett Alan Clayton
    • H02G3/04H05K3/34
    • H05K3/3489H02G3/0487
    • A method for depositing a tacking agent (18) onto a circuit-carrying substrate (e.g., a printed circuit board) (22) such that a regulated volume is simultaneously deposited at multiple substrate sites (24). A first input pressure, P1, introduced through a bladder inlet (12), is supplied to a compliant bladder (14) which is in contact with a plurality of transfer pins (16). The compliant bladder imparts a substantially equal force to each of the transfer pins. The pins are then dipped into a thin film of tacking agent and removed. Subsequently, the first input pressure, P1, is adjusted to a second input pressure, P2, sufficient to force the pins to a uniform maximum extension. Finally, the second input pressure, P2, is adjusted to a third input pressure, P3, which imparts a predetermined uniform force on each of the pins, and the pins are brought in contact with the printed circuit substrate deposition sites. Thus, a uniform, predetermined volume of tacking agent is transferred to each of the board deposition sites, by regulating the force applied to the plurality of pins.
    • 一种用于将补丁剂(18)沉积到载有电路的衬底(例如印刷电路板)(22)上以使得调节体积同时沉积在多个衬底位置(24)上的方法。 通过气囊入口(12)引入的第一输入压力P1被供应到与多个传送销(16)接触的柔性囊(14)。 顺应性囊对每个传送销施加基本上相等的力。 然后将销钉浸入到粘合剂的薄膜中并除去。 随后,将第一输入压力P1调节到第二输入压力P2,足以迫使销钉达到均匀的最大延伸。 最后,将第二输入压力P2调整到第三输入压力P3,这在每个销上施加预定的均匀力,并且使引脚与印刷电路基板沉积部位接触。 因此,通过调节施加到多个销的力,将均匀的预定体积的定位剂转移到每个板沉积位置。
    • 5. 发明授权
    • Low insertion force array connector for providing a removable high density electrical interconnect to a flexible circuit
    • 低插入力阵列连接器,用于向柔性电路提供可移除的高密度电互连
    • US06171114B2
    • 2001-01-09
    • US09593884
    • 2000-06-14
    • Joseph G. GilletteScott G. PotterRobert J. Mulligan
    • Joseph G. GilletteScott G. PotterRobert J. Mulligan
    • H01R1200
    • H01R12/79H01R12/82H05K1/118H05K1/141H05K3/363H05K3/365H05K2201/049H05K2201/10734
    • A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (149) of the substrate.
    • 通过结合可移除地连接到低插入力球形阵列连接器(100)的柔性电路(140)来实现高密度电互连。 柔性电路具有多个导电流道(142),并且每个流道具有终端(144)。 终端以柔性电路的端部排列成阵列。 低插入力连接器由在一侧具有与阵列对应的衬垫(122)的图案的衬底(120)组成。 衬底的另一侧具有通过导电通孔与衬垫电连接的对应阵列(124)。 对准特征(470)将柔性电路上的阵列对准衬底上的焊盘图案。 柔性电路和衬底之间的接触由压缩装置(150)保持,压缩装置(150)提供足够的压缩力(310)以建立阵列和焊盘之间的电连接。 柔性电路通过插入穿过衬底的z轴(149)而可移除地连接到低插入力连接器。
    • 6. 发明授权
    • System for providing a removable high density electrical interconnect
for flexible circuits
    • 用于为柔性电路提供可移除的高密度电互连的系统
    • US6164979A
    • 2000-12-26
    • US267429
    • 1999-03-12
    • Joseph G. GilletteScott G. PotterRobert J. Mulligan
    • Joseph G. GilletteScott G. PotterRobert J. Mulligan
    • H01R12/79H01R12/82H05K1/11H05K1/14H05K3/36H01R12/00H05K1/00
    • H01R12/79H01R12/82H05K1/118H05K1/141H05K3/363H05K3/365H05K2201/049H05K2201/10734
    • A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (149) of the substrate.
    • 通过结合可移除地连接到低插入力球形阵列连接器(100)的柔性电路(140)来实现高密度电互连。 柔性电路具有多个导电流道(142),并且每个流道具有终端(144)。 终端以柔性电路的端部排列成阵列。 低插入力连接器由在一侧具有与阵列对应的衬垫(122)的图案的衬底(120)组成。 衬底的另一侧具有通过导电通孔与衬垫电连接的对应阵列(124)。 对准特征(470)将柔性电路上的阵列对准衬底上的焊盘图案。 柔性电路和衬底之间的接触由压缩装置(150)保持,压缩装置(150)提供足够的压缩力(310)以建立阵列和焊盘之间的电连接。 柔性电路通过插入穿过衬底的z轴(149)而可移除地连接到低插入力连接器。