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    • 7. 发明授权
    • Cooling structure for electronic device
    • 电子设备冷却结构
    • US08711561B2
    • 2014-04-29
    • US13517190
    • 2012-01-27
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • H05K7/20
    • H01L23/467H01L23/36H01L2924/0002H01L2924/00
    • A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
    • 发电部件(3)安装在电路板(2)的一个表面上。 散热构件(4)设置在壳体(1)的一个表面和相对的壁(12)之间。 散热构件(4)具有沿特定方向延伸并与发热部件(3)接触的板(41)和从板(41)向相对壁突出的翅片(42) 12)。 在与散热构件(4)重叠的壳体的相对壁(12)的区域中,设置空气入口(1c)以沿指定方向延伸。 散热构件(4)在两个端部沿规定方向通过导热间隔件(9)与相对的壁(12)接触,并且在翅片(42)之间形成间隙(8) )和相对的壁(12)。
    • 10. 发明申请
    • COOLING STRUCTURE FOR ELECTRONIC DEVICE
    • 电子设备冷却结构
    • US20120314365A1
    • 2012-12-13
    • US13517190
    • 2012-01-27
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • H05K7/20
    • H01L23/467H01L23/36H01L2924/0002H01L2924/00
    • A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
    • 发电部件(3)安装在电路板(2)的一个表面上。 散热构件(4)设置在壳体(1)的一个表面和相对的壁(12)之间。 散热构件(4)具有沿特定方向延伸并与发热部件(3)接触的板(41)和从板(41)向相对壁突出的翅片(42) 12)。 在与散热构件(4)重叠的壳体的相对壁(12)的区域中,设置空气入口(1c)以沿指定方向延伸。 散热构件(4)在两个端部沿规定方向通过导热间隔件(9)与相对的壁(12)接触,并且在翅片(42)之间形成间隙(8) )和相对的壁(12)。