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1. 发明授权

US08476741B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08476741B2
公开(公告)日：2013-07-02
申请号：US13009212
申请日：2011-01-19
申请人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L23/58 , H01L21/31 , H01L21/4763
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译：根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。

2. 发明申请

US20090236114A1 MICROMECHANICAL DEVICE AND METHOD OF MANUFACTURING MICROMECHANICAL DEVICE 有权
标题翻译：微生物装置及制造微生物装置的方法
公开(公告)号：US20090236114A1
公开(公告)日：2009-09-24
申请号：US12399348
申请日：2009-03-06
申请人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
发明人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
IPC分类号： H05K5/06 , H05K7/02
CPC分类号： B81B3/0078 , B81B2201/016 , B81B2203/0109 , H01H1/50 , H01H3/60 , H01H59/0009 , Y10T29/49002
摘要： An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.
摘要翻译：本发明的一个实例是一种微机械装置，其特征在于，包括：设置有信号线的基板，安装在基板上的微机械，由导电材料形成为梁状，通过功能弹性变形电场的方式使得束状部分靠近信号线或离开信号线移动，并且随着变形而改变电特性，变形抑制部分由具有比导电性更高的粘度系数的材料构成材料，其设置在所述微机械相对于所述信号线的相反侧，用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体，具有位于其间的中空部分的微机械。

3. 发明申请

US20090101383A1 MICROMECHANICAL DEVICE AND METHOD OF MANUFACTURING MICROMECHANICAL DEVICE 有权
标题翻译：微生物装置及制造微生物装置的方法
公开(公告)号：US20090101383A1
公开(公告)日：2009-04-23
申请号：US12255144
申请日：2008-10-21
申请人： Takeshi MIYAGI , Michinobu Inoue , Susumu Obata , Yoshiaki Sugizaki
发明人： Takeshi MIYAGI , Michinobu Inoue , Susumu Obata , Yoshiaki Sugizaki
IPC分类号： H05K5/06 , H01L21/50
CPC分类号： B81C1/00293 , B81B3/0078 , B81C2203/0136 , B81C2203/0145 , H03H9/1057 , Y10T29/49002
摘要： A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which contains an inorganic material, is provided on a principal surface of the substrate, covers the micromachine through a hollow section containing a gaseous body therein, and is provided with opening shape sections allowing the hollow section to communicate with the outside, an organic sealing film which contains an organic material, is formed on the inner inorganic sealing film, and blocks up the opening shape sections, and an outer inorganic sealing film which contains an inorganic material with lower moisture permeability than the organic material, is formed on the organic sealing film, and covers the organic sealing film.
摘要翻译：根据本发明的一个方面的微机械装置包括：基板，安装在基板上的微型机械，具有通过电场的功能变形的机构，并且随着变形而改变电特性，含有无机材料的内无机密封膜设置在基板的主表面上，通过包含气体的中空部分覆盖微机械，并且设置有允许中空部分与外部连通的开口形状部分，在内无机密封膜上形成含有有机材料的有机密封膜，并且封闭开口形状部分，并且形成包含具有比有机材料低的透湿性的无机材料的外部无机密封膜，有机密封膜，并覆盖有机密封膜。

4. 发明授权

US08004053B2 Micromechanical device and method of manufacturing micromechanical device 有权
标题翻译：微机械装置及其制造方法
公开(公告)号：US08004053B2
公开(公告)日：2011-08-23
申请号：US12255144
申请日：2008-10-21
申请人： Takeshi Miyagi , Michinobu Inoue , Susumu Obata , Yoshiaki Sugizaki
发明人： Takeshi Miyagi , Michinobu Inoue , Susumu Obata , Yoshiaki Sugizaki
IPC分类号： H01L29/84
CPC分类号： B81C1/00293 , B81B3/0078 , B81C2203/0136 , B81C2203/0145 , H03H9/1057 , Y10T29/49002
摘要： A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which contains an inorganic material, is provided on a principal surface of the substrate, covers the micromachine through a hollow section containing a gaseous body therein, and is provided with opening shape sections allowing the hollow section to communicate with the outside, an organic sealing film which contains an organic material, is formed on the inner inorganic sealing film, and blocks up the opening shape sections, and an outer inorganic sealing film which contains an inorganic material with lower moisture permeability than the organic material, is formed on the organic sealing film, and covers the organic sealing film.
摘要翻译：根据本发明的一个方面的微机械装置包括：基板，安装在基板上的微型机械，具有通过电场的功能变形的机构，并且随着变形而改变电特性，含有无机材料的内无机密封膜设置在基板的主表面上，通过包含气体的中空部分覆盖微机械，并且设置有允许中空部分与外部连通的开口形状部分，在内无机密封膜上形成含有有机材料的有机密封膜，并且封闭开口形状部分，并且形成包含具有比有机材料低的透湿性的无机材料的外部无机密封膜，有机密封膜，并覆盖有机密封膜。

5. 发明申请

US20090071807A1 MEMS SWITCH AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译： MEMS开关及其制造方法
公开(公告)号：US20090071807A1
公开(公告)日：2009-03-19
申请号：US12187734
申请日：2008-08-07
申请人： Shinichi KOMINATO , Masao Segawa , Mariko Sugimoto , Takeshi Miyagi , Michinobu Inoue , Susumu Obata
发明人： Shinichi KOMINATO , Masao Segawa , Mariko Sugimoto , Takeshi Miyagi , Michinobu Inoue , Susumu Obata
IPC分类号： H01H57/00 , H01L21/02
CPC分类号： H01H59/0009 , B81B7/0058 , B81B2207/095 , B81C2203/0145 , B81C2203/0154 , H01H9/04
摘要： A MEMS switch includes a field generator which generates an electric field in a predetermined space, a beam located in the space and made of an electrically conductive material, the beam being flexed downward when subjected to an electrostatic force due to the electric field, the beam being deformed so as to return upward by an elastic restoring force upon extinction of the electrostatic force, a signal line electrically connected to the beam when the beam is flexed downward, and a protective cap covering the field generator, the beam, and the signal line, thereby sealing the field generator, the beam, and the signal line.
摘要翻译： MEMS开关包括在预定空间中产生电场的场发生器，位于该空间中并由导电材料制成的光束，当由于电场而受到静电力时，该光束向下弯曲，该光束当静电力消失时，通过弹性恢复力向上返回，当光束向下弯曲时电连接到光束的信号线以及覆盖场发生器，光束和信号线的保护帽，从而密封场发生器，光束和信号线。

6. 发明授权

US07972884B2 Micromechanical device and method of manufacturing micromechanical device 有权
标题翻译：微机械装置及其制造方法
公开(公告)号：US07972884B2
公开(公告)日：2011-07-05
申请号：US12399348
申请日：2009-03-06
申请人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
发明人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
IPC分类号： H01L21/00
CPC分类号： B81B3/0078 , B81B2201/016 , B81B2203/0109 , H01H1/50 , H01H3/60 , H01H59/0009 , Y10T29/49002
摘要： An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.
摘要翻译：本发明的一个实例是一种微机械装置，其特征在于，包括：设置有信号线的基板，安装在基板上的微机械，由导电材料形成为梁状，通过功能弹性变形电场的方式使得束状部分靠近信号线或离开信号线移动，并且随着变形而改变电特性，变形抑制部分由具有比导电性更高的粘度系数的材料构成材料，其设置在所述微机械相对于所述信号线的相反侧，用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体，具有位于其间的中空部分的微机械。

7. 发明申请

US20080211076A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080211076A1
公开(公告)日：2008-09-04
申请号：US12040209
申请日：2008-02-29
申请人： Hideo Nishiuchi , Takeshi Miyagi , Kazuki Tateyama , Susumu Obata , Kazuhito Higuchi
发明人： Hideo Nishiuchi , Takeshi Miyagi , Kazuki Tateyama , Susumu Obata , Kazuhito Higuchi
IPC分类号： H01L23/04 , H01L21/00
CPC分类号： B81B7/0077 , B81C2203/0136 , B81C2203/0145
摘要： A semiconductor device capable of elevating a yield rate of products to improve the productivity and also ensuring high reliability in production and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a semiconductor substrate 2, a MEMS part 3 formed on a surface of the semiconductor substrate 2 and a cap part arranged at a distance from the MEMS part 3 and also arranged on the surface of the semiconductor substrate 2 so as to cover the MEMS part 3. In the semiconductor device, the cap part is formed by a sidewall area E surrounding the MEMS part 3 and a top board area F having a hollow layer and also forming a closed space together with the semiconductor substrate 2 and the sidewall area E.
摘要翻译：提供能够提高产品的成品率以提高生产率并且还确保高生产可靠性的半导体器件和半导体器件的制造方法。半导体器件包括半导体衬底2，形成在半导体衬底2的表面上的MEMS部分3和与MEMS部分3相距一定距离地布置并且还被布置在半导体衬底2的表面上以覆盖 MEMS部件3.在半导体器件中，盖部分由围绕MEMS部件3的侧壁区域E和具有中空层的顶板区域F形成，并且还与半导体衬底2和侧壁一起形成封闭空间区域E.

8. 发明授权

US08569787B2 Light source apparatus using semiconductor light emitting device 失效
标题翻译：使用半导体发光元件的光源装置
公开(公告)号：US08569787B2
公开(公告)日：2013-10-29
申请号：US13154916
申请日：2011-06-07
申请人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
发明人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L24/06 , H01L33/0095 , H01L33/507 , H01L33/508 , H01L33/647 , H01L2224/06051 , H01L2924/12041 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a light source apparatus includes a semiconductor light emitting device, a mounting substrate, first and second connection members. The semiconductor light emitting device includes a light emitting unit, first and second conductive members, a sealing member, and an optical layer. The mounting substrate includes a base body, first and second substrate electrodes. The connection member electrically connects the conductive member to the substrate electrode. The conductive member is electrically connected to the light emitting unit electrode and includes first and second columnar portions provided on the second major surface. The sealing member covers side surfaces of the first and the second conductive members. The optical layer is provided on the first major surface of the semiconductor stacked body and includes a wavelength conversion unit. A surface area of the second substrate electrode is not less than 100 times a cross-sectional area of the second columnar portion.
摘要翻译：根据一个实施例，光源装置包括半导体发光器件，安装衬底，第一和第二连接构件。半导体发光器件包括发光单元，第一和第二导电构件，密封构件和光学层。安装基板包括基体，第一和第二基板电极。连接构件将导电构件电连接到基板电极。导电构件电连接到发光单元电极，并且包括设置在第二主表面上的第一和第二柱状部分。密封构件覆盖第一导电构件和第二导电构件的侧表面。光学层设置在半导体层叠体的第一主表面上并且包括波长转换单元。第二基板电极的表面积不小于第二柱状部分的横截面面积的100倍。

9. 发明授权

US08350283B2 Semiconductor light emitting device and method for manufacturing same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08350283B2
公开(公告)日：2013-01-08
申请号：US13152654
申请日：2011-06-03
申请人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
发明人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
IPC分类号： H01L33/50
CPC分类号： H01L33/647 , H01L33/0079 , H01L33/44 , H01L33/505 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting unit, first and second conductive members, an insulating layer, a sealing member, and an optical layer. The light emitting unit includes a semiconductor stacked body and first and second electrodes. The semiconductor stacked body includes first and second semiconductor layers and a light emitting layer, and has a major surface on a second semiconductor layer side. The first and second electrodes are connected to the first and second semiconductor layers on the major surface side, respectively. The first conductive member is connected to the first electrode and includes a first columnar portion covering a portion of the second semiconductor. The insulating layer is provided between the first columnar portion and the portion of the second semiconductor. The sealing member covers side surfaces of the conductive members. The optical layer is provided on the other major surface.
摘要翻译：根据一个实施例，半导体发光器件包括发光单元，第一和第二导电构件，绝缘层，密封构件和光学层。发光单元包括半导体层叠体和第一和第二电极。半导体层叠体包括第一和第二半导体层和发光层，并且在第二半导体层侧具有主表面。第一和第二电极分别连接到主表面侧的第一和第二半导体层。第一导电构件连接到第一电极并且包括覆盖第二半导体的一部分的第一柱状部分。绝缘层设置在第一柱状部分和第二半导体的部分之间。密封构件覆盖导电构件的侧表面。光学层设置在另一个主表面上。

10. 发明申请

US20110300651A1 METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE 审中-公开
标题翻译：制造发光装置的方法
公开(公告)号：US20110300651A1
公开(公告)日：2011-12-08
申请号：US12888558
申请日：2010-09-23
申请人： Akihiro Kojima , Yoshiaki Sugizaki , Susumu Obata , Hideo Nishiuchi
发明人： Akihiro Kojima , Yoshiaki Sugizaki , Susumu Obata , Hideo Nishiuchi
IPC分类号： H01L33/44
CPC分类号： H01L33/0079 , H01L33/0075 , H01L33/486 , H01L2224/16 , H01L2933/0066
摘要： According to one embodiment, a method for manufacturing a light-emitting device is disclosed. The method can include forming a first electrode and a second electrode on a semiconductor layer which is included in a first structure body, the semiconductor layer including a light-emitting layer on a substrate. The method can include forming a first metal pillar in conduction with the first electrode, and a second metal pillar in conduction with the second electrode. The method can include filling a region between the first metal pillar and the second metal pillar with an insulating layer. In addition, the method can include separating the substrate from the semiconductor layer, and forming a second structure body in which the semiconductor layer is supported by the insulating layer and which is convex toward an opposite side of the insulating layer to the semiconductor layer.
摘要翻译：根据一个实施例，公开了一种用于制造发光器件的方法。该方法可以包括在包括在第一结构体中的半导体层上形成第一电极和第二电极，该半导体层包括在基板上的发光层。该方法可以包括形成与第一电极导通的第一金属柱和与第二电极导通的第二金属柱。该方法可以包括用绝缘层填充第一金属柱和第二金属柱之间的区域。此外，该方法可以包括从半导体层分离衬底，以及形成第二结构体，其中半导体层被绝缘层支撑并且朝向绝缘层的与半导体层相反的一侧凸出。

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