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1. 发明授权

US06306481B1 Multilayer circuit board having insulating layer with via-holes 失效
标题翻译：多层电路板，具有带通孔的绝缘层
公开(公告)号：US06306481B1
公开(公告)日：2001-10-23
申请号：US09337268
申请日：1999-06-22
申请人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
发明人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
IPC分类号： B32B310
CPC分类号： H05K3/0023 , G03F7/038 , H05K1/0373 , H05K3/4644 , H05K2201/0195 , H05K2201/0209 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529
摘要： A multilayer circuit board having a resolution in the range of 25-80 &mgr;m, and blind via-holes between layers, the blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer having the blind via-holes between the layers has a glass transition temperature in the range of 150-220° C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process are reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes are suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
摘要翻译：具有分辨率在25-80μm的多层电路板和层之间的盲孔，盲孔通孔具有2.0-0.6范围内的纵横比，用于实现层之间的接近，其中绝缘层之间具有盲孔的层具有150-220℃的玻璃化转变温度，并且使用环氧基感光性树脂组合物。得到具有优选的分辨率和耐热性的感光性树脂组合物。提供了一种多层电路板，其中在裸芯片安装工艺中的回流工艺，金线接合工艺和修补工艺的步骤中产生的热应力减小，并且导体布线的剥离和多层的变形在加热过程中由机械应力引起的电路板被抑制。因此，电子设备的尺寸和重量的减小是可能的。

2. 发明授权

US5914216A Multilayer circuit board and photosensitive resin composition used therefor 失效
标题翻译：多层电路板和用于此的光敏树脂组合物
公开(公告)号：US5914216A
公开(公告)日：1999-06-22
申请号：US896456
申请日：1997-07-18
申请人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
发明人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
IPC分类号： G03F7/004 , G03F7/038 , H05K1/03 , H05K3/00 , H05K3/46 , G03C1/725
CPC分类号： H05K3/0023 , G03F7/038 , H05K1/0373 , H05K2201/0195 , H05K2201/0209 , H05K3/4644 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529
摘要： A multilayer circuit board having a resolution in the range of 25-80 .mu.m, and blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer between said layers having the blind via-holes has a glass transition temperature in the range of 150-220.degree. C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process was reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes were suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
摘要翻译：具有25-80μm范围内分辨率的多层电路板和具有2.0-0.6范围内的纵横比的盲孔，以实现层之间的接近，其中所述层之间的绝缘层具有盲通孔的玻璃化转变温度为150〜220℃，使用环氧基感光性树脂组合物。得到具有优选的分辨率和耐热性的感光性树脂组合物。提供一种多层电路板，其中在裸芯片安装工艺中在回流处理，金线接合工艺和修补工艺的步骤中产生的热应力减少，并且导体布线的剥离和多层的变形在加热过程中由机械应力引起的电路板被抑制。因此，电子设备的尺寸和重量的减小是可能的。

3. 发明授权

US06190834B1 Photosensitive resin composition, and multilayer printed circuit board using the same 失效
标题翻译：感光树脂组合物和使用其的多层印刷电路板
公开(公告)号：US06190834B1
公开(公告)日：2001-02-20
申请号：US09073645
申请日：1998-05-06
申请人： Masatoshi Narahara , Mineo Kawamoto , Tokihito Suwa , Masao Suzuki , Satoru Amou , Akio Takahashi , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
发明人： Masatoshi Narahara , Mineo Kawamoto , Tokihito Suwa , Masao Suzuki , Satoru Amou , Akio Takahashi , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
IPC分类号： G03C173
CPC分类号： C08F290/144 , C08F290/14 , G03F7/0388 , H01L2224/16225 , H05K3/0023 , H05K3/4661 , H05K2201/0133 , Y10S522/905
摘要： The present invention provides a photosensitive resin composition capable of forming an insulating film, which is superior in both a roughening property and an adhesiveness, and a via-hole, which is highly reliable in connection, and a multilayer printed circuit board. The present invention provides a photosensitive resin composition containing a first resin, which is an epoxy resin, and a second resin having a N-substituted carbamic acid ester atomic group and a radical polymeric unsaturated bond in its side chain. The second resin is desirably an oligomer having a repeating unit expressed by the following general formula (chem. 1) or (chem. 3) by 3-10 units. Where, X is H or CH3, Y and Z is H or an alkyl group of carbon number 1-4, n is 0 or 1, a part of R1 is an atomic group expressed by the following general formula (chem. 2), the residual R1 is a hydroxyl group, and R2 is an alkylene group of carbon number 1-4.
摘要翻译：本发明提供能够形成绝缘膜的感光性树脂组合物，其具有优异的粗糙性和粘合性，以及连接高度可靠的通孔以及多层印刷电路板。本发明提供含有作为环氧树脂的第一树脂和在其侧链具有N-取代氨基甲酸酯原子团和自由基聚合不饱和键的第二树脂的感光性树脂组合物。第二树脂理想地是具有由以下通式（化学式1）或（化学式3）表示的重复单元的低聚物3-10单元。其中，X为H或CH3，Y和Z为H或碳数为1-4的烷基，n为0或1，R1的一部分为由以下通式（化学式2）表示的原子团，残基R1为羟基，R2为碳数为1-4的亚烷基。

4. 发明授权

US08642694B2 Bio-based coating composition and its coated article 有权
标题翻译：生物基涂料组合物及其涂层制品
公开(公告)号：US08642694B2
公开(公告)日：2014-02-04
申请号：US12713569
申请日：2010-02-26
申请人： Koji Morita , Hirofumi Yamashita , Hitomi Ohara , Shiro Kobayashi , Masahiko Ishii
发明人： Koji Morita , Hirofumi Yamashita , Hitomi Ohara , Shiro Kobayashi , Masahiko Ishii
IPC分类号： C08L67/04 , C08G63/08 , C08G63/02 , C08G63/06
CPC分类号： C08L67/04 , C08F220/06 , C08F220/14 , C08F220/18 , C08F2220/1825 , C08F2220/281 , C08L33/066 , C08L33/068 , C08L2666/04 , C08L2666/02
摘要： There are provided: a bio-based coating composition which is a bio-based ingredient coating composition in consideration of environment and does not need any expensive ingredient and is also excellent in hydrolysis resistance; and an article coated with the coating composition. The bio-based coating composition is characterized by comprising the following film-forming ingredients: a lactic acid polymer (A) which contains a polyfunctional compound having a hydroxyl group and/or a carboxyl group in a functionality of not less than 3 and lactic acid as essential monomer ingredients and has a specific SP value; and a resin (B) which contains a hydroxyl group and/or a carboxyl group and has a specific SP value; wherein the difference (ΔSP) between the SP values of the lactic acid polymer (A) and the resin (B) is in the range of 0.2 to 4.0. The coated article is characterized by being obtained by being coated with the aforementioned coating composition.
摘要翻译：提供：生物基涂料组合物，考虑到环境是生物基成分涂料组合物，不需要任何昂贵的成分，并且耐水解性也优异; 和涂覆有涂料组合物的制品。生物基涂料组合物的特征在于包含以下成膜成分：含有官能度不低于3的具有羟基和/或羧基的多官能化合物的乳酸聚合物（A）和乳酸作为必需单体成分，具有特定的SP值; 和含有羟基和/或羧基并具有特定SP值的树脂（B）; 其中，乳酸聚合物（A）和树脂（B）的SP值之差（DeltaSP）在0.2〜4.0的范围内。涂层制品的特征在于通过涂覆上述涂料组合物获得。

5. 发明申请

US20090083687A1 PRINTED CIRCUIT BOARD DESIGN SUPPORT METHOD AND APPARATUS 有权
标题翻译：印刷电路板设计支持方法和设备
公开(公告)号：US20090083687A1
公开(公告)日：2009-03-26
申请号：US12238895
申请日：2008-09-26
申请人： Toshisato Sadamatsu , Shinichi Hama , Shiro Kobayashi
发明人： Toshisato Sadamatsu , Shinichi Hama , Shiro Kobayashi
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： A method used for supporting designing of a printed circuit board including a plurality of conductive layers having conductive areas to which a constant potential is applied, includes specifying conductive areas having a predetermined wiring from the conductive areas for each of the plurality of conductive layers, extracting areas that overlap each other in a planar view from the specified conductive areas, specifying an interlayer connection member that electrically connects at least two of the plurality of conductive layers in the extracted area, and clearly specifying an area within a predetermined distance from a center of the specified interlayer connection member and in the extracted area.
摘要翻译：一种用于支持包括具有施加恒定电位的导电区域的多个导电层的印刷电路板的设计的方法包括从多个导电层中的每一个的导电区域指定具有预定布线的导电区域，提取指定从提取区域中电连接多个导电层中的至少两个的层间连接构件，并且明确地指定距离所述提取区域中的多个导电层的中心的预定距离内的区域指定的层间连接构件和提取区域。

6. 发明授权

US06841650B2 Crystallizable poly (2,5-di-substituted-1,4-phenylene oxide) and a method of preparing the same 有权
标题翻译：可结晶的聚（2,5-二取代-1,4-亚苯基氧化物）及其制备方法
公开(公告)号：US06841650B2
公开(公告)日：2005-01-11
申请号：US10157862
申请日：2002-05-31
申请人： Hideyuki Higashimura , Kiyoshi Fujisawa , Yoshihiko Moro-Oka , Shiro Kobayashi
发明人： Hideyuki Higashimura , Kiyoshi Fujisawa , Yoshihiko Moro-Oka , Shiro Kobayashi
IPC分类号： C08G65/44 , C08G59/50
CPC分类号： C08G65/44
摘要： There is disclosed a crystallizable poly(2,5-di-substituted-1,4-phenylene oxide), which exhibits an exothermic peak for crystallization of not less than 5 J/g at 150° C. or over when cooled after melting, and/or an endothermic peak, at the time of melting of crystals thereof, of not less than 5 J/g at 150° C. or over when re-heated after cooling of the melt, and which comprises a recurring unit of the following formula (I), and a method of preparing the same by polymerization of a 2,5-di-substituted-phenol of the following formula (II) by use of a copper complex catalyst made of a tridentate ligand of which nitrogen atoms coordinate to a copper atom in coexistence with oxygen: wherein R1's independently represent a hydrocarbon group or a substituted hydrocarbon group, and they may be the same or different. The crystallizable poly(2,5-di-substituted-1,4-phenylene oxide) is able to provide a melt molding which has a reduced degree of coloration and good heat resistance.
摘要翻译：公开了一种可结晶的聚（2,5-二取代-1,4-亚苯基氧化物），其在熔化后冷却时在150℃或更高温度下表现出不低于5J / g的结晶放热峰，和/或其结晶时的吸热峰在熔融物冷却后再加热时在150℃以上不低于5J / g，并且其包含以下的重复单元式（I）的方法和通过使用由氮原子配位的三齿配体构成的铜络合物催化剂聚合下述式（II）的2,5-二取代苯酚而制备的方法与氧共存的铜原子：其中R 1独立地表示烃基或取代的烃基，它们可以相同或不同。可结晶的聚（2,5-二取代-1,4-亚苯基氧化物）能够提供具有降低的着色程度和良好的耐热性的熔融模塑。

7. 发明授权

US06576800B2 Oxidation polymer of a substituted phenol 失效
标题翻译：取代苯酚的氧化聚合物
公开(公告)号：US06576800B2
公开(公告)日：2003-06-10
申请号：US09905978
申请日：2001-07-17
申请人： Hideyuki Higashimura , Shiro Kobayashi
发明人： Hideyuki Higashimura , Shiro Kobayashi
IPC分类号： C07C4100
CPC分类号： C08G65/44
摘要： An oxidation polymer of a substituted phenol, obtained by oxidative polymerization of at least one compound selected from the group consisting of a compound of formula (Ia) and a compound of formula (Ib), in which the oxidation polymer has a number-average polymerization degree of 3 or more: wherein R1 to R4 each represent a hydrogen atom and the like; provided that at least one of R1 to R4 represents a substituted or unsubstituted, saturated hydrocarbon group having 10 or more carbon atoms, and R1 and/or R4 represent a hydrogen atom; wherein R11 represents a substituted or unsubstituted, saturated hydrocarbon group having 15 or more carbon atoms, and R12 is the same as R11, or when R12 is different from R11, R12 represents a substituted or unsubstituted hydrocarbon group and the like.
摘要翻译：通过氧化聚合至少一种选自式（Ia）化合物和式（Ib）化合物的化合物的化合物获得的取代苯酚的氧化聚合物，其中氧化聚合物具有数均聚合 3以上：其中，R1〜R4各自表示氢原子等; 条件是R 1至R 4中的至少一个表示具有10个或更多个碳原子的取代或未取代的饱和烃基，R 1和/或R 4表示氢原子;其中R 11表示取代或未取代的饱和烃基，其具有15或更多的碳原子，R 12与R 11相同，或者当R 12与R 11不同时，R 12表示取代或未取代的烃基等。

8. 发明授权

US5221859A Lead frame for semiconductor device 失效
标题翻译：半导体器件引线框架
公开(公告)号：US5221859A
公开(公告)日：1993-06-22
申请号：US660944
申请日：1991-02-26
申请人： Shiro Kobayashi , Narutoshi Kazama , Masahiko Itoh , Noriyuki Ohnaka
发明人： Shiro Kobayashi , Narutoshi Kazama , Masahiko Itoh , Noriyuki Ohnaka
IPC分类号： H01L23/495 , H05K3/34
CPC分类号： H01L23/49582 , H01L23/4951 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/20753 , H05K3/3421
摘要： A lead frame of a plastic encapsulated type semiconductor device is provided with a coating film which has a solderability higher than a solderability of a basic metal of the lead frame, and the coating film has a corrosion potential higher than a corrosion potential of the basic metal. The coating film protects the basic metal from corrosion caused by the plastic encapsulated member. The coating film of the lead frame made of a Fe-Ni alloy is an alloy comprising metal selected from Mo, W, Au, Cr, Cu, metals of the platinum group and a metal selected from Fe, Co, and Ni.
摘要翻译：塑料封装型半导体器件的引线框架设置有具有比引线框架的碱性金属的可焊性高的可焊性的涂膜，并且涂膜具有高于碱性金属的腐蚀电位的腐蚀电位。涂膜可保护碱性金属免受塑料封装件引起的腐蚀。由Fe-Ni合金制成的引线框架的涂膜是包含选自Mo，W，Au，Cr，Cu的金属，铂族金属和选自Fe，Co和Ni的金属的合金。

9. 发明授权

US5204428A Copolymer and method of producing the same 失效
标题翻译：共聚物及其制造方法
公开(公告)号：US5204428A
公开(公告)日：1993-04-20
申请号：US809224
申请日：1991-12-16
申请人： Shiro Kobayashi , Yoshihiro Taguchi , Hiroshi Uyama
发明人： Shiro Kobayashi , Yoshihiro Taguchi , Hiroshi Uyama
IPC分类号： C08F216/14 , C08F220/10 , C08F246/00 , C09K11/02 , H01G4/18 , H05B33/20
CPC分类号： H01G4/18 , C08F216/14 , C08F220/10 , C08F246/00 , C09K11/02 , H05B33/20
摘要： A copolymer of the present invention is produced by copolymerization of an electron-donating monomer having an electron-accepting group and an electron-accepting monomer having an electron-accepting group. The copolymer thus exhibits a high dielectric constant, a low level of hygroscopicity and good adhesion.
摘要翻译：本发明的共聚物是通过具有电子接受基团的给电子性单体和具有电子接受基团的电子接受性单体的共聚来制造的。因此共聚物表现出高介电常数，低吸湿性和良好的粘合性。

10. 发明申请

US20070294291A1 Environment Load Totalizing Device and Method 审中-公开
标题翻译：环境负荷累加装置和方法
公开(公告)号：US20070294291A1
公开(公告)日：2007-12-20
申请号：US10590476
申请日：2005-09-30
申请人： Tomoyo Sasaki , Yoshiaki Ichikawa , Shiro Kobayashi
发明人： Tomoyo Sasaki , Yoshiaki Ichikawa , Shiro Kobayashi
IPC分类号： G06F17/00
CPC分类号： G06Q10/06 , Y02P90/845
摘要： A storage unit (20) holds component information, step information, and information (stage definition information) on the basic steps assigned to the life stages of a product. The step information includes information on environment load items, information on the basic step corresponding to the objective step, and information on components associated with the objective step. The basic step relates to the manufacture of a product defined according to a predetermined rule and is definition information common to user. A computing unit (10) specifies each component constituting a specific product by using the component information on the components, searches for the step information associated with the specified components, classifies the found step information by using the stage definition information by life stage, and totalizes the information on the environment load items included in the step information for each life stage.
摘要翻译：存储单元（20）在分配给产品的生命阶段的基本步骤上保持组件信息，步骤信息和信息（阶段定义信息）。步骤信息包括关于环境负载项目的信息，与目标步骤相对应的基本步骤的信息以及与目标步骤相关的组件的信息。基本步骤涉及根据预定规则定义的产品的制造，并且是用户常见的定义信息。计算单元（10）通过使用关于组件的组件信息来指定构成特定产品的每个组件，搜索与指定组件相关联的步骤信息，通过使用阶段定义信息通过生命阶段对所找到的步骤信息进行分类，并且将关于每个生命阶段的步骤信息中包括的环境负荷项目的信息。

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