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    • 5. 发明授权
    • Semiconductor memory device with stacked memory cell and method of manufacturing the stacked memory cell
    • 具有堆叠存储单元的半导体存储器件和制造堆叠存储单元的方法
    • US08179711B2
    • 2012-05-15
    • US12273225
    • 2008-11-18
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • G11C11/00
    • G11C13/003G11C5/02G11C7/18G11C11/15G11C11/56G11C11/5678G11C13/0004G11C13/0023G11C13/0026G11C13/0064G11C13/0069G11C2013/0071G11C2213/71G11C2213/74G11C2213/79H01L27/24
    • In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the resistive-change memory cells.
    • 在半导体存储器件和方法中,提供了电阻变化存储单元,每个包括形成在不同层上的多个控制晶体管和包括电阻变化存储器的可变电阻器件。 每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 在一个示例中,控制晶体管的数量是两个。 半导体存储器件包括全局位线; 通过分别对应于本地位线的本地位线选择电路分别连接到全局位线或与全局位线断开的多个局部位线; 以及分别在连接到本地位线时存储数据的多个电阻变化存储单元组。 每个电阻变化存储单元组中的每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 此外,半导体存储器件具有使用全局位线和局部位线的分层位线结构。 因此,可以增加半导体存储器件的集成密度和流过每个电阻变化存储单元的电流量。
    • 7. 发明申请
    • Layout method of a semiconductor memory device
    • 半导体存储器件的布局方法
    • US20070195591A1
    • 2007-08-23
    • US11790444
    • 2007-04-25
    • Beak-hyung ChoDu-eung KimByung-gil ChoiChoong-keun Kwak
    • Beak-hyung ChoDu-eung KimByung-gil ChoiChoong-keun Kwak
    • G11C5/06G11C5/02G11C11/00
    • G11C7/18G11C5/025G11C13/0004
    • The layout method for a semiconductor device includes locating a plurality of first bit line selection circuits at a first side of a variable resistive memory cell block, and locating a plurality of second bit line selection circuits at a second side of the variable resistive memory cell block opposite the first side. The method further includes connecting the first bit line selection circuits with respective odd-numbered local bit lines of the variable resistive memory cell block, and connecting the second bit line selection circuits with respective even-numbered local bit lines of the variable resistive memory cell block. The method still further includes selectively connecting respective odd-numbered local bit lines to a global bit line using the first bit line selection circuits, and selectively connecting respective even-numbered local bit lines to the global bit line using the second bit line selection circuits.
    • 半导体器件的布局方法包括在可变电阻存储器单元块的第一侧定位多个第一位线选择电路,并且将多个第二位线选择电路定位在可变电阻存储器单元块的第二侧 第一面相反 该方法还包括将第一位线选择电路与可变电阻存储单元块的相应奇数本地位线连接,并将第二位线选择电路与可变电阻存储单元块的各个偶数本地位线连接 。 该方法还包括使用第一位线选择电路选择性地将相应的奇数本地位线连接到全局位线,并且使用第二位线选择电路选择性地将各偶数本地位线连接到全局位线。
    • 9. 发明申请
    • Initial firing method and phase change memory device for performing firing effectively
    • 初始烧制方法和相变存储装置,用于有效地进行烧制
    • US20050052904A1
    • 2005-03-10
    • US10929511
    • 2004-08-30
    • Beak-hyung ChoDu-eung KimChoong-keun Kwak
    • Beak-hyung ChoDu-eung KimChoong-keun Kwak
    • G11C13/02G11C11/00G11C16/20
    • G11C13/0004G11C2013/0083Y10S977/754
    • A firing method of a phase change memory device and a phase change memory capable of effectively performing a firing operation are described. The phase change memory device includes a plurality of memory cell array blocks, a counter clock generation unit, a decoding unit, and a driving unit. Each memory cell array block has phase change memory cells. The counter clock generation unit outputs first through third counter clock signals in response to an external clock signal and a firing mode signal, wherein the first through third counter clock signals have different cycles. The decoding unit, in response to the first through third counter clock signals, outputs a block address which selects one of the plurality of memory cell array blocks, word line addresses which enable word lines of the selected memory cell array block, and a redundant word line address which enables a redundant word line of the selected memory cell array block. The driving unit applies a firing current to the memory cell array blocks in response to the firing mode signal. According to the phase change memory device and the initial firing method, the time taken to perform the initial firing operation can be reduced. In addition, since the numbers of the needed signals are minimized, a large number of chips on a single wafer can be simultaneously tested.
    • 描述能够有效地执行点火操作的相变存储器件和相变存储器的点火方法。 相变存储器件包括多个存储单元阵列块,计数器时钟生成单元,解码单元和驱动单元。 每个存储单元阵列块具有相变存储单元。 计数器时钟产生单元响应于外部时钟信号和触发模式信号输出第一至第三计数器时钟信号,其中第一至第三计数器时钟信号具有不同的周期。 解码单元响应于第一至第三计数器时钟信号输出选择多个存储单元阵列块中的一个的块地址,使得能够选择的存储单元阵列块的字线的字线地址和冗余字 行地址,其使能所选存储单元阵列块的冗余字线。 驱动单元响应于点火模式信号向存储单元阵列块施加点火电流。 根据相变存储器件和初始烧制方法,可以减少执行初始点火操作所花费的时间。 此外,由于所需信号的数量最小化,可以同时测试单个晶片上的大量芯片。
    • 10. 发明授权
    • Layout method of a semiconductor memory device
    • 半导体存储器件的布局方法
    • US07460386B2
    • 2008-12-02
    • US11790444
    • 2007-04-25
    • Beak-hyung ChoDu-eung KimByung-gil ChoiChoong-keun Kwak
    • Beak-hyung ChoDu-eung KimByung-gil ChoiChoong-keun Kwak
    • G11C5/02G11C5/06G11C11/00
    • G11C7/18G11C5/025G11C13/0004
    • The layout method for a semiconductor device includes locating a plurality of first bit line selection circuits at a first side of a variable resistive memory cell block, and locating a plurality of second bit line selection circuits at a second side of the variable resistive memory cell block opposite the first side. The method further includes connecting the first bit line selection circuits with respective odd-numbered local bit lines of the variable resistive memory cell block, and connecting the second bit line selection circuits with respective even-numbered local bit lines of the variable resistive memory cell block. The method still further includes selectively connecting respective odd-numbered local bit lines to a global bit line using the first bit line selection circuits, and selectively connecting respective even-numbered local bit lines to the global bit line using the second bit line selection circuits.
    • 半导体器件的布局方法包括在可变电阻存储器单元块的第一侧定位多个第一位线选择电路,并且将多个第二位线选择电路定位在可变电阻存储器单元块的第二侧 第一面相反 该方法还包括将第一位线选择电路与可变电阻存储单元块的相应奇数本地位线连接,并将第二位线选择电路与可变电阻存储单元块的各个偶数本地位线连接 。 该方法还包括使用第一位线选择电路选择性地将相应的奇数本地位线连接到全局位线,并且使用第二位线选择电路选择性地将各偶数本地位线连接到全局位线。