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1. 发明申请

US20060001852A1 Method and apparatus for exposing semiconductor substrates 有权
标题翻译：曝光半导体衬底的方法和装置
公开(公告)号：US20060001852A1
公开(公告)日：2006-01-05
申请号：US11168527
申请日：2005-06-29
申请人： Sang-Ho Lee , Jin-Phil Choi , Dong-Hwa Shin , Seung-Ki Chae , Byong-Cheol Park
发明人： Sang-Ho Lee , Jin-Phil Choi , Dong-Hwa Shin , Seung-Ki Chae , Byong-Cheol Park
IPC分类号： G03B27/42
CPC分类号： G03B27/42 , G03F7/70275
摘要： Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.
摘要翻译：提供了用于仅使用单个光源在单个曝光设备中曝光多个基板的方法和设备，其中第一基板以一系列步骤或照射曝光，在此期间沿主要光学路径传输的光被引导到衬底，其中衬底在连续镜头之间重新定位。第二衬底在一段时间期间被曝光，同时通过改变光路来重新定位第一衬底，以将来自光源的光转移到将暴露第二衬底上的区域的次级光路。当第一衬底被重新定位时，光的转向被终止，使得光将再次沿着主光路传播，以便暴露第一衬底的主表面上的下一个顺序射击。

2. 发明授权

US07417709B2 Method and apparatus for exposing semiconductor substrates 有权
标题翻译：曝光半导体衬底的方法和装置
公开(公告)号：US07417709B2
公开(公告)日：2008-08-26
申请号：US11168527
申请日：2005-06-29
申请人： Sang-Ho Lee , Jin-Phil Choi , Dong-Hwa Shin , Seung-Ki Chae , Byong-Cheol Park
发明人： Sang-Ho Lee , Jin-Phil Choi , Dong-Hwa Shin , Seung-Ki Chae , Byong-Cheol Park
IPC分类号： G03B27/42 , G03B27/70 , G03B27/54 , G03B27/74 , G03B27/32 , G03C5/00
CPC分类号： G03B27/42 , G03F7/70275
摘要： Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.
摘要翻译：提供了用于仅使用单个光源在单个曝光设备中曝光多个基板的方法和设备，其中第一基板以一系列步骤或照射曝光，在此期间沿主要光学路径传输的光被引导到衬底，其中衬底在连续镜头之间重新定位。第二衬底在一段时间期间被曝光，同时通过改变光路来重新定位第一衬底，以将来自光源的光转移到将暴露第二衬底上的区域的次级光路。当第一衬底被重新定位时，光的转向被终止，使得光将再次沿着主光路传播，以便暴露第一衬底的主表面上的下一个顺序射击。

3. 发明申请

US20070263194A1 METHOD OF EXPOSING A WAFER TO A LIGHT, AND RETICLE, RETICLE ASSEMBLY AND EXPOSING APPARATUS FOR PERFORMING THE SAME 审中-公开
标题翻译：将光照射到灯的方法，以及用于实施其的反射装置和曝光装置
公开(公告)号：US20070263194A1
公开(公告)日：2007-11-15
申请号：US11830439
申请日：2007-07-30
申请人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
发明人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
IPC分类号： G03F1/00
CPC分类号： G03F7/70425 , G03B27/42 , G03F7/70466
摘要： A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.
摘要翻译：将晶片暴露于光的方法包括通过照射投影光将图像转印到多个照射区域上，所述多个照射区域中的每一个包括限定在其上形成有光致抗蚀剂膜的晶片上的至少一个管芯区域，并通过照射扫描光来扫描与晶片的边缘部分相邻的至少一个管芯区域。

4. 发明授权

US07265818B2 Method of exposing a wafer to a light, and reticle, reticle assembly and exposing apparatus for performing the same 失效
标题翻译：将晶片暴露于光的方法，以及掩模版，掩模版组件和用于执行其的曝光装置
公开(公告)号：US07265818B2
公开(公告)日：2007-09-04
申请号：US11023231
申请日：2004-12-27
申请人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
发明人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
IPC分类号： G03B27/32 , G03B27/42
CPC分类号： G03F7/70425 , G03B27/42 , G03F7/70466
摘要： A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.
摘要翻译：将晶片暴露于光的方法包括通过照射投影光将图像转印到多个照射区域上，所述多个照射区域中的每一个包括限定在其上形成有光致抗蚀剂膜的晶片上的至少一个管芯区域，并通过照射扫描光来扫描与晶片的边缘部分相邻的至少一个管芯区域。

5. 发明申请

US20050140952A1 Method of exposing a wafer to a light, and reticle, reticle assembly and exposing apparatus for performing the same 失效
标题翻译：将晶片暴露于光的方法，以及掩模版，掩模版组件和用于执行其的曝光装置
公开(公告)号：US20050140952A1
公开(公告)日：2005-06-30
申请号：US11023231
申请日：2004-12-27
申请人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
发明人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
IPC分类号： G03F7/20 , G03B27/42 , G03F1/00 , H01L21/027
CPC分类号： G03F7/70425 , G03B27/42 , G03F7/70466
摘要： A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.
摘要翻译：将晶片暴露于光的方法包括通过照射投影光将图像转印到多个照射区域上，所述多个照射区域中的每一个包括限定在其上形成有光致抗蚀剂膜的晶片上的至少一个管芯区域，并通过照射扫描光来扫描与晶片的边缘部分相邻的至少一个管芯区域。

6. 发明申请

US20050138935A1 Temperature controller for a semiconductor-fabricating tool 失效
标题翻译：半导体制造工具的温度控制器
公开(公告)号：US20050138935A1
公开(公告)日：2005-06-30
申请号：US11023328
申请日：2004-12-27
申请人： Dong-Hwa Shin , Byong-Cheol Park , Sang-Ho Lee , Sung-Wook Park
发明人： Dong-Hwa Shin , Byong-Cheol Park , Sang-Ho Lee , Sung-Wook Park
IPC分类号： H01L21/02 , F25B21/02 , H01L21/00 , H01L21/673
CPC分类号： H01L21/67393 , F25B21/02 , F25B2321/0212 , F25B2700/2107 , H01L21/67248
摘要： A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.
摘要翻译：用于半导体制造工具的温度控制器包括设置在半导体制造工具的外壁上的珀耳帖元件和用于向珀耳帖元件提供电流的电池。珀耳帖元件是用于通过设置在其上的电流发射热量的发热板，以及用于吸收热量的吸热板。第一温度传感器感测珀尔帖元件的温度。第二温度传感器感测半导体制造工具的内部温度。控制器根据由第一温度传感器感测的珀耳帖元件的温度和由第二温度传感器感测到的半导体制造工具的内部温度来控制提供给珀尔帖元件的电流量。

7. 发明授权

US07155915B2 Temperature controller for a semiconductor-fabricating tool 失效
标题翻译：半导体制造工具的温度控制器
公开(公告)号：US07155915B2
公开(公告)日：2007-01-02
申请号：US11023328
申请日：2004-12-27
申请人： Dong-Hwa Shin , Byong-Cheol Park , Sang-Ho Lee , Sung-Wook Park
发明人： Dong-Hwa Shin , Byong-Cheol Park , Sang-Ho Lee , Sung-Wook Park
IPC分类号： F25B21/02
CPC分类号： H01L21/67393 , F25B21/02 , F25B2321/0212 , F25B2700/2107 , H01L21/67248
摘要： A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.
摘要翻译：用于半导体制造工具的温度控制器包括设置在半导体制造工具的外壁上的珀耳帖元件和用于向珀耳帖元件提供电流的电池。珀耳帖元件是用于通过设置在其上的电流发射热量的发热板，以及用于吸收热量的吸热板。第一温度传感器感测珀尔帖元件的温度。第二温度传感器感测半导体制造工具的内部温度。控制器根据由第一温度传感器感测的珀耳帖元件的温度和由第二温度传感器感测到的半导体制造工具的内部温度来控制提供给珀尔帖元件的电流量。

8. 发明授权

US08685797B2 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof 有权
标题翻译：具有封装和底部填充的集成电路封装系统及其制造方法
公开(公告)号：US08685797B2
公开(公告)日：2014-04-01
申请号：US13597086
申请日：2012-08-28
申请人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
发明人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除由升高的部分分离而产生的表面。

9. 发明申请

US20120261810A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER 有权
标题翻译：集成电路封装系统与WAFERSCALE SPACER
公开(公告)号：US20120261810A1
公开(公告)日：2012-10-18
申请号：US13536268
申请日：2012-06-28
申请人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L23/50
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2924/01067 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.
摘要翻译：提供一种集成电路封装系统，包括：具有第一背面和第一主动侧的第一装置; 以及具有与所述第一装置的边缘相邻的所有四个角处精确配合的晶片间隔件以及沿着所述第一装置的边缘的凹部。

10. 发明授权

US08254933B2 Apparatus and method for handover between a heterogeneous communication system and a broadband wireless communication system 有权
标题翻译：异构通信系统与宽带无线通信系统之间切换的装置和方法
公开(公告)号：US08254933B2
公开(公告)日：2012-08-28
申请号：US12029809
申请日：2008-02-12
申请人： Young-Hak Choi , Pyeong-Hwan Wee , Sang-Jun Lee , Jae-Yeong Kwon , Sang-Ho Lee
发明人： Young-Hak Choi , Pyeong-Hwan Wee , Sang-Jun Lee , Jae-Yeong Kwon , Sang-Ho Lee
IPC分类号： H04Q7/20
CPC分类号： H04W36/18 , H04W36/0022 , H04W36/0072 , H04W36/14 , H04W36/30 , H04W88/06 , H04W88/10
摘要： An apparatus and a method for handover between a broadband wireless communication system and a heterogeneous communication system are provided. An operating method of a base station for the handover between a broadband wireless communication system and a and a heterogeneous communication system includes when a terminal enters a border cell, sending a message requesting to measure a signal level of a downlink, to the terminal, when a signal level measured by the terminal falls below a preset threshold, requesting a handover, to a corresponding heterogeneous communication system, over a core network, receiving a message, including channel allocation information for the handover, from the corresponding heterogeneous communication system, and forwarding the message, including the channel allocation information, to the terminal. Hence, when the terminal gets out of the service coverage area of the broadband wireless communication system, it can be handed over to the heterogeneous communication system seamlessly.
摘要翻译：提供了宽带无线通信系统与异构通信系统之间切换的装置和方法。用于宽带无线通信系统和异构通信系统之间的切换的基站的操作方法包括当终端进入边界小区时，向终端发送请求测量下行链路的信号电平的消息，当时由终端测量的信号电平低于预设阈值，通过核心网请求切换到相应的异构通信系统，从对应的异构通信系统接收包括用于切换的信道分配信息的消息，以及转发向终端发送包括信道分配信息的消息。因此，当终端离开宽带无线通信系统的服务覆盖区域时，可以无缝地切换到异构通信系统。

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