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    • 2. 发明申请
    • Method and apparatus for exposing semiconductor substrates
    • 曝光半导体衬底的方法和装置
    • US20060001852A1
    • 2006-01-05
    • US11168527
    • 2005-06-29
    • Sang-Ho LeeJin-Phil ChoiDong-Hwa ShinSeung-Ki ChaeByong-Cheol Park
    • Sang-Ho LeeJin-Phil ChoiDong-Hwa ShinSeung-Ki ChaeByong-Cheol Park
    • G03B27/42
    • G03B27/42G03F7/70275
    • Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.
    • 提供了用于仅使用单个光源在单个曝光设备中曝光多个基板的方法和设备,其中第一基板以一系列步骤或照射曝光,在此期间沿主要光学路径传输的光被引导到 衬底,其中衬底在连续镜头之间重新定位。 第二衬底在一段时间期间被曝光,同时通过改变光路来重新定位第一衬底,以将来自光源的光转移到将暴露第二衬底上的区域的次级光路。 当第一衬底被重新定位时,光的转向被终止,使得光将再次沿着主光路传播,以便暴露第一衬底的主表面上的下一个顺序射击。