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1. 发明申请

US20090288293A1 Metal core package substrate and method for manufacturing the same 审中-公开
标题翻译：金属芯封装基板及其制造方法
公开(公告)号：US20090288293A1
公开(公告)日：2009-11-26
申请号：US12232995
申请日：2008-09-26
申请人： Sang Youp Lee , Keung Jin Sohn , Joung Gul Ryu , Jung Hwan Park , Ho Sik Park , Jun Hyeong Park
发明人： Sang Youp Lee , Keung Jin Sohn , Joung Gul Ryu , Jung Hwan Park , Ho Sik Park , Jun Hyeong Park
IPC分类号： H01R43/16
CPC分类号： H05K3/445 , H05K1/056 , H05K3/4069 , H05K3/4608 , H05K2201/0355 , H05K2203/1189 , H05K2203/1461 , Y10T29/49204
摘要： A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps.
摘要翻译：金属芯封装基板及其制造方法。金属芯封装基板的制造方法可以包括：在金属芯中形成多个孔; 形成穿过第一铜箔层和第二铜箔层的绝缘层的多个焊料凸块; 将第一和第二铜箔层定位在与金属芯的孔对应的位置处，使得焊膏凸起彼此围绕金属芯相对; 通过按压第一和第二铜箔层，允许每个焊膏凸起穿入金属芯的孔中; 并且在金属芯中形成用该焊膏凸起的内部电路。

2. 发明申请

US20120097438A1 Printed Circuit Board and Method For Fabricating The Same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120097438A1
公开(公告)日：2012-04-26
申请号：US13009789
申请日：2011-01-19
申请人： Tae Kyun Bae , Chang Gun Oh , Ho Sik Park
发明人： Tae Kyun Bae , Chang Gun Oh , Ho Sik Park
IPC分类号： H05K1/00 , H05K3/00 , H05K1/11
CPC分类号： H05K3/4647 , H05K1/0366 , H05K2201/0195 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/51
摘要： Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.
摘要翻译：这里公开了一种制造印刷电路板的方法，包括：在其上形成有具有柱经的第一绝缘层的外表面上堆叠包括增强材料的第二绝缘层; 抛光所述第二绝缘层的上表面以暴露所述柱通孔的上侧; 在第二绝缘层上堆叠膜构件以覆盖柱经和压缩第二绝缘层; 抛光膜构件的上表面以暴露柱通孔的上侧; 以及在所述膜构件的上表面上形成连接到所述柱通孔的电路层。

3. 发明授权

US08720049B2 Printed circuit board and method for fabricating the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08720049B2
公开(公告)日：2014-05-13
申请号：US13009789
申请日：2011-01-19
申请人： Tae Kyun Bae , Chang Gun Oh , Ho Sik Park
发明人： Tae Kyun Bae , Chang Gun Oh , Ho Sik Park
IPC分类号： H05K3/20
CPC分类号： H05K3/4647 , H05K1/0366 , H05K2201/0195 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/51
摘要： Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.
摘要翻译：这里公开了一种制造印刷电路板的方法，包括：在其上形成有具有柱经的第一绝缘层的外表面上堆叠包括增强材料的第二绝缘层; 抛光所述第二绝缘层的上表面以暴露所述柱通孔的上侧; 在第二绝缘层上堆叠膜构件以覆盖柱经和压缩第二绝缘层; 抛光膜构件的上表面以暴露柱通孔的上侧; 以及在所述膜构件的上表面上形成连接到所述柱通孔的电路层。

4. 发明授权

US08356405B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US08356405B2
公开(公告)日：2013-01-22
申请号：US12972244
申请日：2010-12-17
申请人： Chang Gun Oh , Ho Sik Park , Tae Kyun Bae
发明人： Chang Gun Oh , Ho Sik Park , Tae Kyun Bae
IPC分类号： H05K3/36
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/4647 , H05K2203/1536 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of a thermoplastic resin, and second metal foils respectively formed on the adhesive layers; applying resists having openings for forming metal posts onto both sides of the carrier; forming metal plating layers for forming the metal posts in the openings; grinding surfaces of the resists; removing the resist and forming insulation layers on both sides of the carrier; and grinding surfaces of the insulation layers. The method is advantageous in that both sides of a carrier are simultaneously layered, it is possible to prevent a substrate from warping during the process of manufacturing the printed circuit board.
摘要翻译：本发明公开了一种制造印刷电路板的方法，包括：提供包括绝缘层的载体，形成在绝缘层两侧的第一金属箔，分别形成在第一金属箔上并由热塑性树脂制成的粘合层，和分别形成在粘合剂层上的第二金属箔; 在载体的两侧上施加具有用于形成金属柱的开口的抗蚀剂; 形成用于在所述开口中形成所述金属柱的金属镀层; 研磨抗蚀剂表面; 去除抗蚀剂并在载体的两侧形成绝缘层; 并研磨绝缘层的表面。该方法的优点在于，载体的两侧同时层叠，可以防止在制造印刷电路板的过程中基板翘曲。

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