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1. 发明申请

US20090288293A1 Metal core package substrate and method for manufacturing the same 审中-公开
标题翻译：金属芯封装基板及其制造方法
公开(公告)号：US20090288293A1
公开(公告)日：2009-11-26
申请号：US12232995
申请日：2008-09-26
申请人： Sang Youp Lee , Keung Jin Sohn , Joung Gul Ryu , Jung Hwan Park , Ho Sik Park , Jun Hyeong Park
发明人： Sang Youp Lee , Keung Jin Sohn , Joung Gul Ryu , Jung Hwan Park , Ho Sik Park , Jun Hyeong Park
IPC分类号： H01R43/16
CPC分类号： H05K3/445 , H05K1/056 , H05K3/4069 , H05K3/4608 , H05K2201/0355 , H05K2203/1189 , H05K2203/1461 , Y10T29/49204
摘要： A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps.
摘要翻译：金属芯封装基板及其制造方法。金属芯封装基板的制造方法可以包括：在金属芯中形成多个孔; 形成穿过第一铜箔层和第二铜箔层的绝缘层的多个焊料凸块; 将第一和第二铜箔层定位在与金属芯的孔对应的位置处，使得焊膏凸起彼此围绕金属芯相对; 通过按压第一和第二铜箔层，允许每个焊膏凸起穿入金属芯的孔中; 并且在金属芯中形成用该焊膏凸起的内部电路。

2. 发明申请

US20120047671A1 SQUEEGEE MODULE 审中-公开
公开(公告)号：US20120047671A1
公开(公告)日：2012-03-01
申请号：US12987900
申请日：2011-01-10
申请人： Yeo Il Park , Seon Jae Mun , Jun Hyeong Park , Seung Wan Kim , Sun Moon Kim , Dong Sun Kim , Seung Ho Beak , Chang Hee Lee
发明人： Yeo Il Park , Seon Jae Mun , Jun Hyeong Park , Seung Wan Kim , Sun Moon Kim , Dong Sun Kim , Seung Ho Beak , Chang Hee Lee
IPC分类号： A47L1/06
CPC分类号： H01L24/742 , B23K1/0016 , B23K3/0607 , B23K3/08 , B23K2101/42 , H01L24/11 , H01L2224/1132 , H01L2224/131 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A squeegee module. The squeegee module of the present invention includes a rotary unit rotated in opposite directions, support rods mounted to the rotary unit on opposite sides of the center of the rotary unit, a squeegee holder connected to ends of the support rods, and a squeegee blade mounted to the squeegee holder, wherein the squeegee holder moves upwards and downwards in cooperation with rotation of the rotary unit, thus controlling the inclination angle of the squeegee blade.
摘要翻译：刮板模块。本发明的刮板组件包括沿相反方向旋转的旋转单元，在旋转单元的中心的相对侧上安装到旋转单元的支撑杆，连接到支撑杆的端部的刮板保持器，以及安装与刮刀保持器相关联，其中，刮板保持件与旋转单元的旋转协同地上下移动，从而控制刮板的倾斜角度。

3. 发明申请

US20150242945A1 SYSTEM AND METHOD FOR PROVIDING BIDDING SERVICE 审中-公开
标题翻译：提供投标服务的系统和方法
公开(公告)号：US20150242945A1
公开(公告)日：2015-08-27
申请号：US14632784
申请日：2015-02-26
申请人： Gyu Sung PARK , Jun Hyeong PARK
发明人： Gyu Sung PARK , Jun Hyeong PARK
IPC分类号： G06Q30/08 , G06Q30/06
CPC分类号： G06Q30/08 , G06Q30/0611
摘要： The present invention disclosed herein relates to a system and method for providing a bidding service. A bidding service providing system according to an embodiment of the present invention may include a bidding condition determination unit configured to determine a maximum number of bidders and a bidding price on a basis of an equivalent value of a bid subject, a successful bidder selection unit configured to select a predetermined number of successful bidders from among bidders, and a repayment processing unit configured to set a credit-debt relation between the successful bidders and failed bidders and perform a process for repayment of debt to the failed bidders by the successful bidders.
摘要翻译：本文公开的本发明涉及一种用于提供投标服务的系统和方法。根据本发明的实施例的投标服务提供系统可以包括投标条件确定单元，其被配置为基于投标对象的等效值来确定投标者的最大数量和投标价格，成功投标者选择单元配置从投标人中选择预定数量的成功投标者，以及偿还处理单元，其被配置为设置成功的投标者和失败的投标者之间的信用债务关系，并且由成功的投标者执行偿还对失败的投标者的债务的处理。

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