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1. 发明授权

US5569711A Cycloolefin resin composition 失效
公开(公告)号：US5569711A
公开(公告)日：1996-10-29
申请号：US431025
申请日：1995-04-28
申请人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
发明人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
IPC分类号： C08L21/00 , C08L23/08 , C08L45/00 , C08L51/04 , C08L51/06 , C08L65/00 , C08L77/00
CPC分类号： G11B7/2538 , C08L23/08 , C08L45/00 , C08L51/04 , C08L51/06 , C08L65/00 , C08L77/00 , C08L21/00
摘要： The cycloolefin resin compositions of the present invention comprise:[A] cycloolefin resin selected from (a-1) a cycloolefin random copolymer having recurring units derived from a cycloolefin of a specific structure, (a-2) a ring opening (co)polymer of the cycloolefin, (a-3) a hydrogenation product of the ring opening (co)polymer and (a-4) a graft-modified product of the random copolymer (a-1), the ring opening (co)polymer (a-2) and the hydrogenation product thereof (a-3);[B] at least one of (b-1) an unmodified elastomer, (b-2) a modified elastomer, (b-3) an unmodified crystalline polyolefin and (b-4) a modified crystalline polyolefin; and[C] a polyamide resin. Molded products formed from these cycloolefin resin compositions are excellent particularly in resistance to greases.

2. 发明授权

US5439973A Cycloolefin resin composition 失效
标题翻译：环烯烃树脂组合物
公开(公告)号：US5439973A
公开(公告)日：1995-08-08
申请号：US333337
申请日：1994-11-02
申请人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
发明人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
IPC分类号： C08L21/00 , C08L23/08 , C08L45/00 , C08L51/04 , C08L51/06 , C08L65/00 , C08L77/00
CPC分类号： G11B7/2538 , C08L23/08 , C08L45/00 , C08L51/04 , C08L51/06 , C08L65/00 , C08L77/00 , C08L21/00
摘要： The cycloolefin resin compositions of the present invention comprise:[A] cycloolefin resin selected from (a-1) a cycloolefin random copolymer having recurring units derived from a cycloolefin of a specific structure, (a-2) a ring opening (co)polymer of the cycloolefin, (a-3) a hydrogenation product of the ring opening (co)polymer and (a-4) a graft-modified product of the random copolymer (a-1), the ring opening (co)polymer (a-2) and the hydrogenation product thereof (a-3);[B] at least one of (b-1) an unmodified elastomer, (b-2) a modified elastomer, (b-3) an unmodified crystalline polyolefin and (b-4) a modified crystalline polyolefin; and[C] a polyamide resin. Molded products formed from these cycloolefin resin compositions are excellent particularly in resistance to greases.
摘要翻译：本发明的环烯烃树脂组合物包含：[a]环烯烃树脂，其选自（a-1）具有来源于特定结构的环烯烃的重复单元的环烯烃无规共聚物，（a-2）开环（共）聚合物的环烯烃（a-3）是开环（共）聚合物的氢化产物和（a-4）无规共聚物（a-1）的接枝改性产物，开环（共）聚合物（a-3） -2）及其氢化产物（a-3）; [b]（b-1）未改性弹性体，（b-2）改性弹性体，（b-3）未改性结晶聚烯烃和（b-4）改性结晶聚烯烃中的至少一种; 和[C]聚酰胺树脂。由这些环烯烃树脂组合物形成的成型品特别优异地耐油脂性。

3. 发明授权

US5516841A Cycloolefin resin composition 失效
公开(公告)号：US5516841A
公开(公告)日：1996-05-14
申请号：US431011
申请日：1995-04-28
申请人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
发明人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
IPC分类号： C08L21/00 , C08L23/08 , C08L45/00 , C08L51/04 , C08L51/06 , C08L65/00 , C08L77/00
CPC分类号： G11B7/2538 , C08L23/08 , C08L45/00 , C08L51/04 , C08L51/06 , C08L65/00 , C08L77/00 , C08L21/00
摘要： The cycloolefin resin compositions of the present invention comprise:[A] cycloolefin resin selected from (a-1) a cycloolefin random copolymer having recurring units derived from a cycloolefin of a specific structure, (a-2) a ring opening (co)polymer of the cycloolefin, (a-3) a hydrogenation product of the ring opening (co)polymer and (a-4) a graft-modified product of the random copolymer (a-1), the ring opening (co)polymer (a-2) and the hydrogenation product thereof (a-3);[B] at least one of (b-1) an unmodified elastomer, (b-2) a modified elastomer, (b-3) an unmodified crystalline polyolefin and (b-4) a modified crystalline polyolefin; and[C] a polyamide resin. Molded products formed from these cycloolefin resin compositions are excellent particularly in resistance to greases.

4. 发明授权

US5585433A Cycloolefin resin composition 失效
公开(公告)号：US5585433A
公开(公告)日：1996-12-17
申请号：US431012
申请日：1995-04-28
申请人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
发明人： Sanehiro Yamamoto , Toshio Kimura , Takasi Nakagawa , Akinori Toyota
IPC分类号： C08L23/08 , C08L65/00 , C08L77/00
CPC分类号： C08L65/00 , C08L23/08 , C08L77/00
摘要： The cycloolefin resin compositions of the present invention comprise:[A] cycloolefin resin selected from (a-1) a cycloolefin random copolymer having recurring units derived from a cycloolefin of a specific structure, (a-2) a ring opening (co)polymer of the cycloolefin, (a-3) a hydrogenation product of the ring opening (co)polymer and (a-4) a graft-modified product of the random copolymer (a-1), the ring opening (co)polymer (a-2) and the hydrogenation product thereof (a-3);[B] at least one of (b-1) an unmodified elastomer, (b-2) a modified elastomer, (b-3) an unmodified crystalline polyolefin and (b-4) a modified crystalline polyolefin; and[C] a polyamide resin. Molded products formed from these cycloolefin resin compositions are excellent particularly in resistance to greases.

5. 发明授权

US5424104A Thermoplastic resin composition and use thereof 失效
标题翻译：热塑性树脂组合物及其用途
公开(公告)号：US5424104A
公开(公告)日：1995-06-13
申请号：US178616
申请日：1994-01-07
申请人： Yoshikatsu Amimoto , Fumitoshi Ikejiri , Sanehiro Yamamoto , Akinori Toyota , Katunari Nishimura , Masahiro Kanda , Tetsuo Kato
发明人： Yoshikatsu Amimoto , Fumitoshi Ikejiri , Sanehiro Yamamoto , Akinori Toyota , Katunari Nishimura , Masahiro Kanda , Tetsuo Kato
IPC分类号： C08L51/06 , C08K5/49 , C08K5/524 , C08L77/00 , C08L77/06 , H01R13/46 , B29D22/00 , B29D23/00
CPC分类号： C08L77/00
摘要： Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).
摘要翻译：公开了一种热塑性树脂组合物，其包含（A）包含二羧酸单元的芳族聚酰胺，所述二羧酸单元包含50-100摩尔％的由对苯二甲酸衍生的单元，以及0-50摩尔％的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸，以及衍生自脂族二胺和/或脂环族二胺的二胺单元，所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。硫酸在30℃，熔点高于300℃，（B）接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和（ C）脂肪族聚酰胺，其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物（B）和5- 基于100重量份的芳族聚酰胺（A），80重量份的脂肪族聚酰胺（C）。

6. 发明授权

US5306754A Polyamide resin composition and connector 失效
标题翻译：聚酰胺树脂组合物和连接器
公开(公告)号：US5306754A
公开(公告)日：1994-04-26
申请号：US32864
申请日：1993-03-17
申请人： Sanehiro Yamamoto , Kazuto Sugiyama , Akinori Toyota , Yoshikatsu Amimoto , Fumitoshi Ikejiri , Tetsuo Kato , Masahiro Kanda
发明人： Sanehiro Yamamoto , Kazuto Sugiyama , Akinori Toyota , Yoshikatsu Amimoto , Fumitoshi Ikejiri , Tetsuo Kato , Masahiro Kanda
IPC分类号： C08K5/13 , C08K5/36 , C08K5/372 , C08L23/26 , C08L77/00 , C08L77/06 , C08L77/10 , H01B3/30 , H01R13/46 , C08K13/00
CPC分类号： H01B3/306 , C08K5/13 , C08K5/372 , C08L77/10
摘要： The resin composition of the invention comprises as resin components specific aromatic polyamide (A), a specific graft-modified polymer (B), an aliphatic polyamide (C), and plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C. and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.
摘要翻译：本发明的树脂组合物包含作为树脂组分的特定芳族聚酰胺（A），特定的接枝改性聚合物（B），脂肪族聚酰胺（C）和多种抗氧化剂，其包含具有分子量的受阻酚型抗氧化剂不低于500，TGA 10％重量减轻温度不低于300℃，分子量不小于600的硫型抗氧化剂（E）和TGA 10％重量损失温度不低于 280℃。本发明的连接器具有由上述树脂组合物形成的壳体。本发明的树脂组合物显示出优异的耐热性。本发明的连接器重量轻，耐热性，耐水性和耐化学性优异。

7. 发明授权

US5763517A Thermoplastic resin composition and molded product thereof 失效
标题翻译：热塑性树脂组合物及其成型体
公开(公告)号：US5763517A
公开(公告)日：1998-06-09
申请号：US721272
申请日：1996-09-26
申请人： Sanehiro Yamamoto , Kazuto Sugiyama , Akinori Toyota , Yoshikatsu Amimoto , Fumitoshi Ikejiri
发明人： Sanehiro Yamamoto , Kazuto Sugiyama , Akinori Toyota , Yoshikatsu Amimoto , Fumitoshi Ikejiri
IPC分类号： C08F255/02 , C08F255/08 , C08F279/00 , C08F283/14 , C08K5/13 , C08K5/36 , C08K5/372 , C08L23/26 , C08L51/04 , C08L51/06 , C08L77/00 , C08L77/06
CPC分类号： C08L51/06 , C08F255/02 , C08F255/08 , C08F279/00 , C08F283/14 , C08K5/13 , C08K5/372 , C08L51/04 , C08L77/00 , C08L77/06
摘要： The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280.degree. C., particularly preferably (A-1) specific polyamide having a melting point of higher than 300.degree. C., (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C., and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.
摘要翻译：本发明的热塑性树脂组合物包含（A）熔点不低于280℃的聚酰胺，特别优选熔点高于300℃的（A-1）特定聚酰胺，（B）特定的改性聚合物，（C）分子量不小于500的TGA 10％失重温度不低于300℃的受阻酚型抗氧化剂，（D）具有分子量重量不低于600，TGA 10％重量减少温度不低于280℃。本发明的成型产品由上述热塑性树脂组合物制成。本发明的热塑性树脂组合物的热稳定性优良。

8. 发明授权

US5113018A Method of producing N-alkylaminophenols 失效
标题翻译：生产N-烷基氨基酚的方法
公开(公告)号：US5113018A
公开(公告)日：1992-05-12
申请号：US538719
申请日：1990-06-15
申请人： Yoshito Kurano , Masato Kawamura , Masahiro Kondo , Michio Tanaka , Sanehiro Yamamoto
发明人： Yoshito Kurano , Masato Kawamura , Masahiro Kondo , Michio Tanaka , Sanehiro Yamamoto
IPC分类号： C07C213/02
CPC分类号： C07C213/02
摘要： N-alkyl amino phenols, such as N-ethyl-m-amino phenol are produced in high yield and with high purity by reacting a divalent phenol, such as resorcinol, with an alkylamine, such as ethylamine, in the absence of catalyst and solvent, at a temperature of 120.degree.-210.degree. C. under elevated pressure in an inert gas atmosphere. In a first embodiment, the resulting reaction mixture is acidified to convert the N-alkylaminophenol to its water soluble salt and the resulting aqueous layer is separated from the oily layer. The aqueous layer is rendered alkaline to liberate N-alkylaminophenol as an oily layer. The N-alkyl-aminophenol oily layer is then separated from the aqueous layer and distilled. In an alternative embodiment, the reaction mixture resulting from the reaction between the divalent phenol and alkylamine is combined with an aqueous solution of an alkali to convert unreacted phenol to its water soluble salt while the product N-alkylaminophenol remains in an oily phase which is separated from the aqueous phase. An organic solvent is used as an extractant. The recovered N-alkylaminophenol organic solution is then distilled to recover N-alkylaminophenol. Purities of the recovered N-alkylaminophenol in excess of 95% can be achieved.

9. 发明授权

US4891431A Process for preparing 2-unsubstituted imidazoles 失效
标题翻译：制备2-未取代的咪唑的方法
公开(公告)号：US4891431A
公开(公告)日：1990-01-02
申请号：US107799
申请日：1987-09-25
申请人： Sanehiro Yamamoto , Mitsuki Yasuhara , Fujihisa Matsunaga , Masato Okano , Mitsunori Nakamura
发明人： Sanehiro Yamamoto , Mitsuki Yasuhara , Fujihisa Matsunaga , Masato Okano , Mitsunori Nakamura
IPC分类号： C07D233/54 , C07D233/58
CPC分类号： C07D233/56 , C07D233/64
摘要： A process for preparing 2-unsubstituted imidazoles which comprises reacting an .alpha.-hydroxycarbonyl compound with a formamide in such amounts as to make the molar ratio of said formamide to said hydroxycarbonyl compound not more than 2 at a reaction temperature of 100.degree.-170.degree. C. in an atmosphere of ammonia gas. According to this process, 2-unsubstituted imidazoles may be obtained in very high yields. In addition, because no great excess of formamide is used in carrying out the reaction, an effect of not requiring the recovery operation incident to decomposition of formamide is obtained as well. And by removing formic acid formed as a by-product by the reaction, a reactor and separation equipment such as a distillation column are not corroded, and imidazoles of a high purity can be obtained.

10. 发明授权

US5324766A Resin composition for forming plated layer and use thereof 失效
标题翻译：用于形成镀层的树脂组合物及其用途
公开(公告)号：US5324766A
公开(公告)日：1994-06-28
申请号：US138390
申请日：1993-10-20
申请人： Fumitoshi Ikejiri , Sanehiro Yamamoto , Keiji Kawamoto
发明人： Fumitoshi Ikejiri , Sanehiro Yamamoto , Keiji Kawamoto
IPC分类号： C08K3/00 , H05K1/03 , H05K9/00 , C08J5/08 , C08K3/18 , C08K3/22 , C08L77/00
CPC分类号： H05K9/0083 , C08K3/0033 , H05K1/0346
摘要： The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.
摘要翻译：本文公开的用于形成镀层的树脂组合物包含由二羧酸组分回收单元组成的聚酰胺和衍生自具有4至25个碳原子的亚烷基的二胺组分单元和至少一种无机填料的重复单元。还公开了在由树脂组合物形成的树脂模塑制品的表面上形成有镀层的树脂模塑制品，电磁波屏蔽材料，装饰性树脂模塑制品和通过形成镀层制成的连接材料。此外，公开了通过在由所述树脂组合物形成的树脂模塑制品的表面上的布线电路部分中选择性地金属化层形成的印刷电路板和用于镀覆其上镀有层的这些制品的方法。

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