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    • 3. 发明专利
    • Three-dimensional semiconductor device
    • 三维半导体器件
    • JP2011211200A
    • 2011-10-20
    • JP2011071053
    • 2011-03-28
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • SETSU KOSHUHWANG KI-HYUNCHOI HANMEIPARK CHAN-JINHUR SUNG-HOI
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L29/42348H01L21/32137H01L27/0688H01L27/11551H01L27/11556H01L27/11578H01L27/11582H01L29/511H01L29/517H01L29/792H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a three-dimensional semiconductor device which increases a thickness of a conductive pattern arranged three-dimensionally and thereby can decrease its resistance.SOLUTION: The device includes a horizontal structure laminated on a substrate in order and a vertical structure crossing the horizontal structure vertically. Each of the horizontal structure contains a second pattern which covers a conductive line parallel to the substrate and one side wall of the conductive line adjacent to the vertical structure. Moreover, each of the vertical structure contains a first pattern which covers the semiconductor column and at least one side wall of the semiconductor column adjacent to the horizontal structure. The device includes an electrode structure containing an electrode laminated on the substrate in order, a semiconductor pattern passing through the electrode structure vertically, and a memory element which has the first and second patterns and is interposed between the semiconductor pattern and electrode structure. The first pattern is extended vertically to cross a plurality of electrodes, and the second pattern is extended horizontally to cross a plurality of semiconductor patterns.
    • 要解决的问题:提供三维半导体器件,其增加三维布置的导电图案的厚度,从而可以降低其电阻。解决方案:该器件依次层叠在基板上并具有垂直结构 横向横向结构。 每个水平结构包含第二图案,其覆盖平行于基板的导电线和与垂直结构相邻的导线的一个侧壁。 此外,每个垂直结构都包含覆盖半导体柱的第一图案和与水平结构相邻的半导体柱的至少一个侧壁。 该装置包括依次层叠在基板上的电极,垂直地贯穿电极结构的半导体图形的电极结构以及具有第一图案和第二图案并位于半导体图案和电极结构之间的存储元件。 第一图案垂直延伸以跨越多个电极,并且第二图案水平延伸以跨越多个半导体图案。
    • 5. 发明专利
    • Non-volatile memory cell programming method
    • 非易失性记忆体编程方法
    • JP2009032386A
    • 2009-02-12
    • JP2008164829
    • 2008-06-24
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • PARK SANG-JINSETSU KOSHU
    • G11C16/02G11C16/04G11C16/06
    • G11C16/10
    • PROBLEM TO BE SOLVED: To provide a nonvolatile memory cell programming method. SOLUTION: This memory cell programming method includes a first programming step, a second programming step and a stabilization step. In the first programming step, a first bit of the 2-bit data is programmed in the memory cell by applying a first programming voltage to the memory cell. In the second programming step, a second bit of the 2-bit data is programmed in the memory cell by applying a second programming voltage to the memory cell. In the stabilization step, a stabilization voltage having an electric field opposite to electric fields formed by the first and second programming voltages is applied to the memory cell after the programming step corresponding to the programming voltage of higher level out of the first programming voltage and second programming voltage. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种非易失性存储单元编程方法。 该存储单元编程方法包括第一编程步骤,第二编程步骤和稳定步骤。 在第一编程步骤中,通过向存储器单元施加第一编程电压,将2位数据的第一位编程在存储单元中。 在第二编程步骤中,通过向存储单元施加第二编程电压,将2位数据的第二位编程在存储单元中。 在稳定步骤中,在与第一编程电压之外的较高电平的编程电压相对应的编程步骤之后,将具有与由第一编程电压和第二编程电压形成的电场相反的电场的稳定电压施加到存储器单元, 编程电压。 版权所有(C)2009,JPO&INPIT