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    • 1. 发明专利
    • Manufacture method of nonvolatile memory device
    • 非易失性存储器件的制造方法
    • JP2007053362A
    • 2007-03-01
    • JP2006217337
    • 2006-08-09
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • JEONG YOUNG-CHEONKWON CHUL-SOONYU JAE-MINPARK ZAIGENRIM JI-WOONYOON IN-GU
    • H01L21/8247H01L27/10H01L27/115H01L29/788H01L29/792
    • H01L29/7881H01L21/28273H01L27/105H01L27/11526H01L27/11543H01L29/42324
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a split-gate nonvolatile memory device.
      SOLUTION: A first gate insulating film and a first conductive film are formed on a substrate, and an oxide film pattern is formed by oxidizing the conductive film partially. A floating gate electrode is formed on the first gate insulating film through a process of partly etching the first conductive film by using the oxide film pattern as an etching mask. After a first silicon film is formed on all the surface of the substrate where the floating gate electrode is formed, a tunnel insulating film and a second gate insulating film are formed on the side of the floating gate electrode and a part of the surface of the substrate adjacent to the floating gate electrode respectively by oxidizing the first silicon film. A control gate electrode is formed on the tunnel insulating film and the second gate insulating film. A second silicon film is formed on all the surface of the substrate where the control gate electrode is formed, and the second silicon film is turned to a thermal oxide film.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 解决的问题:提供一种制造分离式非易失性存储装置的方法。 解决方案:在基板上形成第一栅极绝缘膜和第一导电膜,并且部分地氧化导电膜形成氧化物膜图案。 通过使用氧化膜图案作为蚀刻掩模,部分地蚀刻第一导电膜的工艺,在第一栅极绝缘膜上形成浮栅电极。 在形成浮栅的衬底的所有表面上形成第一硅膜之后,在浮栅电极的一侧形成隧道绝缘膜和第二栅绝缘膜, 通过氧化第一硅膜分别与浮置栅电极相邻的衬底。 在隧道绝缘膜和第二栅极绝缘膜上形成控制栅电极。 在形成控制栅极的基板的所有表面上形成第二硅膜,并将第二硅膜转变为热氧化膜。 版权所有(C)2007,JPO&INPIT