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    • 4. 发明专利
    • Method of manufacturing eeprom cell
    • 制造EEPROM单元的方法
    • JP2005322920A
    • 2005-11-17
    • JP2005134634
    • 2005-05-02
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • JEON HEE-SEOGYOON SEUNG-BEOMKIN RYUTAI
    • H01L21/8247H01L21/28H01L21/336H01L21/8242H01L27/115H01L29/423H01L29/788H01L29/792
    • H01L27/11521H01L21/28273H01L27/115H01L27/11524H01L29/42324H01L29/66825
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing an EEPROM cell with an improved process of forming a tunnel oxide layer. SOLUTION: The method of manufacturing EEPROM cell includes the steps of: forming a first conductive layer pattern and a tunneling oxide layer, under the first conductive layer pattern; forming a second conductive layer pattern on both sides of the first conductive layer pattern via a gate oxide layer formed on the sidewalls of the first conductive layer pattern and a substrate; then electrically connecting the two patterns to form a conductive layer for a floating gate; forming a coupling oxide layer and a third conductive layer on the conductive layer for a floating gate; and then patterning these layers to create a selected transistor section on the tunneling oxide layer and a control transistor section, wherein the select transistor section has formed a gate stack made up of a selected gate, a first coupling oxide layer pattern and a first floating gate, and the control transistor section has, separated from the select transistor section, a gate stack made up of a control gate, a second coupling oxide layer pattern and a second floating gate. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种通过改进的形成隧道氧化物层的工艺来制造EEPROM电池的方法。 解决方案:EEPROM单元的制造方法包括以下步骤:在第一导电层图案下形成第一导电层图案和隧道氧化物层; 通过形成在第一导电层图案和衬底的侧壁上的栅极氧化层,在第一导电层图案的两侧上形成第二导电层图案; 然后电连接两个图案以形成用于浮动栅极的导电层; 在浮栅的导电层上形成耦合氧化物层和第三导电层; 然后对这些层进行构图以在隧道氧化物层和控制晶体管部分上形成选定的晶体管部分,其中选择晶体管部分形成由选择的栅极,第一耦合氧化物层图案和第一浮动栅极构成的栅极堆叠 并且控制晶体管部分与选择晶体管部分分离由控制栅极,第二耦合氧化物层图案和第二浮置栅极组成的栅极堆叠。 版权所有(C)2006,JPO&NCIPI
    • 5. 发明专利
    • Split gate-type nonvolatile semiconductor memory device and manufacturing method of same
    • 分离栅型非易失性半导体存储器件及其制造方法
    • JP2005268804A
    • 2005-09-29
    • JP2005077986
    • 2005-03-17
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • JEON HEE-SEOGYOON SEUNG-BEOMKIN RYUTAICHOI YONG-SUK
    • H01L21/8247H01L21/28H01L21/336H01L27/115H01L29/423H01L29/51H01L29/788H01L29/792
    • H01L27/115H01L21/28273H01L27/11521H01L29/42324H01L29/513H01L29/7881
    • PROBLEM TO BE SOLVED: To provide a split gate-type nonvolatile semiconductor memory device and a manufacturing method of the same.
      SOLUTION: A gate insulating layer and a floating gate conductive layer are formed on a semiconductor substrate, a mask layer pattern is formed, a first sacrifice spacer is formed on both walls thereof, an inter-gate insulating layer is formed on the floating gate insulating conductive layer, the first sacrifice spacer is removed, etching is performed on the floating gate conductive layer with the mask layer pattern and inter-gate insulating layer as the masks, a tunneling insulating layer is formed on an exposed portion thereof, a control gate conductive layer is formed on the entire surface of the semiconductor substrate, a second sacrifice spacer is formed thereon, etching is performed on the control gate conductive layer with it as a mask to form the control gate, and etching is performed on the remaining mask layer pattern, inter-gate insulating layer and exposed floating gate conductive layer to form the floating gate.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 解决的问题:提供一种分离式栅型非易失性半导体存储器件及其制造方法。 解决方案:在半导体衬底上形成栅极绝缘层和浮栅导电层,形成掩模层图案,在其两个壁上形成第一牺牲隔离物,在栅极绝缘层上形成栅极间绝缘层 浮置栅极绝缘导电层,去除第一牺牲间隔物,以掩模层图案和栅极间绝缘层为掩模对浮栅导电层进行蚀刻,在其暴露部分上形成隧道绝缘层, 控制栅极导电层形成在半导体衬底的整个表面上,在其上形成第二牺牲衬垫,以控制栅极导电层作为掩模进行蚀刻,形成控制栅极,并对剩余的栅极进行蚀刻 掩模层图案,栅极间绝缘层和暴露的浮栅导电层以形成浮栅。 版权所有(C)2005,JPO&NCIPI
    • 6. 发明专利
    • Eeprom device and method of manufacturing the same
    • EEPROM装置及其制造方法
    • JP2008066725A
    • 2008-03-21
    • JP2007226188
    • 2007-08-31
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • PARK WEON-HOHAN JEONG-UKKIN RYUTAI
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L29/42324H01L27/115H01L27/11521H01L27/11524H01L27/1203
    • PROBLEM TO BE SOLVED: To provide an EEPROM device having improved integration and reliability by a simplified structure, and to provide a method of manufacturing the same. SOLUTION: After forming a tunnel insulating film on a substrate, first and second gate structures having substantially the same structure are formed so as to be mutually isolated from each other on the tunnel insulating film. After forming a common source region on the substrate between the first and second gate structures, first and second drain regions are formed respectively in first and second parts of the substrate adjacent to the first and second gate structures, respectively. Accordingly, functions of a memory transistor and a selection transistor are mutually alternately performed by application of a signal, thus achieving an EEPROM device having first and second transistors of substantially the same structure. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种通过简化的结构提高集成度和可靠性的EEPROM器件,并提供其制造方法。 解决方案:在衬底上形成隧道绝缘膜之后,形成具有基本相同结构的第一和第二栅极结构,以便在隧道绝缘膜上彼此相互隔离。 在第一和第二栅极结构之间的衬底上形成公共源极区域之后,分别在衬底的与第一和第二栅极结构相邻的第一和第二部分中分别形成第一和第二漏极区域。 因此,存储晶体管和选择晶体管的功能通过施加信号相互交替地执行,从而实现具有基本上相同结构的第一和第二晶体管的EEPROM器件。 版权所有(C)2008,JPO&INPIT
    • 8. 发明专利
    • High voltage transistor and manufacturing method therefor
    • 高压晶体管及其制造方法
    • JP2005064508A
    • 2005-03-10
    • JP2004233400
    • 2004-08-10
    • Samsung Electronics Co Ltd三星電子株式会社
    • YOO TAE-KWANGJEON HEE-SEOGYOON SEUNG-BEOMKIN RYUTAI
    • H01L29/41H01L21/265H01L21/28H01L21/336H01L21/8247H01L27/115H01L29/417H01L29/423H01L29/78H01L29/788H01L29/792H01L31/0328
    • H01L29/66659H01L21/26586H01L21/28114H01L29/42376H01L29/665H01L29/7835
    • PROBLEM TO BE SOLVED: To provide a high-voltage transistor for which transistor space can be reduced and a salicide process can be applied, and to provide its manufacturing method.
      SOLUTION: This high-voltage transistor is equipped with a channel region formed on a semiconductor substrate, gate insulating film formed on the channel region, lightly-doped source region and lightly-doped drain region formed on the semiconductor substrate through the channel region, heavily-doped source region separated from the channel region by a primary distance, heavily-doped drain region separated from the channel region by a secondary distance which is larger than the primary distance, the gate bottom which is in contact with the gate insulating film on the channel region, the gate electrode formed to be integrated with the gate bottom that has the upper part of the gate extending from the gate bottom and projecting beyond the low concentration drain region by a predetermined length, primary metal silicide layer formed on the heavily-doped source region, and secondary metal silicide layer formed on the heavily-doped drain region.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供可以减小晶体管空间并可以应用自对准硅化物工艺的高压晶体管,并提供其制造方法。 解决方案:该高电压晶体管配备有形成在半导体衬底上的沟道区,形成在沟道区上的栅极绝缘膜,通过沟道形成在半导体衬底上的轻掺杂源极区和轻掺杂漏极区 区域,重掺杂源极区域与沟道区域分离一次距离,从沟道区域分离出大于主要距离的次级距离的重掺杂漏极区域,与栅极绝缘体接触的栅极底部 所述栅电极形成为与所述栅极一体化,所述栅极底部具有从所述栅极底部延伸并突出超过所述低浓度漏极区域预定长度的所述栅极的上部,所述栅极电极形成在所述栅极底部上, 重掺杂源极区和形成在重掺杂漏极区上的二次金属硅化物层。 版权所有(C)2005,JPO&NCIPI