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1. 发明申请

US20100213960A1 Probe Card Test Apparatus And Method 失效
标题翻译：探针卡测试仪和方法
公开(公告)号：US20100213960A1
公开(公告)日：2010-08-26
申请号：US12682391
申请日：2008-10-10
申请人： Sammy Mok , Frank Swiatowiec , Fariborz Agahdel
发明人： Sammy Mok , Frank Swiatowiec , Fariborz Agahdel
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R35/00
摘要： A probe card analyzer mounts on a probe card in a wafer prober and a use a fixture in the wafer probe and switch electronics in place of an ATE head. Methods of testing can confirm that probe cards are operating within their specifications over large temperature ranges and the mechanical force ranges seen in real manufacturing environments. This reduces the cost and improves the accuracy and speed of analyzing probe cards and improves diagnosing problems with probe cards.
摘要翻译：探针卡分析仪安装在晶片探针中的探针卡上，并使用晶片探针中的夹具和开关电子元件代替ATE头。测试方法可以确认探针卡在大温度范围内在其规格范围内运行，并且在实际制造环境中可以看到机械力范围。这降低了成本，提高了探针卡分析的准确性和速度，并提高了探针卡诊断的难度。

2. 发明授权

US08531202B2 Probe card test apparatus and method 失效
标题翻译：探针卡测试仪和方法
公开(公告)号：US08531202B2
公开(公告)日：2013-09-10
申请号：US12682391
申请日：2008-10-10
申请人： Sammy Mok , Frank Swiatowiec , Fariborz Agahdel
发明人： Sammy Mok , Frank Swiatowiec , Fariborz Agahdel
IPC分类号： G01R31/26
CPC分类号： G01R31/2889 , G01R35/00
摘要： A probe card analyzer mounts on a probe card in a wafer prober and a use a fixture in the wafer probe and switch electronics in place of an ATE head. Methods of testing can confirm that probe cards are operating within their specifications over large temperature ranges and the mechanical force ranges seen in real manufacturing environments. This reduces the cost and improves the accuracy and speed of analyzing probe cards and improves diagnosing problems with probe cards.
摘要翻译：探针卡分析仪安装在晶片探针中的探针卡上，并使用晶片探针中的夹具和开关电子元件代替ATE头。测试方法可以确认探针卡在大温度范围内在其规格范围内运行，并且在实际制造环境中可以看到机械力范围。这降低了成本，提高了探针卡分析的准确性和速度，并提高了探针卡诊断的难度。

3. 发明申请

US20080061808A1 Compliance partitioning in testing of integrated circuits 失效
标题翻译：集成电路测试中的合规划分
公开(公告)号：US20080061808A1
公开(公告)日：2008-03-13
申请号：US11900795
申请日：2007-09-12
申请人： Sammy Mok , Frank Swiatowiec , Fariborz Agahdel
发明人： Sammy Mok , Frank Swiatowiec , Fariborz Agahdel
IPC分类号： G01R31/26 , B23K31/02 , H05K3/30 , C23C26/00
CPC分类号： C23C26/00 , G01R1/06727 , G01R1/07357 , G01R1/07378 , G01R31/2891 , Y10T29/4913
摘要： Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electronics. The probecards can also use thinner interconnector substrates to conform to the planarity of a DUT and may suspend such a substrate by wires attached to a perimeter edge of the substrate to permit the substrate to tilt. Tilting can also be facilitated by positioning tester-side springs away from the perimeter of the substrate. Low compliance MEMS probes for such architectures can be provided on replaceable coupons having attachment points away from electrical connections, and a method for fabricating probe springs can plate spring material on a membrane deformed by contact with a bumped substrate.
摘要翻译： Probecard架构分割了几个不同组件之间的IC测试所需的弹簧标准。这样的架构可以提供更短的弹簧，更好的阻抗控制，改进的功率/接地分配以及更直接的测试仪器电路。这些问题也可以使用更薄的互连器基板来符合DUT的平面度，并且可以通过连接到基板的周边边缘的线来悬挂这种基板，以允许基板倾斜。也可以通过将测试仪侧弹簧远离基板的周边来进行倾斜。可以在具有远离电气连接的附接点的可更换的试样上提供用于这种结构的低顺应性MEMS探针，并且用于制造探针弹簧的方法可以通过与凸起的基底接触而变形的膜上的弹簧材料。

4. 发明授权

US07876087B2 Probe card repair using coupons with spring contacts and separate atachment points 失效
标题翻译：使用带有弹簧触点和独立突出点的优惠券进行探针卡修复
公开(公告)号：US07876087B2
公开(公告)日：2011-01-25
申请号：US11900795
申请日：2007-09-12
申请人： Sammy Mok , Frank J. Swiatowiec , Fariborz Agahdel
发明人： Sammy Mok , Frank J. Swiatowiec , Fariborz Agahdel
IPC分类号： G01R31/28
CPC分类号： C23C26/00 , G01R1/06727 , G01R1/07357 , G01R1/07378 , G01R31/2891 , Y10T29/4913
摘要： Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electronics. The probecards can also use thinner interconnector substrates to conform to the planarity of a DUT and may suspend such a substrate by wires attached to a perimeter edge of the substrate to permit the substrate to tilt. Tilting can also be facilitated by positioning tester-side springs away from the perimeter of the substrate. Low compliance MEMS probes for such architectures can be provided on replaceable coupons having attachment points away from electrical connections, and a method for fabricating probe springs can plate spring material on a membrane deformed by contact with a bumped substrate.
摘要翻译： Probecard架构分割了几个不同组件之间的IC测试所需的弹簧标准。这样的架构可以提供更短的弹簧，更好的阻抗控制，改进的功率/接地分配以及更直接的测试仪器电路。这些问题也可以使用更薄的互连器基板来符合DUT的平面度，并且可以通过连接到基板的周边边缘的线来悬挂这样的基板，以允许基板倾斜。也可以通过将测试仪侧弹簧远离基板的周边来进行倾斜。可以在具有远离电气连接的附接点的可更换的试样上提供用于这种结构的低顺应性MEMS探针，并且用于制造探针弹簧的方法可以通过与凸起的基底接触而变形的膜上的弹簧材料。

5. 发明申请

US20050275418A1 High density interconnect system having rapid fabrication cycle 失效
标题翻译：具有快速制造周期的高密度互连系统
公开(公告)号：US20050275418A1
公开(公告)日：2005-12-15
申请号：US11133021
申请日：2005-05-18
申请人： Fu Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank Swiatowiec , Zhaohui Shan
发明人： Fu Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank Swiatowiec , Zhaohui Shan
IPC分类号： G01R1/073 , G01R31/02 , G01R31/28 , H05K7/06
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
摘要翻译：描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于主板安装表面和用于调整参考平面相对于晶片的平面度的机构。具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。互连结构和方法优选地提供改进的制造周期。

6. 发明授权

US07137830B2 Miniaturized contact spring 失效
公开(公告)号：US07137830B2
公开(公告)日：2006-11-21
申请号：US10390994
申请日：2003-03-17
申请人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
发明人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： G01R3/00 , B81B3/0072 , B81B2201/018 , G01R1/06761 , H01L21/4853 , H01L23/49811 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/09701 , H01L2924/14 , H01R12/57 , H01R12/718 , H01R13/24 , H01R13/2442 , H05K3/4092 , H05K7/1061
摘要： This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

7. 发明授权

US07126220B2 Miniaturized contact spring 有权
公开(公告)号：US07126220B2
公开(公告)日：2006-10-24
申请号：US10390988
申请日：2003-03-17
申请人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
发明人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： G01R3/00 , B81B3/0072 , B81B2201/018 , G01R1/06761 , H01L21/4853 , H01L23/49811 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/09701 , H01L2924/14 , H01R12/57 , H01R12/718 , H01R13/24 , H01R13/2442 , H05K3/4092 , H05K7/1061
摘要： This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

8. 发明申请

US20090153165A1 High Density Interconnect System Having Rapid Fabrication Cycle 失效
标题翻译：高密度互连系统具有快速制造周期
公开(公告)号：US20090153165A1
公开(公告)日：2009-06-18
申请号：US12354520
申请日：2009-01-15
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/02
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
摘要翻译：描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于主板安装表面和用于调整参考平面相对于晶片的平面度的机构。具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。互连结构和方法优选地提供改进的制造周期。

9. 发明申请

US20090064498A1 Membrane spring fabrication process 审中-公开
标题翻译：膜弹簧制造工艺
公开(公告)号：US20090064498A1
公开(公告)日：2009-03-12
申请号：US12288169
申请日：2008-10-16
申请人： Sammy Mok , Frank J. Swiatowiec
发明人： Sammy Mok , Frank J. Swiatowiec
IPC分类号： G01R3/00
CPC分类号： C23C26/00 , G01R1/0735 , G01R3/00 , H05K3/4092 , Y10T29/49204
摘要： Processes are described for building low compliance MEMS type C-spring probes in a coupon form that can be used as replaceable probes in probe card applications. The coupons have plated spring structures and a plated frame that holds a thin polyimide film in tension. The film keeps the probes and their tips of the top probes aligned to the pads of an IC being tested and the probes and tips of bottom probes aligned to the pads of a probe card high density interconnect that routes to an IC tester.
摘要翻译：描述了用于以优惠券形式构建低顺应性MEMS型C型弹簧探针的方法，可用作探针卡应用中的可替换探针。优惠券具有电镀弹簧结构和电镀框架，其保持薄的聚酰亚胺薄膜处于张力状态。该膜保持探头及其顶部探针的尖端与正在测试的IC的焊盘对齐，并将底部探针的探头和尖端与探针卡的焊盘对准高密度互连，从而路由至IC测试仪。

10. 发明授权

US07138818B2 Massively parallel interface for electronic circuit 失效
公开(公告)号：US07138818B2
公开(公告)日：2006-11-21
申请号：US11327728
申请日：2006-01-05
申请人： Fu Chiung Chong , Sammy Mok
发明人： Fu Chiung Chong , Sammy Mok
IPC分类号： G01R31/02
CPC分类号： G01R31/2863 , G01R1/06722 , G01R1/07342 , G01R3/00 , G01R31/2874 , G01R31/2889
摘要： Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic devices, for interconnecting computers and other peripheral devices within a network, or for interconnecting other electronic circuitry. Preferred embodiments of the massively parallel interface structures provide massively parallel integrated circuit test assemblies. The massively parallel interface structures preferably use one or more substrates to establish connections between one or more integrated circuits on a semiconductor wafer, and one or more test modules. One or more layers on the intermediate substrates preferably include MEMS and/or thin-film fabricated spring probes. The parallel interface assemblies provide tight signal pad pitch and compliance, and preferably enable the parallel testing or burn-in of multiple ICs, using commercial wafer probing equipment. In some preferred embodiments, the parallel interface assembly structures include separable standard electrical connector components, which reduces assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form.

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