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    • 5. 发明授权
    • Bipolar doped semiconductor structure and method for making
    • 双极掺杂半导体结构及其制造方法
    • US5326985A
    • 1994-07-05
    • US951994
    • 1992-09-28
    • Herbert GoronkinJun ShenSaied N. Tehrani
    • Herbert GoronkinJun ShenSaied N. Tehrani
    • H01L29/778H01L29/161H01L29/205
    • H01L29/7783
    • A semiconductor structure that provides both N-type and P-type doping from a single dopant source is provided. A first doping region (13) comprising a first material composition includes holes and electrons in a doping energy level (E.sub.D)- A first undoped spacer region (12) comprising the first material composition covers the doping region (13). An undoped channel (11,14) comprising a second material composition covers the first spacer region (12) and a second undoped spacer region (12) comprising the first material composition covers the undoped channel (11,14). The first material composition has a wider bandgap than the second material composition and the doping energy level (E.sub.D) is selected to provide electrons to the undoped channel (11,14) when the second material composition has a conduction band minimum less than the doping energy level (E.sub.D) and to provide holes to the first undoped channel (11,14) when the second material composition has a valence band maximum greater than the doping energy level (E.sub.D).
    • 提供了从单个掺杂剂源提供N型和P型掺杂的半导体结构。 包括第一材料组合物的第一掺杂区域(13)包括掺杂能级(ED)的空穴和电子 - 包含第一材料组合物的第一未掺杂间隔区域(12)覆盖掺杂区域(13)。 包括第二材料组合物的未掺杂通道(11,14)覆盖第一间隔区域(12),并且包括第一材料组合物的第二未掺杂间隔区域(12)覆盖未掺杂沟道(11,14)。 第一材料组合物具有比第二材料组成更宽的带隙,并且当第二材料组合物具有小于掺杂能量的导带最小值时,选择掺杂能级(ED)以向未掺杂沟道(11,14)提供电子 (ED),并且当第二材料组合物具有大于掺杂能级(ED)的价带最大值时,向第一未掺杂通道(11,14)提供孔。