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1. 发明申请

WO2003021641A3 METHOD AND APPARATUS FOR SENSING A WAFER IN A CARRIER 审中-公开
公开(公告)号：WO2003021641A3
公开(公告)日：2003-03-13
申请号：PCT/US2002/027168
申请日：2002-08-26
申请人： SPEEDFAM-IPEC CORPORATION
发明人： HERB, John, D. , TEENY, Ned, W. , SCHULTZ, Stephen, C.
IPC分类号： H01L21/00
摘要： The invention is a carrier that determines if a wafer has been properly loaded. The carrier includes a body having a cavity covered by a membrane, thereby forming an initial plenum. One or more annular ribs may extend from the body to the membrane to divide the initial plenum into a plurality of plenums. A sensor is positioned within one of the plenums to detect the presence of the wafer. Pump(s) with pressure regulators may be used to pressurize the plenum(s). A first plenum may be pressurized sufficient to hold the wafer to the membrane by creating a partial vacuum between the membrane and the wafer. A second plenum may be pressurized sufficient to urge the membrane away from the sensor if the wafer is not properly loaded in the carrier. If the membrane is near the sensor, the wafer has been properly loaded into the carrier.

2. 发明申请

WO2003021641A2 METHOD AND APPARATUS FOR SENSING A WAFER IN A CARRIER 审中-公开
标题翻译：用于感测载波中的波形的方法和装置
公开(公告)号：WO2003021641A2
公开(公告)日：2003-03-13
申请号：PCT/US2002/027168
申请日：2002-08-26
申请人： SPEEDFAM-IPEC CORPORATION
发明人： HERB, John, D. , TEENY, Ned, W. , SCHULTZ, Stephen, C.
IPC分类号： H01L21/00
CPC分类号： B24B37/30 , B24B37/0053 , B24B49/10 , H01L21/67265 , H01L21/6838
摘要： The invention is a carrier that determines if a wafer has been properly loaded. The carrier includes a body having a cavity covered by a membrane, thereby forming an initial plenum. One or more annular ribs may extend from the body to the membrane to divide the initial plenum into a plurality of plenums. A sensor is positioned within one of the plenums to detect the presence of the wafer. Pump(s) with pressure regulators may be used to pressurize the plenum(s). A first plenum may be pressurized sufficient to hold the wafer to the membrane by creating a partial vacuum between the membrane and the wafer. A second plenum may be pressurized sufficient to urge the membrane away from the sensor if the wafer is not properly loaded in the carrier. If the membrane is near the sensor, the wafer has been properly loaded into the carrier.
摘要翻译：本发明是确定晶片是否已被正确加载的载体。载体包括具有被膜覆盖的空腔的主体，从而形成初始增压室。一个或多个环形肋可以从主体延伸到膜以将初始增压室分成多个增压室。传感器位于一个通风室内以检测晶片的存在。带压力调节器的泵可以用于对集气室加压。可以通过在膜和晶片之间产生部分真空来将第一增压室加压以将晶片保持在膜上。如果晶片没有被适当地装载在载体中，则第二增压室可被加压以足以将膜推离传感器。如果膜靠近传感器，则晶片已经被适当地加载到载体中。

3. 发明申请

WO2002002273A3 CARRIER HEAD WITH REDUCED MOMENT WEAR RING 审中-公开
公开(公告)号：WO2002002273A3
公开(公告)日：2002-01-10
申请号：PCT/US2001/020530
申请日：2001-06-27
申请人： SPEEDFAM-IPEC CORPORATION
发明人： SCHULTZ, Stephen, C. , HERB, John, D. , DYER, Timothy, S.
IPC分类号： B24B37/04
摘要： A work piece carrier head (20) for a CMP or other polishing apparatus is configured to eliminate the slow band associated with the polishing of the surface of a work piece (30). The carrier head (20) includes a wear ring (28) that is positioned circumferentially about the work piece (30) and that together with the work piece (30) is pressed against a moving polishing pad (40). The wear ring (28) is resiliently coupled (32) to the body (22) of the carrier head (20) in a manner to avoid any overturning moment on the ring (28) caused by the frictional force of the polishing pad (40) against the wear ring (28).

4. 发明申请

WO2003020471A1 LAMINATED WEAR RING 审中-公开
标题翻译：层压磨边
公开(公告)号：WO2003020471A1
公开(公告)日：2003-03-13
申请号：PCT/US2002/027170
申请日：2002-08-26
申请人： SPEEDFAM-IPEC CORPORATION
发明人： MARQUARDT, David , LOUGHER, Wayne , SCHULTZ, Stephen, C.
IPC分类号： B24B37/04
CPC分类号： B24B37/30 , B24B37/32
摘要： A laminated wear ring (128) for a chemical mechanical planarization (CMP) apparatus provides improved control of the removal rate of material from the edge of a wafer during a polishing/planarization operation. The laminated wear ring (128) includes a high stiffness stainless steel base (130) and a plastic laminate (146). The high stiffness stainless steel base (130) avoids flexing of the wear ring (128) during polishing and thus provides control of the flexing of a polish pad against which the wafer surface is pressed. The plastic laminate protects the stainless steel base (130) from attack by the polishing slurry and provides a buffer that protects the stainless steel base (130) from mechanically damaging the wafer and vice versa.
摘要翻译：用于化学机械平面化（CMP）装置的层压耐磨环（128）提供了在抛光/平坦化操作期间对晶片边缘的材料的去除速率的改进的控制。层压耐磨环（128）包括高刚性不锈钢基座（130）和塑料层压板（146）。高刚度不锈钢基座（130）避免了抛光过程中磨损环（128）的弯曲，从而提供了对晶片表面进行加压的抛光垫的弯曲的控制。塑料层压板保护不锈钢底座130免受抛光浆料的侵蚀，并提供缓冲器，保护不锈钢基座（130）免受机械损坏晶片，反之亦然。

5. 发明公开

EP1121222A1 OSCILLATING ORBITAL POLISHER AND METHOD 审中-公开
标题翻译： OSTOITAL振荡抛光机和方法及其使用
公开(公告)号：EP1121222A1
公开(公告)日：2001-08-08
申请号：EP99948290.4
申请日：1999-09-16
申请人： SpeedFam-Ipec Corporation
发明人： ADAMS, John, A. , SMITH, Everett, D. , SCHULTZ, Stephen, C.
IPC分类号： B24B1/00 , H01L21/302
CPC分类号： B24B37/042 , B24B23/03 , Y10S977/888
摘要： A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate (152) by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate (152) is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillation, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads (160) to provide more uniform conditioning and to extend their useful life span.

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