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1. 发明申请

WO2002084714A3 METHOD AND APPARATUS FOR ELECTROCHEMICALLY DEPOSITING A MATERIAL ONTO A WORKPIECE SURFACE 审中-公开
公开(公告)号：WO2002084714A3
公开(公告)日：2002-10-24
申请号：PCT/US2002/011428
申请日：2002-04-10
申请人： SPEEDFAM-IPEC CORPORATION
发明人： EMESH, Ismail , CHADDA, Saket , KOROVIN, Nikolay, N. , MUELLER, Brian, L.
IPC分类号： C25D7/12
摘要： An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

2. 发明申请

WO2002064314A1 METHOD AND APPARATUS FOR ELECTROCHEMICAL PLANARIZATION OF A WORKPIECE 审中-公开
标题翻译：工业电化学平面化方法与装置
公开(公告)号：WO2002064314A1
公开(公告)日：2002-08-22
申请号：PCT/US2002/004141
申请日：2002-02-12
申请人： SPEEDFAM-IPEC CORPORATION
发明人： EMESH, Ismail , CHADDA, Saket , KOROVIN, Nikolay, N. , MUELLER, Brian, L.
IPC分类号： B24B37/04
CPC分类号： B24B37/20 , B23H5/08 , B24B37/12 , C25F3/02 , C25F7/00 , H01L21/32125 , H01L21/7684
摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad (40) and a platen (50). The platen (50) is formed of conductive material, is disposed proximate to the polishing pad (40) and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor (70) is positioned within the platen (50). The electrical conductor (70) has a first end connected to a power source (90). A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad (40). The power source (90) applies a positive charge to the workpiece via the electrical conductor (70) so that an electric potential difference between the metallized surface of the workpiece and the platen (50) is created to remove at least a portion of the metallized surface from the workpiece.
摘要翻译：用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫（40）和压板（50）。压板（50）由导电材料形成，靠近抛光垫（40）设置，并且被构造成在平坦化处理的至少一部分期间具有负电荷。至少一个电导体（70）位于压板（50）内。电导体（70）具有连接到电源（90）的第一端。工件载体构造成承载工件并将工件压靠在抛光垫（40）上。电源（90）经由电导体（70）向工件施加正电荷，使得在工件的金属化表面和压板（50）之间产生电位差，以去除金属化的至少一部分工件表面。

3. 发明申请

WO2002084714A2 METHOD AND APPARATUS FOR ELECTROCHEMICALLY DEPOSITING A MATERIAL ONTO A WORKPIECE SURFACE 审中-公开
标题翻译：将材料电沉积到工件表面上的方法和装置
公开(公告)号：WO2002084714A2
公开(公告)日：2002-10-24
申请号：PCT/US2002/011428
申请日：2002-04-10
申请人： SPEEDFAM-IPEC CORPORATION
发明人： EMESH, Ismail , CHADDA, Saket , KOROVIN, Nikolay, N. , MUELLER, Brian, L.
IPC分类号： H01L21/00
CPC分类号： C25D17/001 , B23H5/08 , C25D5/06 , C25D5/22 , C25D17/14 , H01L21/2885 , H01L21/67167 , H01L21/67219 , H01L21/6723
摘要： An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.
摘要翻译：公开了一种用于将材料沉积在工件的表面上并用于抛光材料的电化学沉积设备和方法。该设备包括压板和抛光表面，其包括邻近压板设置的导电材料和嵌入其中的导体。在材料沉积期间，跨导体和压板施加偏压以使材料沉积到工件表面上。

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