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1. 发明专利

DE69112693T2 未知
公开(公告)号：DE69112693T2
公开(公告)日：1996-02-01
申请号：DE69112693
申请日：1991-04-24
申请人： SONY CORP
发明人： ASAMI YUKIO , FUKAZAWA HIROYUKI , KOJIMA AKIRA
IPC分类号： B29C45/14 , H01L21/56 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50
摘要： A semiconductor device is fabricated by placing a semiconductor chip (7) in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers (3). Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mould surrounding the chip. Furthermore, the mould has horizontal movement restricting projections (12) to limit vertical movement of the chip within the mould cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.

2. 发明专利

DE69112693D1 未知
公开(公告)号：DE69112693D1
公开(公告)日：1995-10-12
申请号：DE69112693
申请日：1991-04-24
申请人： SONY CORP
发明人： ASAMI YUKIO , FUKAZAWA HIROYUKI , KOJIMA AKIRA
IPC分类号： B29C45/14 , H01L21/56 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50
摘要： A semiconductor device is fabricated by placing a semiconductor chip (7) in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers (3). Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mould surrounding the chip. Furthermore, the mould has horizontal movement restricting projections (12) to limit vertical movement of the chip within the mould cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.

3. 发明专利

JP2003017657A Connecting component and semiconductor device having it and method for manufacturing connecting component 审中-公开
标题翻译：连接组件和具有其制造连接组件的方法的半导体器件
公开(公告)号：JP2003017657A
公开(公告)日：2003-01-17
申请号：JP2001203669
申请日：2001-07-04
申请人： Sony Corp , ソニー株式会社
发明人： FUKAZAWA HIROYUKI
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
CPC分类号： H01L2224/16145 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a connecting component, a semiconductor device having it, and a method for manufacturing the connecting component wherein the connecting component enables easy manufacture of the whole device and does not make the whole device larger.
SOLUTION: The connecting component is provided with electrically conductive parts for electrically connecting electronic components with each other and an insulating part for preventing a short circuit, and the connecting component 100 is constituted such that the insulating part 140 is disposed adjacent to the conductive parts 110, 120 and 130. This insulating part has a part facing the electronic component 400 formed in nearly the same shape as the external shape of the electronic component.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供连接部件，具有该连接部件的半导体器件以及连接部件的制造方法，其中连接部件能够容易地制造整个器件，并且不会使整个器件更大。解决方案：连接部件设置有用于将电子部件彼此电连接的导电部件和用于防止短路的绝缘部件，并且连接部件100构成为使得绝缘部件140邻近导电部件110设置，120和130.该绝缘部件具有面向电子部件400的部分，其形成为与电子部件的外部形状几乎相同的形状。

4. 发明专利

JP2002203939A INTEGRATED ELECTRONIC COMPONENT AND ITS INTEGRATING METHOD 失效
公开(公告)号：JP2002203939A
公开(公告)日：2002-07-19
申请号：JP2000398715
申请日：2000-12-27
申请人： SONY CORP
发明人： MATSUZAKI YUKO , FUKAZAWA HIROYUKI
IPC分类号： H01L25/18 , H01L23/12 , H01L25/065 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To obtain a three-dimensional integrated electronic component that can laminate a plurality of semiconductor devices without requiring an outer lead, an electrode pad on a wiring board, a process for complicated alignment, and a special bonding tool, and to provide a method for laminating the three- dimensional integrated electronic component. SOLUTION: In this integrated electronic component 10, the semiconductor device 12 is die-bonded onto the wiring board 11, wire bonding is carried out for forming a first stage (the lowest stage) for applying a sheet 15 containing spherical filler, a second semiconductor device 12b at the second stage is die- bonded onto the sheet, and wire bonding is performed to the semiconductor device 12 for forming. To form the integrated electronic component 10, above processes are repeated for a required number of times.

5. 发明专利

JPH08181411A OUTER SHAPE PROCESSING METHOD OF PRINTED WIRING BOARD 失效
公开(公告)号：JPH08181411A
公开(公告)日：1996-07-12
申请号：JP31983594
申请日：1994-12-22
申请人： SONY CORP
发明人： FUKAZAWA HIROYUKI
IPC分类号： B27C5/00 , H05K3/00
摘要： PURPOSE: To provide an outer shape processing method of a printed wiring board which enables proper outer shape processing without leaving a broken place inside an effective region of a substrate. CONSTITUTION: In the title outer shape processing method of a printed wiring board for outer shape processing of a substrate with an effective region 2 wherein a wiring pattern is formed and an invalid region 3 in a periphery thereof, a cutting blade part of a machining tool is first inserted into the invalid region 3 apart by a specified distance D from the effective region 2 of the substrate 1 and then outer shape processing is performed for a substrate according to a prescribed boundary line L while a relative position of the machining tool and the substrate 1 is changed.

6. 发明专利

JPH06216172A MANUFACTURE FOR RESIN-SEALED ELECTRONIC ELEMENT AND DRYER USED THEREFOR 失效
公开(公告)号：JPH06216172A
公开(公告)日：1994-08-05
申请号：JP29574093
申请日：1993-11-25
申请人： SONY CORP
发明人： TERASAKI TATSU , FUKAZAWA HIROYUKI
IPC分类号： H01L21/56
摘要： PURPOSE:To provide a manufacturing method of a resin sealed electronic element in an excellent working environment and a drier by the constitution, wherein bubbles do not remain in a resin package, the appearance of the package is fine and exellent, the reliability as the package can be improved, the requirement for transfer of sealing material to another container when the unhardened sealing material is dried is not necessary, and drying work is very easy. CONSTITUTION:Sealing material (tablet) 30 used for resin sealing is dried with dry gas or drying agent. Thereafter, resin sealing for an electronic element is performed by using the sealing material 30. When the dry gas is sent through and the drying is performed, the sealing material is contained in a packing material 84 and sealed. The packing material 84 is mounted on a hollow needle 80, which is connected to a dry-air introducing pipe 82. The packing material is pierced with the hollow needle by own weight. A gas discharging port 86 is provided at the upper part of the packing material at the same time or before or after the piercing action. The dry gas is introduced into the inside of the packing material through the hollow needle.

7. 发明专利

JPH0629340A DIE FOR FORMING RESIN-SEALED SEMICONDUCTOR DEVICE AND RESIN-SEAL OF SEMICONDUCTOR CHIP USED THEREFOR 失效
公开(公告)号：JPH0629340A
公开(公告)日：1994-02-04
申请号：JP18485492
申请日：1992-07-13
申请人： SONY CORP
发明人： KIHIRA TORU , FUKAZAWA HIROYUKI
IPC分类号： H01L21/56 , H01L23/28
摘要： PURPOSE:To provide a forming die which prevents the occurrence of voids or non-fillings in a package sealed in resin, and a forming method which employs the die. CONSTITUTION:A forming die M is made up of an upper die 5 and a lower die 6, and the ends of a number of movable pins 9 are flatly formed so as to be flush with inner surfaces 5a and 6a of cavities 5A and 6A of the upper and lower dies. These pins are respectively disposed on the upper and lower dies in such a way as to be vertically movable relative to the inner surface. While an IC chip 1 mounted on a leadframe is fastened at a predetermined location within the cavities 5A and 6A by means of the die M, the movement of the IC chip 1 is regulated by drawing each movable pin 9. In this state, the cavity of the die is filled with molten sealing resin. By the end of the filling, the movable pins 9 are retracted to the position where the flat ends of the pins become flush with the inner surfaces 5a and 6a of the cavities 5A and 6A, and sealing resin is then made set.

8. 发明专利

JPH05315520A SURFACE MOUNT TYPE SEMICONDUCTOR DEVICE AND BENDING METHOD FOR OUTER LEAD THEREOF 失效
公开(公告)号：JPH05315520A
公开(公告)日：1993-11-26
申请号：JP11760092
申请日：1992-05-11
申请人： SONY CORP
发明人： FUKAZAWA HIROYUKI , SATO KAZUHIRO
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50 , H05K3/34
摘要： PURPOSE:To absorb the retrogressive component in the elastic region of an outer lead when a bending process is conducted by a method wherein the outer lead is bent without coming into contact with a sealing member. CONSTITUTION:First, an outer lead 4 is bent to the side of the backside 13 of a sealing member 7 in such a manner that the outer lead is not brought into contact with the sealing material 7 at the base part of the outer lead 4 which is led out from the sealing material 7. The first electrode 8a is formed in the middle part of the outer lead 4. Then, the tip part of the outer lead 4 is bent to the opposite direction, namely, bent toward the sealing material 7, and an outer electrode part 8b is formed by the free end of the outer lead 4. Accordingly, the retrogressive component, in the elastic region provided on the outer lead, generated when the bending work is conducted can be absorbed, and a high degree of bending technique is unnecessitated.

9. 发明专利

JPH0547978A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0547978A
公开(公告)日：1993-02-26
申请号：JP18509391
申请日：1991-07-25
申请人： SONY CORP
发明人： FUKAZAWA HIROYUKI , MAKINO HARUHIKO
IPC分类号： H01L23/28 , H01L21/56 , H01L23/495 , H01L23/50
摘要： PURPOSE:To prevent the generation of voids which is generated when a semiconductor element is sealed with a molding resin. CONSTITUTION:In a semiconductor device wherein a semiconductor element 7 is mounted on a lead frame 100 consisting of a die pad 102 and a plurality of inner lead parts 3 and is sealed with a molding resin M, the interval between the outer peripheral edge parts of the die pad 102 and each internal tip 8 of the lead parts 3 is made narrow in such a way that the rate of the flow of the resin M, which flows on the upper surface of the element 7 and/or the lower surface of the die pad, becomes roughly equal with the rate of the flow of the resin M, which flows on the periphery of the element 7. The device is constituted so as to give a resistance to the flow of the resin M to flow on these parts. Accordingly, the flow of the resin M becomes uniform, the generation of a void can be reduced or eliminated and the reliability and productivity of the device are improved.

10. 发明专利

JPH04206855A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04206855A
公开(公告)日：1992-07-28
申请号：JP33833890
申请日：1990-11-30
申请人： SONY CORP
发明人： ASAMI YUKIO , FUKAZAWA HIROYUKI , OIDE TOMOSHI , KOJIMA AKIRA
IPC分类号： H01L23/28
摘要： PURPOSE:To notably enhance the bond properties of a semiconductor chip onto a mold resin for avoiding the cracking in a package by removing the organic pollutants at least on the surface of the semiconductor chip. CONSTITUTION:In order to remove pollutants 8, the oxygen in dry air (or air) is turned into ozone in high energetic state by ultraviolet ray (a) excitation so as to decompose and remove the organic pollutants 8 by the ozone radicals. At this time, numerous OH radicals are formed on the surface of a semiconductor chip 5 to be turned in hydrophilic state having no organic pollutants at all so that the O-H coupling of OH radicals on the semiconductor chip surface (a) with the organic matters comprising a mold resin 11 may be facilitated to make the semiconductor chip 5 firmly bond onto the mold resin 11.

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