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1. 发明申请

WO2008005871A3 ZONE CONTROL HEATER PLATE FOR TRACK LITHOGRAPHY SYSTEMS 审中-公开
公开(公告)号：WO2008005871A3
公开(公告)日：2008-01-10
申请号：PCT/US2007/072543
申请日：2007-06-29
申请人： SOKUDO CO., LTD. , SALINAS, Martin Jeff , QUACH, David H.
发明人： SALINAS, Martin Jeff , QUACH, David H.
IPC分类号： H05B3/02
摘要： A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned signal layer, adapted to facilitate electrical connections to the plurality of wires.

2. 发明申请

WO2013162838A1 METHODS AND APPARATUS FOR CONTROLLING SUBSTRATE UNIFORMITY 审中-公开
标题翻译：用于控制基板均匀性的方法和装置
公开(公告)号：WO2013162838A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/035006
申请日：2013-04-02
申请人： APPLIED MATERIALS, INC. , SADJADI, S.M. Reza , LUBOMIRSKY, Dmitry , NOORBAKHSH, Hamid , YE, Zheng John , QUACH, David H. , KANG, Sean S.
发明人： SADJADI, S.M. Reza , LUBOMIRSKY, Dmitry , NOORBAKHSH, Hamid , YE, Zheng John , QUACH, David H. , KANG, Sean S.
IPC分类号： H01L21/205
CPC分类号： H01L22/20 , C23C14/22 , C23C16/44 , H01J37/32082 , H01J37/32467 , H01J37/32522 , H01J37/32541 , H01J37/32605 , H01J37/32642 , H01J37/32697 , H01J2237/334 , H01L21/02104 , H01L21/02274 , H01L21/3065 , H01L21/67069 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H01L21/68735
摘要： A dynamically tunable process kit, a processing chamber having a dynamically tunable process kit, and a method for processing a substrate using a dynamically tunable process kit are provided. The dynamically tunable process kit allows one or both of the electrical and thermal state of the process kit to be changed without changing the phyisical construction of the process kit, thereby allowing plasma properties, and hence processing results, to be easily changed without replacing the process kit. The processing chamber having a dynamically tunable process kit includes a chamber body that includes a portion of a conductive side wall configured to be electrically controlled, and a process kit. The processing chamber includes a first control system operable to control one or both of an electrical and thermal state of the process kit and a second control system operable to control an electrical state of the portion of the side wall.
摘要翻译：提供了一种动态可调工艺套件，具有动态可调工艺套件的处理室以及使用动态可调工艺套件处理衬底的方法。动态可调工艺套件允许改变工艺套件的电气和热状态，而不改变工艺套件的植物结构，从而允许容易地改变等离子体性能，因此处理结果而不需要更换过程套件。具有可动态调节的处理套件的处理室包括腔室主体，其包括被配置为电控制的导电侧壁的一部分，以及处理套件。处理室包括可操作以控制处理套件的电气和热状态中的一个或两个的第一控制系统和可操作以控制侧壁部分的电气状态的第二控制系统。

3. 发明申请

WO2012125771A2 SUBSTRATE SUPPORT ASSEMBLY FOR THIN FILM DEPOSITION SYSTEMS 审中-公开
标题翻译：用于薄膜沉积系统的基底支撑组件
公开(公告)号：WO2012125771A2
公开(公告)日：2012-09-20
申请号：PCT/US2012/029134
申请日：2012-03-14
申请人： APPLIED MATERIALS, INC. , NGUYEN, Tuan Anh , OLGADO, Donald J.K. , QUACH, David H.
发明人： NGUYEN, Tuan Anh , OLGADO, Donald J.K. , QUACH, David H.
IPC分类号： H01L21/683 , H01L21/205 , C23C16/458
CPC分类号： C30B25/12 , C23C16/4583
摘要： Substrate support assemblies and deposition chambers employing such support assemblies to improve temperature uniformity during film depositions, such as epitaxial growths of group-V material stacks for LEDs. In one embodiment, the support assembly includes a first component having a first thermal resistance and a top surface upon which the substrate is to be disposed at a first location. The support assembly further includes a second component to be disposed over the first component to cover a second location of the susceptor while the substrate is disposed over the first location and having a second thermal resistance to insulate regions of the susceptor adjacent to the substrate by an amount approximating that of the substrate during a deposition process. In embodiments, the second component is removable from the first component and supports the substrate in absence of the first component during transfer of the substrate between multiple deposition systems.
摘要翻译：采用这种支撑组件的衬底支撑组件和沉积室在薄膜沉积期间改善温度均匀性，例如用于LED的V族材料堆叠的外延生长。在一个实施例中，支撑组件包括具有第一热阻的第一部件和衬底将布置在第一位置处的顶表面。所述支撑组件还包括第二部件，所述第二部件设置在所述第一部件上方以覆盖所述基座的第二位置，同时所述基板设置在所述第一位置上方并且具有第二热阻以使所述基座的邻近所述基板的区域通过量在沉积过程中接近基板的量。在实施例中，第二部件可从第一部件移除并且在多个沉积系统之间的衬底转移期间在没有第一部件的情况下支撑衬底。

4. 发明申请

WO2011159615A2 METHOD AND APPARATUS FOR INDUCING TURBULENT FLOW OF A PROCESSING CHAMBER CLEANING GAS 审中-公开
标题翻译：用于诱导加工室清洁气体的涡流的方法和装置
公开(公告)号：WO2011159615A2
公开(公告)日：2011-12-22
申请号：PCT/US2011/040197
申请日：2011-06-13
申请人： APPLIED MATERIALS, INC. , CHUNG, Hua , DONG, Xizi , MAUNG, Kyawwin , HANAWA, Hiroji , KANG, Sang Won , QUACH, David H. , OLGADO, Donald J.K. , BOUR, David , HSU, Wei-Yung , TAM, Alexander , CHANG, Anzhong , ACHARYA, Sumedh
发明人： CHUNG, Hua , DONG, Xizi , MAUNG, Kyawwin , HANAWA, Hiroji , KANG, Sang Won , QUACH, David H. , OLGADO, Donald J.K. , BOUR, David , HSU, Wei-Yung , TAM, Alexander , CHANG, Anzhong , ACHARYA, Sumedh
IPC分类号： H01L21/205 , H01L21/302
CPC分类号： B08B5/00 , C23C16/4405 , C23C16/45506 , C23C16/45591 , H01L21/02041 , H01L21/67115 , Y10S438/905
摘要： Embodiments of the invention generally relate to apparatus and methods for cleaning chamber components using a cleaning plate. The cleaning plate is adapted to be positioned on a substrate support during a cleaning process, and includes a plurality of turbulence-inducing structures. The turbulence-inducing structures induce a turbulent flow of cleaning gas while the cleaning plate is rotated during a cleaning process. The cleaning plate increases the retention time of the cleaning gas near the showerhead during cleaning. Additionally, the cleaning plate reduces concentration gradients within the cleaning plate to provide a more effective clean. The method includes positioning a cleaning plate adjacent to a showerhead, and introducing cleaning gas to the space between the showerhead and the cleaning plate. A material deposited on the surface of the showerhead is then heated and vaporized in the presence of the cleaning gas, and then exhausted from the processing chamber.
摘要翻译：本发明的实施例一般涉及使用清洁板清洁腔室部件的装置和方法。清洁板适于在清洁过程期间定位在基板支撑件上，并且包括多个湍流诱导结构。湍流诱导结构在清洁过程中清洁板旋转时引起清洁气体的湍流。在清洁过程中，清洁板增加了喷头附近清洁气体的停留时间。此外，清洁板减少清洁板内的浓度梯度以提供更有效的清洁。该方法包括将清洁板定位在与喷头相邻的位置，并将清洁气体引入到喷头和清洁板之间的空间。然后将沉积在喷头表面上的材料在清洁气体的存在下加热和蒸发，然后从处理室中排出。

5. 发明申请

WO2011037647A1 AUTOMATIC SUBSTRATE LOADING STATION 审中-公开
标题翻译：自动基座装载站
公开(公告)号：WO2011037647A1
公开(公告)日：2011-03-31
申请号：PCT/US2010/027938
申请日：2010-03-19
申请人： APPLIED MATERIALS, INC. , QUACH, David H. , ISHIKAWA, Tetsuya
发明人： QUACH, David H. , ISHIKAWA, Tetsuya
IPC分类号： H01L21/677 , H01L21/68 , B65G49/07
CPC分类号： C23C16/54 , H01L21/67161 , H01L21/67201 , H01L21/67207 , H01L21/67259 , H01L21/67748 , H01L21/67751 , H01L21/68 , H01L21/68764 , H01L21/68771
摘要： Embodiments of the present invention provide method and apparatus for automatically loading substrates to a substrate carrier tray. On embodiment of the present invention provides an automatic substrate loader comprises a cassette handling mechanism, a substrate aligner configured to align a substrate, and a carrier tray aligner. The automatic substrate loader further comprises a first robot configured to transfer substrates between the substrate aligner and the substrate storage cassettes, and a second robot configured to transfer substrates between the substrate aligner and the carrier tray disposed on the carrier tray aligner.
摘要翻译：本发明的实施例提供了用于将衬底自动加载到衬底托盘的方法和装置。在本发明的实施例中，提供一种自动基板装载器，其包括盒式处理机构，被配置为对准基板的基板对准器和载体盘对准器。自动基板装载器还包括第一机器人，其被配置为在基板对准器和基板存储盒之间传送基板，以及第二机器人，其被配置为在基板对准器和设置在托盘调准器上的托盘之间传送基板。

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