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1. 发明申请

WO2011043566A3 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE 审中-公开
标题翻译：装置和处理基板的方法
公开(公告)号：WO2011043566A3
公开(公告)日：2011-11-03
申请号：PCT/KR2010006749
申请日：2010-10-04
申请人： SNU PRECISION CO LTD , BAK BYEONG-MIN , GONG DOO WON , SON SUNG KWAN , CHO WHANG SIN , JUNG SUNG JAE , PAHK HEUI JAE
发明人： BAK BYEONG-MIN , GONG DOO WON , SON SUNG KWAN , CHO WHANG SIN , JUNG SUNG JAE , PAHK HEUI JAE
IPC分类号： H01L21/20 , H01L31/042
CPC分类号： H01L21/6776 , C23C16/4401 , C23C16/4411 , C23C16/45563 , C23C16/4557 , C23C16/54 , H01L21/6715
摘要： There is provided a substrate processing apparatus and method capable of preventing the substrate from being heated and efficiently collecting residual deposition material. The substrate processing apparatus includes a chamber unit including an inner space divided into an introduction section, a film formation section, and a discharge section, at least one material injection nozzle unit disposed in the film formation section of the chamber unit to inject a deposition material to a substrate being transferred, and a cooling plate unit disposed to surround the film formation section of the chamber unit and adapted to cool inside of the film formation section. In addition, the substrate processing apparatus further includes at least one cold trap unit disposed at a lower part of the material injection nozzle unit to collect residual deposition material not deposited on the substrate but left from the whole deposition material injected from the material injection nozzle unit.
摘要翻译：提供了能够防止基板被加热并有效地收集残留沉积材料的基板处理装置和方法。基板处理装置包括：室单元，包括分为导入部，成膜部和排出部的内部空间;至少一个注入喷嘴单元，设置在室单元的成膜部中，以将沉积材料到被转印的基板，以及冷却板单元，设置成围绕室单元的成膜部分并且适于在成膜部分内部冷却。此外，基板处理装置还包括至少一个冷阱单元，其设置在材料注入喷嘴单元的下部，以收集未沉积在基板上但留在从材料注入喷嘴单元注入的整个沉积材料的残留沉积材料。

2. 发明申请

WO2010082755A3 EVAPORATION APPARATUS, THIN FILM DEPOSITING APPARATUS AND METHOD FOR FEEDING SOURCE MATERIAL OF THE SAME 审中-公开
标题翻译：蒸发装置，薄膜沉积装置和用于输送相同来源材料的方法
公开(公告)号：WO2010082755A3
公开(公告)日：2010-10-14
申请号：PCT/KR2010000203
申请日：2010-01-13
申请人： SNU PRECISION CO LTD , YOON HYUNG SEOK , SON SUNG KWAN , KANG CHANG HO , KWON HYUN GOO
发明人： YOON HYUNG SEOK , SON SUNG KWAN , KANG CHANG HO , KWON HYUN GOO
IPC分类号： H01L21/203
CPC分类号： C23C14/044 , C23C14/24 , C23C14/246
摘要： Provided are an evaporation apparatus and a thin film depositing apparatus, and a source material filling method thereof. The thin film depositing apparatus includes a chamber having an inner space, a substrate transferring member to fix a substrate and move the substrate within the inner space, and a plurality of evaporation members to supply a deposition source material to the substrate, wherein each of the evaporation members is disposed to allow its central extension line to form an acute angle with a surface of the substrate that moves. Therefore, it is possible to form a thin film on the substrate by supplying the vaporized source material to the substrate in a sloped direction with respect to the substrate through the use of the plurality of evaporation members, and to fill the source material by selectively control only an evaporation member where the source material is exhausted without shutting down the whole apparatus.
摘要翻译：本发明提供一种蒸镀装置及薄膜蒸镀装置及其原料填充方法。薄膜沉积装置包括具有内部空间的腔室，用于固定基板并在内部空间内移动基板的基板传递构件，以及用于向基板供应沉积源材料的多个蒸发构件，其中，每个设置蒸发构件以允许其中心延伸线与移动的基底的表面形成锐角。因此，可以通过使用多个蒸发部件将蒸发的源材料相对于基板以倾斜方向供应到基板，并且通过选择性地控制填充源材料来在基板上形成薄膜只有在没有关闭整个设备的情况下排放源材料的蒸发部件。

3. 发明申请

WO2010056057A3 DEPOSITION MATERIAL SUPPLY APPARATUS AND SUBSTRATE TREATMENT APPARATUS HAVING THE SAME 审中-公开
标题翻译：沉积物料供应装置及其基材处理装置
公开(公告)号：WO2010056057A3
公开(公告)日：2010-07-08
申请号：PCT/KR2009006671
申请日：2009-11-13
申请人： SNU PRECISION CO LTD , YOON HYUNG SEOK , CHOI SANG HWA , SON SUNG KWAN , KANG CHANG HO , KWON HYUN GOO , NAMGOONG SUNG TAE , HAN KYUNG ROK
发明人： YOON HYUNG SEOK , CHOI SANG HWA , SON SUNG KWAN , KANG CHANG HO , KWON HYUN GOO , NAMGOONG SUNG TAE , HAN KYUNG ROK
IPC分类号： C23C14/24 , H05B33/10
CPC分类号： C23C14/243 , C23C14/12 , C23C14/544
摘要： Provided are a deposition material supplying device and a substrate processing apparatus including the deposition material supplying device, which store a large amount of organic material without deteriorating the organic material and vaporize a desired amount of the organic material to a substrate. The deposition material supplying device includes: a pot in which a storage space filled with raw material communicates with a vaporization space where the raw material is vaporized; a transporting unit configured to continuously or periodically transport the raw material filling the storage space to the vaporization space; a heating unit disposed on an outside of the vaporization space of the pot to supply heat vaporizing the raw material; and a cooling unit disposed on an outside of the storage space to prevent the raw material stored in the storage space from being thermally deteriorated.
摘要翻译：提供了一种沉积材料供给装置和包括沉积材料供给装置的基板处理装置，其存储大量的有机材料而不使有机材料恶化并将所需量的有机材料蒸发到基板。沉积材料供给装置包括：容纳有原料的储存空间与原料蒸发的蒸发空间连通的罐; 传送单元，被配置为将填充所述存储空间的原料连续地或周期地运送到所述蒸发空间; 加热单元，设置在所述锅的蒸发空间的外侧，以供应蒸发所述原料的热量; 以及设置在所述存储空间的外侧的冷却单元，以防止存储在所述存储空间中的原料热劣化。

4. 发明申请

WO2010027178A2 DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME 审中-公开
标题翻译：沉积装置和使用该沉积方法的沉积方法
公开(公告)号：WO2010027178A2
公开(公告)日：2010-03-11
申请号：PCT/KR2009004906
申请日：2009-09-01
申请人： SNU PRECISION CO LTD , KANG CHANG HO , KWON HYUN GOO , NAMGOONG SUNG TAE , SON SUNG KWAN
发明人： KANG CHANG HO , KWON HYUN GOO , NAMGOONG SUNG TAE , SON SUNG KWAN
IPC分类号： H01L21/203
CPC分类号： C23C14/547 , C23C14/042 , C23C14/12 , C23C14/568
摘要： A transmission chamber connected to the processing chamber, a substrate seating part located in the processing chamber to seat a substrate, a deposition source facing the substrate seating part and storing a source material, and a thickness measuring part installed in the transmission chamber to directly measure a practical thickness of a deposition layer formed on the substrate. It is possible to directly measure and monitor the practical thickness of the deposition layer using the deposition apparatus employing the thickness measuring part. Thus, a thickness of the deposition layer can be exactly controlled by monitoring the practical thickness of the deposition layer in real time and correcting the deposition control thickness used to control the practical thickness of the deposition layer, so that the reliability and the yield rate of a device fabricated on the substrate can be improved.
摘要翻译：连接到处理室的传输室，位于处理室中的基板安置部分，用于安置基板，面向基板安置部分并存储源材料的沉积源，以及安装在传送室中的厚度测量部分，以直接测量形成在基板上的沉积层的实际厚度。可以使用采用厚度测量部件的沉积设备直接测量和监测沉积层的实际厚度。因此，可以通过实时监控沉积层的实际厚度和校正用于控制沉积层的实际厚度的沉积控制厚度来精确地控制沉积层的厚度，从而可靠性和屈服率可以改善在基板上制造的器件。

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