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1. 发明公开

US20230343663A1 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20230343663A1
公开(公告)日：2023-10-26
申请号：US18214969
申请日：2023-06-27
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Ho-Chuan Lin , Min-Han Chuang , Chia-Chu Lai
IPC分类号： H01L23/31 , H01L21/56 , H01L23/528 , H01L23/00
CPC分类号： H01L23/3107 , H01L21/56 , H01L23/5286 , H01L24/11 , H01L24/14 , H01L24/43 , H01L24/45
摘要： An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

2. 发明公开

US20230386992A1 ELECTRONIC MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC PACKAGE HAVING THE SAME 审中-公开
公开(公告)号：US20230386992A1
公开(公告)日：2023-11-30
申请号：US18234695
申请日：2023-08-16
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Ho-Chuan Lin , Chia-Chu Lai , Min-Han Chuang
IPC分类号： H01L23/522 , H01L23/31
CPC分类号： H01L23/5223 , H01L28/40 , H01L23/31 , H01L23/5226
摘要： An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

3. 发明公开

US20230343665A1 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20230343665A1
公开(公告)日：2023-10-26
申请号：US18215113
申请日：2023-06-27
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Ho-Chuan Lin , Min-Han Chuang , Chia-Chu Lai
IPC分类号： H01L23/31 , H01L21/56 , H01L23/528 , H01L23/00
CPC分类号： H01L23/3107 , H01L21/56 , H01L23/5286 , H01L24/11 , H01L24/14 , H01L24/43 , H01L24/45
摘要： An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

4. 发明授权

US09698090B2 Semiconductor substrate and fabrication method thereof 有权
公开(公告)号：US09698090B2
公开(公告)日：2017-07-04
申请号：US13753882
申请日：2013-01-30
申请人： Siliconware Precision Industries Co., Ltd.
发明人： Bo-Shiang Fang , Ho-Chuan Lin , Chia-Chu Lai , Min-Han Chuang , Li-Fang Lin
IPC分类号： H01L23/48 , H01L23/498 , H01L23/14 , H01L23/13 , H01L21/768
CPC分类号： H01L23/49827 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L2224/11 , H01L2924/0002 , H01L2924/19011 , H01L2924/00
摘要： A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

5. 发明授权

US09281557B2 Multi bandwidth balun and circuit structure thereof 有权
标题翻译：多频带平衡 - 不平衡变换器及其电路结构
公开(公告)号：US09281557B2
公开(公告)日：2016-03-08
申请号：US14090787
申请日：2013-11-26
申请人： Siliconware Precision Industries Co., Ltd
发明人： Chia-Chu Lai , Min-Han Chuang , Bo-Shiang Fang , Ho-Chuan Lin , Li-Fang Lin
IPC分类号： H01Q1/50 , H03H5/00 , H03H7/42
CPC分类号： H01Q1/50 , H03H7/425
摘要： A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.
摘要翻译：提供了一种多频带平衡 - 不平衡变压器，包括主信号端口，电连接到主信号端口的主电感器，与主电感器相互感应的第一电感器，以构成第一转换电路的第一电感器;第一电容器模块，与第一转换电路平行的两个第一信号端口电连接到第一电容器模块，电连接到第一信号端口和第一电容器模块之间的第一主电容器，与主电感器相互感应的第二电感器，以构成第二电容器第二转换电路的电感器，与第二转换电路并联连接的第二电容器模块，电连接到第二电容器模块的两个第二信号端口，以及与第二信号端口和第二电容器模块电连接的第二主电容器。

6. 发明申请

US20140204806A1 DUPLEXER, CIRCUIT STRUCTURE THEREOF AND RF TRANSCEIVER APPARATUS COMPRISING THE DUPLEXER 有权
标题翻译：双工器，其电路结构及包含双工器的射频收发器
公开(公告)号：US20140204806A1
公开(公告)日：2014-07-24
申请号：US13875550
申请日：2013-05-02
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Min-Han Chuang , Chia-Chu Lai , Bo-Shiang Fang , Ho-Chuan Lin , Yen-Yu Chen
IPC分类号： H03H7/46
CPC分类号： H03H7/463 , H03H7/09 , H03H7/1775 , H03H7/1783 , H03H2001/0064 , H03H2001/0078
摘要： A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.
摘要翻译：提供了一种双工器，其包括第一，第二和第三信号端口; 第一过滤器和第二过滤器。第一滤波器具有分别具有第一，第二和第三电感器的第一，第二和第三谐振电路。第一，第二和第三电感器是互感的。第一和第三谐振电路分别电连接到第一和第二信号端口。第二滤波器具有分别具有第四，第五和第六电感器的第四，第五和第六谐振电路。第四谐振电路与第一谐振电路串联连接。第五电感器和第四电感器是互感的。第六谐振电路与第三信号端口电连接。第二滤波器还具有分别与第五和第六谐振电路串联连接的主电容器，并位于它们之间。

7. 发明申请

US20140015621A1 BALANCED-TO-UNBALANCED CONVERTER 有权
标题翻译：平衡至不平衡转换器
公开(公告)号：US20140015621A1
公开(公告)日：2014-01-16
申请号：US13644507
申请日：2012-10-04
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Ming-Fan Tsai , Hsin-Hung Lee , Chia-Chu Lai , Yen-Yu Chen , Ho-Chuan Lin
IPC分类号： H03H5/10
CPC分类号： H03H7/42
摘要： A balanced-to-unbalanced converter (balun) is provided, including: a converting circuit having a first processing circuit including a first inductor and a first capacitor connected in series, a second processing circuit including a second capacitor and a second inductor connected in series, the second capacitor being electrically connected to the first inductor, and two balanced output ends connected to the first processing circuit and the second processing circuit, respectively; and a preprocessing circuit connected to the converting circuit and including an unbalanced input end for converting real impedance at the unbalanced input end into complex impedance at the balanced output ends. Accordingly, the balun satisfies the need of the wireless communication chips by providing differential signals with complex impedance. This is done by employing the preprocessing circuit in conjunction with the converting circuit to convert an unbalanced signal with real impedance into a balanced signal with complex impedance.
摘要翻译：提供了一种平衡 - 不平衡转换器（balun），包括：具有第一处理电路的转换电路，包括第一电感器和串联连接的第一电容器，第二处理电路包括串联连接的第二电容器和第二电感器所述第二电容器电连接到所述第一电感器，以及两个平衡输出端分别连接到所述第一处理电路和所述第二处理电路; 以及连接到转换电路并且包括用于将不平衡输入端处的实际阻抗转换成平衡输出端的复阻抗的不平衡输入端的预处理电路。因此，平衡 - 不平衡变压器通过提供具有复阻抗的差分信号来满足无线通信芯片的需要。这通过使用预处理电路与转换电路结合来实现，将具有实际阻抗的不平衡信号转换成具有复阻抗的平衡信号。

8. 发明授权

US11776897B2 Electronic module, manufacturing method thereof and electronic package having the same 有权
公开(公告)号：US11776897B2
公开(公告)日：2023-10-03
申请号：US17465137
申请日：2021-09-02
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Ho-Chuan Lin , Chia-Chu Lai , Min-Han Chuang
IPC分类号： H01L23/31 , H01L23/522 , H01L49/02
CPC分类号： H01L23/5223 , H01L23/31 , H01L23/5226 , H01L28/40
摘要： An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

9. 发明申请

US20220359374A1 ELECTRONIC MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC PACKAGE HAVING THE SAME 有权
公开(公告)号：US20220359374A1
公开(公告)日：2022-11-10
申请号：US17465137
申请日：2021-09-02
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Ho-Chuan Lin , Chia-Chu Lai , Min-Han Chuang
IPC分类号： H01L23/522 , H01L23/31 , H01L49/02
摘要： An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

10. 发明申请

US20220359324A1 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20220359324A1
公开(公告)日：2022-11-10
申请号：US17368475
申请日：2021-07-06
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Ho-Chuan Lin , Min-Han Chuang , Chia-Chu Lai
IPC分类号： H01L23/31 , H01L23/528 , H01L23/00 , H01L21/56
摘要： An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

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