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1. 发明申请

US20140124950A1 SEMICONDUCTOR SUBSTRATE AND FABRICATION METHOD THEREOF 有权
标题翻译：半导体基板及其制造方法
公开(公告)号：US20140124950A1
公开(公告)日：2014-05-08
申请号：US13753882
申请日：2013-01-30
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Bo-Shiang Fang , Ho-Chuan Lin , Chia-Chu Lai , Min-Han Chuang , Li-Fang Lin
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L23/49827 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L2224/11 , H01L2924/0002 , H01L2924/19011 , H01L2924/00
摘要： A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.
摘要翻译：公开了一种半导体衬底。半导体衬底包括：至少在其表面上形成有开口的衬底本体，其中衬底主体的表面和开口的壁由绝缘材料制成; 以及形成在所述基板主体的表面上的电路层，其中所述电路层覆盖所述开口的端部并且与所述开口电绝缘。该开口有助于增加硅材料的电路层和衬底主体之间的绝缘结构的厚度，以防止当高频信号施加到电路层时的信号劣化。

2. 发明授权

US09698090B2 Semiconductor substrate and fabrication method thereof 有权
公开(公告)号：US09698090B2
公开(公告)日：2017-07-04
申请号：US13753882
申请日：2013-01-30
申请人： Siliconware Precision Industries Co., Ltd.
发明人： Bo-Shiang Fang , Ho-Chuan Lin , Chia-Chu Lai , Min-Han Chuang , Li-Fang Lin
IPC分类号： H01L23/48 , H01L23/498 , H01L23/14 , H01L23/13 , H01L21/768
CPC分类号： H01L23/49827 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L2224/11 , H01L2924/0002 , H01L2924/19011 , H01L2924/00
摘要： A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

3. 发明授权

US09281557B2 Multi bandwidth balun and circuit structure thereof 有权
标题翻译：多频带平衡 - 不平衡变换器及其电路结构
公开(公告)号：US09281557B2
公开(公告)日：2016-03-08
申请号：US14090787
申请日：2013-11-26
申请人： Siliconware Precision Industries Co., Ltd
发明人： Chia-Chu Lai , Min-Han Chuang , Bo-Shiang Fang , Ho-Chuan Lin , Li-Fang Lin
IPC分类号： H01Q1/50 , H03H5/00 , H03H7/42
CPC分类号： H01Q1/50 , H03H7/425
摘要： A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.
摘要翻译：提供了一种多频带平衡 - 不平衡变压器，包括主信号端口，电连接到主信号端口的主电感器，与主电感器相互感应的第一电感器，以构成第一转换电路的第一电感器;第一电容器模块，与第一转换电路平行的两个第一信号端口电连接到第一电容器模块，电连接到第一信号端口和第一电容器模块之间的第一主电容器，与主电感器相互感应的第二电感器，以构成第二电容器第二转换电路的电感器，与第二转换电路并联连接的第二电容器模块，电连接到第二电容器模块的两个第二信号端口，以及与第二信号端口和第二电容器模块电连接的第二主电容器。

4. 发明申请

US20140204806A1 DUPLEXER, CIRCUIT STRUCTURE THEREOF AND RF TRANSCEIVER APPARATUS COMPRISING THE DUPLEXER 有权
标题翻译：双工器，其电路结构及包含双工器的射频收发器
公开(公告)号：US20140204806A1
公开(公告)日：2014-07-24
申请号：US13875550
申请日：2013-05-02
申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
发明人： Min-Han Chuang , Chia-Chu Lai , Bo-Shiang Fang , Ho-Chuan Lin , Yen-Yu Chen
IPC分类号： H03H7/46
CPC分类号： H03H7/463 , H03H7/09 , H03H7/1775 , H03H7/1783 , H03H2001/0064 , H03H2001/0078
摘要： A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.
摘要翻译：提供了一种双工器，其包括第一，第二和第三信号端口; 第一过滤器和第二过滤器。第一滤波器具有分别具有第一，第二和第三电感器的第一，第二和第三谐振电路。第一，第二和第三电感器是互感的。第一和第三谐振电路分别电连接到第一和第二信号端口。第二滤波器具有分别具有第四，第五和第六电感器的第四，第五和第六谐振电路。第四谐振电路与第一谐振电路串联连接。第五电感器和第四电感器是互感的。第六谐振电路与第三信号端口电连接。第二滤波器还具有分别与第五和第六谐振电路串联连接的主电容器，并位于它们之间。

5. 发明申请

US20170271251A1 FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE 审中-公开
公开(公告)号：US20170271251A1
公开(公告)日：2017-09-21
申请号：US15612390
申请日：2017-06-02
申请人： Siliconware Precision Industries Co., Ltd.
发明人： Bo-Shiang Fang , Ho-Chuan Lin , Chia-Chu Lai , Min-Han Chuang , Li-Fang Lin
IPC分类号： H01L23/498 , H01L23/14 , H01L21/768 , H01L23/13
摘要： A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

6. 发明授权

US09503043B2 Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexer 有权
标题翻译：双工器，其电路结构和包括双工器的RF收发器设备
公开(公告)号：US09503043B2
公开(公告)日：2016-11-22
申请号：US13875550
申请日：2013-05-02
申请人： Siliconware Precision Industries Co., Ltd.
发明人： Min-Han Chuang , Chia-Chu Lai , Bo-Shiang Fang , Ho-Chuan Lin , Yen-Yu Chen
IPC分类号： H03H7/46 , H03H7/09 , H03H7/01 , H03H1/00
CPC分类号： H03H7/463 , H03H7/09 , H03H7/1775 , H03H7/1783 , H03H2001/0064 , H03H2001/0078
摘要： A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.
摘要翻译：提供了一种双工器，其包括第一，第二和第三信号端口; 第一过滤器和第二过滤器。第一滤波器具有分别具有第一，第二和第三电感器的第一，第二和第三谐振电路。第一，第二和第三电感器是互感的。第一和第三谐振电路分别电连接到第一和第二信号端口。第二滤波器具有分别具有第四，第五和第六电感器的第四，第五和第六谐振电路。第四谐振电路与第一谐振电路串联连接。第五电感器和第四电感器是互感的。第六谐振电路与第三信号端口电连接。第二滤波器还具有分别与第五和第六谐振电路串联连接的主电容器，并位于它们之间。

7. 发明申请

US20140320374A1 MULTI BANDWIDTH BALUN AND CIRCUIT STRUCTURE THEREOF 有权
标题翻译：多功能BALUN及其电路结构
公开(公告)号：US20140320374A1
公开(公告)日：2014-10-30
申请号：US14090787
申请日：2013-11-26
申请人： Siliconware Precision Industries Co., Ltd
发明人： Chia-Chu Lai , Min-Han Chuang , Bo-Shiang Fang , Ho-Chuan Lin , Li-Fang Lin
IPC分类号： H03H7/42 , H01Q1/50
CPC分类号： H01Q1/50 , H03H7/425
摘要： A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.
摘要翻译：提供了一种多频带平衡 - 不平衡变压器，包括主信号端口，电连接到主信号端口的主电感器，与主电感器相互感应的第一电感器，以构成第一转换电路的第一电感器;第一电容器模块，与第一转换电路平行的两个第一信号端口电连接到第一电容器模块，电连接到第一信号端口和第一电容器模块之间的第一主电容器，与主电感器相互感应的第二电感器，以构成第二电容器第二转换电路的电感器，与第二转换电路并联连接的第二电容器模块，电连接到第二电容器模块的两个第二信号端口，以及与第二信号端口和第二电容器模块电连接的第二主电容器。

8. 发明申请

US20140184261A1 TESTING APPARATUS AND TESTING METHOD 审中-公开
标题翻译：测试装置和测试方法
公开(公告)号：US20140184261A1
公开(公告)日：2014-07-03
申请号：US14056214
申请日：2013-10-17
申请人： Siliconware Precision Industries Co., Ltd.
发明人： Chia-Chu Lai , Ming-Fan Tsai , Ho-Chuan Lin , Min-Han Chuang , Bo-Shiang Fang
IPC分类号： G01R1/04
CPC分类号： G01R1/0466
摘要： A testing method is provided, including providing a testing apparatus including a carrier member and a testing element, the carrier member comprising a first surface, a second surface opposing the first surface, and an elastic conductive area defined on the first surface; disposing an object-to-be-tested on the elastic conductive area; electrically connecting the testing element to the object-to-be-tested and the carrier member, to form an electric loop among the carrier member, the object-to-be-tested and the testing element. Through the design of the elastic conductive area, the object-to-be-tested can be secured with a small pressure applied thereto, and is prevented from being cracked.
摘要翻译：提供了一种测试方法，包括提供包括载体构件和测试元件的测试装置，所述载体构件包括第一表面，与第一表面相对的第二表面和限定在第一表面上的弹性导电区域; 在弹性导电区域上设置待测物体; 将测试元件电连接到待测对象和载体构件，以在载体构件，待测对象和测试元件之间形成电循环。通过弹性导电区域的设计，可以用施加在其上的小的压力来确保待测对象，并且防止被破坏。

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