专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110083830A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20110083830A1
公开(公告)日：2011-04-14
申请号：US12643931
申请日：2009-12-21
申请人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： H01L23/427 , F28D15/04 , H01L23/467
CPC分类号： H01L23/427 , F28D15/0233 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
摘要翻译：示例性散热装置包括基座，安装在基座上并经由两个第一热管连接到基座的第一散热器，以及位于第一散热器的侧面处的第二散热器，并且热连接到基座通孔第二个热管。第一个散热片包括两个散热片组。其中一个翅片组堆叠在另一个翅片组上。每个翅片组包括从翅片组的中心沿着水平方向沿翅片组的周边径向扩散的多个翅片。

2. 发明申请

US20100309626A1 ELECTRONIC SYSTEM WITH HEAT DISSIPATION STRUCTURE 有权
标题翻译：具有散热结构的电子系统
公开(公告)号：US20100309626A1
公开(公告)日：2010-12-09
申请号：US12614452
申请日：2009-11-09
申请人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/181 , G06F1/20
摘要： An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.
摘要翻译：诸如计算机系统的电子系统包括限定其侧面的开口的壳体，布置在壳体中的母板，位于母板侧的硬盘和覆盖壳体的开口的散热结构。主板包括面向壳体的开口的印刷电路板，安装在印刷电路板上并朝向开口的第一电子部件和第二电子部件。散热结构包括与壳体接合的基部和从基部延伸到壳体外部的翅片。底座包括接触第一和第二电子部件的第一接合部分和接触硬盘的第二接合部分。第一接合部分和第二接合部分彼此处于不同的高度。

3. 发明申请

US20100163213A1 ACTIVE HEAT SINK FOR USE WITH ELECTRONIC DEVICE 失效
标题翻译：与电子设备一起使用的主动散热器
公开(公告)号：US20100163213A1
公开(公告)日：2010-07-01
申请号：US12496653
申请日：2009-07-02
申请人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0208 , F28D15/0275 , F28F1/34 , F28F13/125 , F28F2215/00 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
摘要翻译：散热器包括导热基座，热连接并相对于基座旋转的导热轴和多个翅片。轴包括热连接到基座的热吸收部分和与吸热部分连接的散热部分。翅片设置在轴的散热部分上。

4. 发明申请

US20100147502A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 审中-公开
标题翻译：热管散热装置
公开(公告)号：US20100147502A1
公开(公告)日：2010-06-17
申请号：US12432745
申请日：2009-04-29
申请人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F1/10
CPC分类号： F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F13/08 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section.
摘要翻译：散热装置包括热管。热管包括与散热器连接的蒸发部分，与翅片组件连接的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。热管的蒸发部分的直径小于冷凝部分的直径。

5. 发明申请

US20100101757A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100101757A1
公开(公告)日：2010-04-29
申请号：US12396484
申请日：2009-03-03
申请人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting.
摘要翻译：从电子设备去除热量的散热装置包括基板，与基板热连接的散热片，固定部件和两个风扇。固定构件包括联接到翅片组的顶部的驱动部分，位于翅片组的圆周的两个相对侧的两个安装部分和从驱动部分向外延伸并与两个安装部分连接的两个连接臂。分别安装在固定构件的两个安装部分上并且位于翅片组的圆周的两个相对位置处的两个风扇被驱动以由驱动部分围绕翅片组的周边旋转，并产生两股气流其流过不相交的翅片组。

6. 发明申请

US20090211730A1 HEAT DISSIPATION DEVICE HAVING A BRACKET 审中-公开
标题翻译：具有支架的散热装置
公开(公告)号：US20090211730A1
公开(公告)日：2009-08-27
申请号：US12143846
申请日：2008-06-23
申请人： SHI-WEN ZHOU , SHOU-BIAO XU , CHUN-CHI CHEN
发明人： SHI-WEN ZHOU , SHOU-BIAO XU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink, a second heat sink far away from the first heat sink, a heat pipe transferring heat from the first heat sink to the second heat sink and a bracket for reinforcing the heat dissipation device. The bracket includes a first end attached to the first heat sink and a second end attached to the second heat sink. The second end defines a through hole receiving the heat pipe therethrough. The second end has a supporting portion and a clasping portion from an edge of the through hole. The supporting portion and the clasping portion are spaced from each other and firmly clasp the heat pipe. The clasping portion is bent to abut against the heat pipe and urge the heat pipe toward the supporting portion.
摘要翻译：散热装置包括第一散热器，远离第一散热器的第二散热器，将热量从第一散热器传递到第二散热器的热管和用于加强散热装置的支架。支架包括附接到第一散热器的第一端和附接到第二散热器的第二端。第二端限定通过其中的热管。第二端具有从通孔的边缘的支撑部分和夹紧部分。支撑部分和夹紧部分彼此间隔开并牢固地夹住热管。夹紧部分被弯曲以抵靠热管并将热管推向支撑部分。

7. 发明申请

US20100238630A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20100238630A1
公开(公告)日：2010-09-23
申请号：US12508582
申请日：2009-07-24
申请人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU
发明人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU
IPC分类号： H05K7/20 , F28D15/04 , F28F7/00
CPC分类号： F28D15/0233 , F28D15/0275 , F28F2215/10 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.
摘要翻译：散热装置包括散热器和固定在散热器上的一对热管。散热器包括矩形柱，分别从柱的四个角向外延伸的四个分支和在分支之间延伸的多个翅片。每个热管包括附接到柱的底部的蒸发部分，与蒸发部分平行并连接到柱的顶部的冷凝部分和将蒸发部分和冷凝部分互连的绝热部分。块被固定到热管的冷凝部分的底部。

8. 发明申请

US20100243229A1 HEAT SINK AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20100243229A1
公开(公告)日：2010-09-30
申请号：US12506213
申请日：2009-07-20
申请人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

9. 发明申请

US20090260779A1 HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE 审中-公开
标题翻译：具有改进的熔体结构的散热装置
公开(公告)号：US20090260779A1
公开(公告)日：2009-10-22
申请号：US12107004
申请日：2008-04-21
申请人： SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/02
CPC分类号： H01L23/427 , F28D15/0275 , F28F1/32 , F28F2215/10 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic element, includes a base plate for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together, and at least a heat pipe having an evaporating section thermally engaging with the base plate and a pair of condensing sections extending through the fins. Each of the fins has a plurality of parallel and protruding flanges on a top face thereof. The protruding flanges of the fins are of equal height and parallel to short sides of the fins. Each protruding flange has a length equal to that of the short sides of the fins. A distance between two neighboring ones of the protruding flanges located between the condensing sections is the same. The protruding flanges are provided for increasing a heat dissipation area of the fin.
摘要翻译：一种用于从电子元件散热的散热装置，包括用于从发热部件吸收热量的基板，位于基板上方并具有堆叠在一起的多个翅片的翅片单元，以及至少具有与基板热接合的蒸发部分和延伸穿过翅片的一对冷凝部分。每个翅片在其顶面上具有多个平行和突出的凸缘。翅片的突出凸缘具有相同的高度并且平行于翅片的短边。每个突出的凸缘的长度等于翅片短边的长度。位于冷凝段之间的两个相邻突出凸缘之间的距离相同。突出的凸缘被设置用于增加翅片的散热面积。

10. 发明申请

US20080000619A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20080000619A1
公开(公告)日：2008-01-03
申请号：US11623288
申请日：2007-01-15
申请人： SHI-WEN ZHOU , CHUN-CHI CHEN , MENG FU
发明人： SHI-WEN ZHOU , CHUN-CHI CHEN , MENG FU
IPC分类号： F28F1/30
CPC分类号： F28F1/32 , F28D15/0275 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin assembly including a plurality of fins and a heat conductive member. Each individual fin includes a main body with one through hole and a sleeve installed in the through hole of the main body. The sleeve has a hole defined therethrough. The heat conductive member has higher heat conductivity than the main bodies of the fins, and is installed into the through hole of the each individual fin via extension through the hole of the sleeve. The main body and the sleeve of the each individual fin are made of different materials so that the sleeve serves as a transition component for facilitating soldering the each individual fin on the heat conductive member and heat conduction from the heat conductive member to the main body of the each individual fin.
摘要翻译：散热装置包括：翅片组件，其包括多个翅片和导热构件。每个单独的翅片包括具有一个通孔的主体和安装在主体的通孔中的套筒。套筒具有穿过其中的孔。导热构件具有比翅片的主体更高的导热性，并且通过套筒的孔经由延伸部安装到每个单独翅片的通孔中。每个单独翅片的主体和套筒均由不同的材料制成，使得套筒用作便于将导热构件上的每个单独的翅片焊接并从导热构件到主体的热传导的过渡部件每个个体鳍。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式