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1. 发明申请

US20110083830A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20110083830A1
公开(公告)日：2011-04-14
申请号：US12643931
申请日：2009-12-21
申请人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： H01L23/427 , F28D15/04 , H01L23/467
CPC分类号： H01L23/427 , F28D15/0233 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
摘要翻译：示例性散热装置包括基座，安装在基座上并经由两个第一热管连接到基座的第一散热器，以及位于第一散热器的侧面处的第二散热器，并且热连接到基座通孔第二个热管。第一个散热片包括两个散热片组。其中一个翅片组堆叠在另一个翅片组上。每个翅片组包括从翅片组的中心沿着水平方向沿翅片组的周边径向扩散的多个翅片。

2. 发明申请

US20100238630A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20100238630A1
公开(公告)日：2010-09-23
申请号：US12508582
申请日：2009-07-24
申请人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU
发明人： SHOU-BIAO XU , GUO CHEN , SHI-WEN ZHOU
IPC分类号： H05K7/20 , F28D15/04 , F28F7/00
CPC分类号： F28D15/0233 , F28D15/0275 , F28F2215/10 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.
摘要翻译：散热装置包括散热器和固定在散热器上的一对热管。散热器包括矩形柱，分别从柱的四个角向外延伸的四个分支和在分支之间延伸的多个翅片。每个热管包括附接到柱的底部的蒸发部分，与蒸发部分平行并连接到柱的顶部的冷凝部分和将蒸发部分和冷凝部分互连的绝热部分。块被固定到热管的冷凝部分的底部。

3. 发明申请

US20100243229A1 HEAT SINK AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20100243229A1
公开(公告)日：2010-09-30
申请号：US12506213
申请日：2009-07-20
申请人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

4. 发明申请

US20110063802A1 ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US20110063802A1
公开(公告)日：2011-03-17
申请号：US12610388
申请日：2009-11-02
申请人： GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

5. 发明申请

US20100258287A1 HEAT SINK AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20100258287A1
公开(公告)日：2010-10-14
申请号：US12537267
申请日：2009-08-07
申请人： GUO CHEN , PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： GUO CHEN , PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： H01L21/4882 , H01L23/3672 , H01L23/3677 , H01L2924/0002 , Y10T29/4935 , Y10T29/49368 , H01L2924/00
摘要： A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover.
摘要翻译：散热器包括基座，盖和多个柱状翅片。底座从其顶面突出多个螺柱。该盖在其中限定多个凹口和孔。柱状翅片各自具有容纳在基部的相应凹部中的头部和从头部延伸穿过盖子的本体。基座上的基座与基座的螺栓铆接在盖子的孔中。基座与盖配合以将翅片的头部夹在其间，从而将柱状翅片固定到盖上。

6. 发明申请

US20110048681A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20110048681A1
公开(公告)日：2011-03-03
申请号：US12620500
申请日：2009-11-17
申请人： GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28D15/04 , F28F7/00
CPC分类号： H01L23/427 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
摘要翻译：示例性散热装置包括连接板，第一散热器，第二散热器和第二平坦化热管。第一散热器包括安装在连接板的底部上的基板和插入连接板中并接触基板的多个圆柱形销。第二散热器包括散热器和从散热器一体延伸的多个矩形固体翅片。散热器接合连接板。热管将第一散热器的基板和第二散热器的第二散热器热连接。

7. 发明申请

US20100296251A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20100296251A1
公开(公告)日：2010-11-25
申请号：US12565712
申请日：2009-09-23
申请人： CHUN-CHI CHEN , SHI-WEN ZHOU , GUO CHEN
发明人： CHUN-CHI CHEN , SHI-WEN ZHOU , GUO CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
摘要翻译：散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

8. 发明申请

US20110094711A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 失效
标题翻译：热管散热装置
公开(公告)号：US20110094711A1
公开(公告)日：2011-04-28
申请号：US12688794
申请日：2010-01-15
申请人： GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
摘要翻译：散发由安装在印刷电路板上的电子元件产生的热的示例性散热装置包括支撑件，导热基座，第一翅片组件和热管。导热基座牢固地附接到支撑件的底侧并与电子元件热接触。第一翅片组件牢固地附接到支撑件的顶侧。热管包括夹在支撑件和导热基座之间的蒸发器，以及延伸穿过支撑件并在第一翅片组件中延伸的冷凝器。

9. 发明申请

US20080142194A1 HEAT DISSIPATION DEVICE WITH A HEAT PIPE 失效
标题翻译：带散热管的散热装置
公开(公告)号：US20080142194A1
公开(公告)日：2008-06-19
申请号：US11752902
申请日：2007-05-23
申请人： SHI-WEN ZHOU , GUO CHEN , PENG LIU , CHUN-CHI CHEN
发明人： SHI-WEN ZHOU , GUO CHEN , PENG LIU , CHUN-CHI CHEN
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： F28D15/0233 , F28D1/0472 , F28F1/20 , H01L23/367 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a radiator comprising a collar, a core received in the collar and a helical heat pipe embedded in a circumferential face of the core. The collar has a receiving hole and a plurality of fins extending radially and outwardly from an outer face of the collar. The core together with the heat pipe is received in the receiving hole of the radiator. The core has a flat bottom face and a top face opposite to the bottom face. The heat pipe is located between the radiator and the core and thermally contacts the collar of the radiator and the core. The heat pipe extends from the bottom face of the core to the top face of the core, and has a flattened bottom face coplanar with the bottom face of the core for contacting with an electronic device.
摘要翻译：散热装置包括散热器，其包括套环，容纳在轴环中的芯和嵌入在芯的圆周面中的螺旋形热管。套环具有接收孔和从轴环的外表面径向向外延伸的多个翅片。核心与热管一起被接收在散热器的接收孔中。芯具有平坦的底面和与底面相对的顶面。热管位于散热器和芯之间，并与散热器和芯体的轴颈热接触。热管从芯的底面延伸到芯的顶面，并且具有与芯的底面共面的扁平底面，用于与电子装置接触。

10. 发明申请

US20080083528A1 HEAT DISSIPATION DEVICE HAVING MOUNTING BRACKETS 失效
标题翻译：具有安装支架的散热装置
公开(公告)号：US20080083528A1
公开(公告)日：2008-04-10
申请号：US11309841
申请日：2006-10-10
申请人： CHUN-CHI CHEN , SHI-WEN ZHOU , GUO CHEN , LI HE , PENG LIU
发明人： CHUN-CHI CHEN , SHI-WEN ZHOU , GUO CHEN , LI HE , PENG LIU
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
摘要翻译：散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。挡板终止于保持板（28）。多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

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